IEC 60068-2-58:1999

Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

General Information

• Status: Published
• Publication Date: 14-Jan-1999
• ICS: 19.040 - Environmental testing
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: TC 91 - Electronics assembly technology
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 15-Jul-2004

Relations

• Revised: IEC 60068-2-58:2004 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• Effective Date: 05-Sep-2023

Standards Content (Sample)

INTERNATIONAL
IEC
STANDARD
60068-2-58
Second edition
1999-01
Environmental testing –
Part 2-58:
Tests – Test Td – Test methods for solderability,
resistance to dissolution of metallization
and to soldering heat of surface mounting
devices (SMD)
Essais d’environnement –
Partie 2-58:
Essais – Essai Td – Méthodes d’essai de la soudabilité,
de la résistance de la métallisation à la dissolution
et de la résistance à la chaleur de soudage
des composants pour montage en surface

Reference number
Numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series.
Consolidated publications
Consolidated versions of some IEC publications including amendments are

available. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the
base publication, the base publication incorporating amendment 1 and the base

publication incorporating amendments 1 and 2.

Validity of this publication
The technical content of IEC publications is kept under constant review by the IEC,
thus ensuring that the content reflects current technology.
Information relating to the date of the reconfirmation of the publication is available
in the IEC catalogue.
Information on the subjects under consideration and work in progress undertaken by
the technical committee which has prepared this publication, as well as the list of
publications issued, is to be found at the following IEC sources:
• IEC web site*
• Catalogue of IEC publications
Published yearly with regular updates
(On-line catalogue)*
• IEC Bulletin
Available both at the IEC web site* and as a printed periodical
Terminology, graphical and letter symbols
For general terminology, readers are referred to IEC 60050: International Electro-
technical Vocabulary (IEV).
For graphical symbols, and letter symbols and signs approved by the IEC for
general use, readers are referred to publications IEC 60027: Letter symbols to be
used in electrical technology, IEC 60417: Graphical symbols for use on equipment.
Index, survey and compilation of the single sheets and IEC 60617: Graphical symbols
for diagrams.
* See web site address on title page.

INTERNATIONAL
IEC
STANDARD
60068-2-58
Second edition
1999-01
Environmental testing –
Part 2-58:
Tests – Test Td – Test methods for solderability,
resistance to dissolution of metallization
and to soldering heat of surface mounting
devices (SMD)
Essais d’environnement –
Partie 2-58:
Essais – Essai Td – Méthodes d’essai de la soudabilité,
de la résistance de la métallisation à la dissolution
et de la résistance à la chaleur de soudage
des composants pour montage en surface

 IEC 1999  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission 3, rue de Varembé Geneva, Switzerland
Telefax: [phone] e-mail: [e-mail] IEC web site http://www.iec.ch
Commission Electrotechnique Internationale
PRICE CODE
Q
International Electrotechnical Commission
For price, see current catalogue

– 2 – IEC 60068-2-58 © IEC:1999(E)

CONTENTS
Page
FOREWORD . 4

Clause
1 Scope. 5

2 Normative references. 5
3 Terms and definitions. 5
4 Preconditioning. 6
5 Solder bath method . 6
5.1 Test apparatus and materials for the solder bath method. 6
5.1.1 Solder bath. 6
5.1.2 Flux. 6
5.1.3 Solder. 6
6 Procedure. 6
6.1 Number of specimens . 6
6.2 Clamping. 6
6.3 Fluxing. 6
6.4 Solder immersion. 6
6.4.1 Severities. 7
6.4.2 Attitude. 8
7 Solder reflow methods. 8
7.1 Test apparatus and materials . 8
7.1.1 Solder paste. 8
7.1.2 Test substrates . 8
7.1.2.1 Test substrates for infrared, forced gas or vapour phase
solder reflow. 8
7.1.2.2 Test substrate for hot plate solder reflow. 8
8 Test procedure. 9
8.1 Number of specimens . 9
8.2 Application of solder paste . 9

8.3 Placement of specimens . 9
8.4 Preheating. 9
8.5 Solder reflow. 9
8.5.1 Reflow procedure for wetting . 9
8.5.1.1 Reflow method 1: infrared, forced gas or vapour phase . 9
8.5.1.2 Reflow method 2: hot plate soldering. 9
8.5.2 Reflow procedure for resistance to soldering heat. 10
8.5.2.1 Reflow method 1: vapour phase soldering system . 10
8.5.2.2 Reflow method 2: infrared and forced gas convection soldering
systems . 10
8.5.2.3 Reflow method 3: hot plate soldering. 11

IEC 60068-2-58 © IEC:1999(E) – 3 –

Clause Page
9 Flux removal. 11

9.1 Recovery. 11

9.2 Evaluation. 11

9.2.1 Wetting. 11

9.2.1.1 Terminations with metallized solder pads . 11

9.2.1.2 Metallic terminations shorter than 6 mm

(dimension d in figure 2) . 12

9.2.2 Dewetting. 12

9.2.3 Resistance to soldering heat. 12
9.2.4 Resistance to dissolution of metallization. 13
10 Information to be given in the relevant specification . 13
Annex A (normative)  Criteria for visual examination. 14
Annex B (invormative) Guidance. 16

– 4 – IEC 60068-2-58 © IEC:1999(E)

INTERNATIONAL ELECTROTECHNICAL COMMISSION

__________
ENVIRONMENTAL TESTING –
Part 2-58: Tests – Test Td – Test methods for solderability, resistance

to dissolution of metallization and to soldering heat

of surface mounting devices (SMD)

FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization
for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical reports or guides and they are accepted by the National Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60068-2-58 has been prepared by IEC technical committee 50:
Environmental testing, and is published by IEC technical committee 91: Surface mounting
technology.
This second edition cancels and replaces the first edition, published in 1989, and constitutes a
technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
91/157/FDIS 91/164/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
Annex A forms an integral part of this standard.
Annex B is for information only.

IEC 60068-2-58 © IEC:1999(E) – 5 –

ENVIRONMENTAL TESTING –
Part 2-58: Tests – Test Td – Test methods for solderability, resistance

to dissolution of metallization and to soldering heat

of surface mounting devices (SMD)

1 Scope
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD).

Soldering tests applicable to SMD in IEC 60068-2-69 and to other electrotechnical products are
in IEC 60068-2-20 and IEC 60068-2-54, for which guidance is given in IEC 60068-2-44.
This standard provides standard procedures for determining the solderabillty, resistance to
dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD)
(hereinafter referred to as specimens).
The procedures use either a solder bath or reflow method and are applicable only to specimens
or products designed to withstand short term immersion in molten solder or limited exposure to
reflow systems.
2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of this part of IEC 60068. At the time of publication, the editions indicated
were valid. All normative documents are subject to revision, and parties to agreements based
on this part of IEC 60068 are encouraged to investigate the possibility of applying the most
recent editions of the normative documents indicated below. Members of IEC and ISO maintain
registers of currently valid International Standards.
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60068-2-20:1979, Environmental testing – Part 2: Tests – Test T: Soldering
IEC 60068-2-44:1995, Environmental testing – Part 2: Tests – Guidance on test T: Soldering
IEC 60068-2-54:1985, Environmental testing – Part 2: Tests – Test Ta: Soldering – Solder-
ability testing by the wetting balance method
IEC 60068-2-69:1995, Environmental testing – Part 2: Tests – Test Te: Solderability testing of
electronic components for surface mount technology by the wetting balance method

IEC 60249-2-4:1987, Base materials for printed circuits – Part 2: Specifications – Specification
No. 4: Epoxide woven, glass fabric, copper-clad laminated sheet, general purpose grade
IEC 60749:1996, Semiconductor devices – Mechanical and climatic test methods
3 Terms and definitions
For the purpose of this part of IEC 60068, the terms and definitions as defined in IEC 60068-1
and IEC 60068-2-20 apply.
– 6 – IEC 60068-2-58 © IEC:1999(E)

4 Preconditioning
4.1 The specimen shall be tested in the "as-received" condition unless otherwise specified by

the relevant specifica
...