IEC 60749-29:2011

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

IEC 60749-29:2011 covers the I-test and the overvoltage latch-up testing of integrated circuits. The purpose of this test is toestablish a method for determining integrated circuit (IC) latch-up characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing "no trouble found" (NTF) and "electrical overstress" (EOS) failures due to latch-up. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect to the previous edition include:
- a number of minor technical changes;
- the addition of two new annexes covering the testing of special pins and temperature calculations.

Dispositifs à semiconducteurs - Méthodes d'essai mécaniques et climatiques - Partie 29: Essai de verrouillage

La CEI 60749-29:2011 couvre l'essai I et l'essai de verrouillage de surtension des circuits intégrés. L'objet de cet essai est d'établir une méthode pour déterminer les caractéristiques de verrouillage des circuits intégrés (CI) et pour définir les critères de défaillance de verrouillage. Les caractéristiques de verrouillage sont utilisées pour la détermination de la fiabilité de produit et la minimisation des défaillances en rapport avec "l'absence d'observation de problèmes" (NTF, No Trouble Found) et la "contrainte électrique excessive" (EOS, Electrical Overstress) dues au verrouillage. Cette deuxième édition annule et remplace la première édition publiée en 2003 et constitue une révision technique. Les modifications importantes apportées par rapport à l'édition antérieure concernent:
- un certain nombre de modifications techniques mineures;
- l'addition de deux nouvelles annexes traitant de l'essai des broches spéciales et des calculs de température.

General Information

• Status: Published
• Publication Date: 06-Apr-2011
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 30-Apr-2011
• Completion Date: 07-Apr-2011

Relations

• Revises: IEC 60749-29:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60749-29 ®
Edition 2.0 2011-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 29: Latch-up test
Dispositifs à semiconducteurs – Méthodes d'essai mécaniques et climatiques –
Partie 29: Essai de verrouillage

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IEC 60749-29 ®
Edition 2.0 2011-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 29: Latch-up test
Dispositifs à semiconducteurs – Méthodes d'essai mécaniques et climatiques –
Partie 29: Essai de verrouillage

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX T
ICS 31.080.01 ISBN 978-2-88912-434-3

– 2 – 60749-29  IEC:2011
CONTENTS
FOREWORD . 3
1 Scope and object . 5
2 Terms and definitions . 5
3 Classification and levels . 8
3.1 Classification . 8
3.2 Levels . 8
4 Apparatus and material . 8
4.1 Latch-up tester . 8
4.1.1 General . 8
4.1.2 V and their qualification method. 9
supply
4.1.3 Trigger source qualification method . 9
4.2 Automated test equipment (ATE) . 10
4.3 Heat source . 10
5 Procedure . 10
5.1 General latch-up test procedure . 10
5.2 Detailed latch-up test procedure . 13
5.2.1 I-test . 13
5.2.2 V overvoltage test . 17
supply
5.2.3 Testing dynamic devices . 19
5.2.4 DUT disposition . 19
5.2.5 Record keeping . 19
6 Failure criteria . 20
7 Summary . 20
Annex A (informative) Examples of special pins that are connected to passive
components . 21
Annex B (informative) Calculation of operating ambient or operating case temperature
for a given operating junction temperature . 23

qualification circuit . 9
Figure 1 – V
supply
Figure 2 – Trigger source qualification circuit . 10
Figure 3 – Latch-up test flow . 11
Figure 4 – Test waveform for positive I-test . 14
Figure 5 – Test waveform for negative I-test . 15
Figure 6 – Equivalent circuit for positive input/output I-test latch-up testing . 16
Figure 7 – Equivalent circuit for negative input/output I-test latch-up testing . 17
Figure 8 – Test waveform for V overvoltage . 18
supply
Figure 9 – Equivalent circuit for V overvoltage test latch-up testing . 19
supply
Figure A.1 – Examples of special pins that are connected to passive components . 22

a
Table 1 – Test matrix . 12
Table 2 – Timing specifications for I-test and V overvoltage test . 13
supply
60749-29  IEC:2011 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 29: Latch-up test
FOREWORD
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International Standard IEC 60749-29 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2003 and constitutes a
technical revision. The significant changes with respect to the previous edition include:
– a number of minor technical changes;
– the addition of two new annexes covering the testing of special pins and temperature
calculations.
– 4 – 60749-29  IEC:2011
The text of this standard is based on the following documents:
FDIS Report on voting
47/2083/FDIS 47/2090/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publicat
...