IEC 62604-1:2022

Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification

IEC 62604-1:2022 specifies the methods of test and general requirements for SAW and BAW duplexers of assessed quality using either capability approval or qualification approval procedures. This edition includes the following significant technical changes with respect to the previous edition:
- the term "multiplexer" has been added to Clause 3.
NOTE In this document, SAW and BAW duplexers are treated simultaneously because both duplexers are used in the same manner especially in mobile phones and have the same requirements of characteristics, test method and so on.

Duplexeurs à ondes acoustiques de surface (OAS) et à ondes acoustiques de volume (OAV) sous assurance de la qualité - Partie 1: Spécification générique

L’IEC 62604-1:2022 spécifie les méthodes d’essai et les exigences générales pour les duplexeurs à OAS et à OAV dont la qualité est assurée par les procédures d’agrément de savoir-faire ou par les procédures d’homologation. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
- ajout du terme "multiplexeur" à l’Article 3.
NOTE Dans le présent document, les duplexeurs à OAS et à OAV sont traités simultanément, car ces deux duplexeurs sont utilisés de la même manière, en particulier dans les téléphones mobiles; ils ont en outre les mêmes exigences de caractéristiques, de méthode d’essai, etc.

General Information

• Status: Published
• Publication Date: 10-Jul-2022
• ICS: 31.140 - Piezoelectric devices
• Technical Committee: TC 49 - Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection
• Drafting Committee: WG 10 - TC 49/WG 10
• Current Stage: PPUB - Publication issued
• Start Date: 11-Jul-2022
• Completion Date: 11-Aug-2022

Relations

• Revises: IEC 62604-1:2015 - Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification
• Effective Date: 05-Sep-2023

Overview

IEC 62604-1:2022 is the International Electrotechnical Commission (IEC) generic specification for surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality. It specifies the methods of test and general requirements for SAW/BAW duplexers using either capability approval or qualification approval procedures. This edition updates terminology (the term “multiplexer” was added) and treats SAW and BAW duplexers together because they share the same use cases and test requirements, especially in mobile phones and other RF applications.

Key Topics

• Scope and terminology: Definitions, units and graphical symbols for SAW, BAW, duplexers and multiplexers.
• Quality assessment procedures: Requirements for manufacturer approval, capability approval and qualification approval, including eligibility, application and granting processes.
• Test and measurement methods:
  • Electrical tests: S‑parameters measurement, intermodulation distortion, insulation resistance, voltage proof.
  • Visual and dimensional inspection: Visual tests (A/B) and mechanical dimension checks.
  • Mechanical and environmental tests: Sealing, solderability, thermal shock, vibration, shock, free-fall, acceleration, low air pressure, damp heat, salt mist, flammability and ESD sensitivity.
  • Endurance and screening: Procedures for life tests, screening, rework/repair and certified records of released lots.
• Preferred ratings and characteristics: Nominal frequency bands, operating temperature ranges, climatic categories and severity levels for bump/vibration/shock.
• Marking and documentation: Duplexer and package marking requirements and capability manuals.

Applications

• Component qualification and supplier approval: Use IEC 62604-1 to qualify SAW/BAW duplexers during procurement and supplier audits.
• Design verification and production testing: Reference for RF component test plans (S‑parameters, intermodulation) and environmental robustness verification.
• Mobile and wireless equipment: Ensures duplexers meet performance and reliability expectations in mobile phones, wireless infrastructure and IoT devices.
• Certification and quality management: Supports independent conformity assessment and traceable records for released lots.

Who Should Use This Standard

• RF component manufacturers (SAW/BAW duplexers and multiplexers)
• Test laboratories and QA teams performing capability/qualification approvals
• Procurement and supply‑chain engineers specifying RF filters for mobile devices
• Certification bodies and reliability engineers evaluating environmental and electrical robustness

Related standards

Refer to the normative references listed in IEC 62604-1 for related IEC publications and other standards relevant to frequency control, RF testing and environmental testing. For implementation, consult the full IEC 62604-1:2022 document for detailed test conditions, procedures and acceptance criteria.

Keywords: IEC 62604-1:2022, SAW duplexer, BAW duplexer, multiplexer, duplexer testing, S-parameters, intermodulation, qualification approval, capability approval, RF filter standards.

Standards Content (Sample)

IEC 62604-1 ®
Edition 2.0 2022-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of
assessed quality –
Part 1: Generic specification
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IEC 62604-1 ®
Edition 2.0 2022-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of
assessed quality –
Part 1: Generic specification
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.140 ISBN 978-2-8322-3982-7

– 2 – IEC 62604-1:2022 RLV © IEC 2022
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, units and graphical symbols . 9
3.1 Terms and definitions . 9
3.1.1 General terms . 9
3.1.2 Response characteristics related terms . 11
3.1.3 SAW and BAW duplexers related terms . 15
3.2 Units and graphical symbols . 17
4 Order of precedence of documents . 18
5 Preferred values for ratings and characteristics . 18
5.1 General . 18
5.2 Nominal frequency bands . 18
5.3 Operating temperature ranges, in degrees Celsius (°C) . 18
5.4 Climatic category . 19
5.5 Bump severity . 19
5.6 Vibration severity . 19
5.7 Shock severity . 20
5.8 Fine leak rate . 20
6 Marking . 20
6.1 Duplexer marking . 20
6.2 Package marking . 20
7 Quality assessment procedures . 20
7.1 General . 20
7.2 Primary stage of manufacture . 21
7.3 Structurally similar components . 21
7.4 Subcontracting . 21
7.5 Incorporated components . 21
7.6 Manufacturer’s approval . 21
7.7 Approval procedures . 21
7.7.1 General . 21
7.7.2 Capability approval . 21
7.7.3 Qualification approval . 22
7.8 Procedures for capability approval . 22
7.8.1 General . 22
7.8.2 Eligibility for capability approval . 22
7.8.3 Application for capability approval . 22
7.8.4 Granting of capability approval . 22
7.8.5 Capability manual . 22
7.9 Procedures for qualification approval . 22
7.9.1 General . 22
7.9.2 Eligibility for qualification approval . 22
7.9.3 Application for qualification approval . 22
7.9.4 Granting of qualification approval . 23
7.9.5 Quality conformance inspection . 23
7.10 Test procedures . 23

7.11 Screening requirements . 23
7.12 Rework and repair work . 23
7.12.1 Rework . 23
7.12.2 Repair work . 23
7.13 Certified records of released lots . 23
7.14 Validity of release . 23
7.15 Release for delivery . 23
7.16 Unchecked parameters . 23
8 Test and measurement procedures . 24
8.1 General . 24
8.2 Test and measurement conditions . 24
8.2.1 Standard conditions for testing . 24
8.2.2 Precision of measurement . 24
8.2.3 Precautions . 24
8.2.4 Alternative test methods . 24
8.3 Visual inspection . 25
8.3.1 General . 25
8.3.2 Visual test A . 25
8.3.3 Visual test B . 25
8.4 Dimensions test . 25
8.5 Electrical test procedures . 25
8.5.1 S-parameters measurement . 25
8.5.2 Intermodulation distortion measurement . 27
8.5.3 Insulation resistance . 27
8.5.4 Voltage proof . 27
8.6 Mechanical and environmental test procedures . 27
8.6.1 Sealing tests (non-destructive) . 27
8.6.2 Soldering (solderability and resistance to soldering heat) (destructive) . 28
8.6.3 Rapid change of temperature: severe shock by liquid immersion (non-
destructive). 28
8.6.4 Rapid change of temperature with prescribed time of transition (non-
destructive). 28
8.6.5 Bump (destructive) . 28
8.6.6 Vibration (destructive). 29
8.6.7 Shock (destructive) . 29
8.6.8 Free fall (destructive) . 29
8.6.9 Acceleration, steady state (non-destructive) . 30
8.6.10 Low air pressure (non-destructive) . 30
8.6.11 Dry heat (non-destructive) . 30
8.6.12 Damp heat, cyclic (destructive) . 30
8.6.13 Cold (non-destructive) . 30
8.6.14 Climatic sequence (destructive) . 30
8.6.15 Damp heat, steady state (destructive) . 31
8.6.16 Salt mist cyclic (destructive) . 31
8.6.17 Immersion in cleaning solvents (non-destructive) . 31
8.6.18 Flammability test (destructive) . 31
8.6.19 Electrostatic discharge (ESD) sensitivity test (destructive) . 31
8.7 Endurance test procedure . 32
Bibliography . 33

– 4 – IEC 62604-1:2022 RLV © IEC 2022
Figure 1 – FBAR configuration . 10
Figure 2 – SMR configuration . 11
Figure 3 – Frequency response of SAW and BAW duplexers . 17
Figure 4 – S-parameters measurement . 26

Table 1 – Frequency allocation of typical UMTS bands . 18

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE ACOUSTIC WAVE (SAW) AND
BULK ACOUSTIC WAVE (BAW) DUPLEXERS
OF ASSESSED QUALITY –
Part 1: Generic specification
FOREWORD
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This redline version of the official IEC Standard allows the user to identify the changes made to
the previous edition IEC 62604-1:2015. A vertical bar appears in the margin wherever a change
has been made. Additions are in green text, deletions are in strikethrough red text.

– 6 – IEC 62604-1:2022 RLV © IEC 2022
IEC 62604-1 has been prepared by IEC technical committee 49: Piezoelectric, dielectric and
electrostatic devices and associated materials for frequency control, selection and detection. It
is an International Standard.
This second edition cancels and replaces the first edition published in 2015. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
• the term "multiplexer" has been added to Clause 3.
NOTE In this document, SAW and BAW duplexers are treated simultaneously because both duplexers are used in
the same manner especially in mobile phones and have the same requirements of characteristics, test method and
so on.
The text of this International Standard is based on the following documents:
Draft Report on voting
49/1360/CDV 49/1375/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62604 series, published under the general title Surface acoustic
wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality, can be found on the
IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

SURFACE ACOUSTIC WAVE (SAW) AND
BULK ACOUSTIC WAVE (BAW) DUPLEXERS
OF ASSESSED QUALITY –
Part 1: Generic specification
1 Scope
This part of IEC 62604 specifies the methods of test and general requirements for SAW and
BAW duplexers of assessed quality using either capability approval or qualification approval
procedures.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology
IEC 60050 (all parts), International Electrotechnical Vocabulary (available at
www.electropedia.org)
IEC 60050-561, International electrotechnical vocabulary – Part 561: Piezoelectric, dielectric
and electrostatic devices and associated materials for frequency control, selection and
detection
IEC 60068-1:2013, Environmental testing – Part 1: General and guidance
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-6, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-7, Basic environmental testing procedures – Part 2-7: Tests – Test Ga and
guidance: Acceleration, steady state
IEC 60068-2-13, Basic environmental testing procedures – Part 2-13: Tests – Test M: Low air
pressure
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-17:1994, Basic environmental testing procedures – Part 2-17: Tests – Test Q:
Sealing
IEC 60068-2-27, Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
IEC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
– 8 – IEC 62604-1:2022 RLV © IEC 2022
IEC 60068-2-31, Environmental testing – Part 2-31: Tests – Test Ec: Rough handling shocks,
primarily for equipment-type specimens
IEC 60068-2-45, Basic environmental testing procedures – Part 2-45: Tests – Test XA and
guidance: Immersion in cleaning solvents
IEC 60068-2-52, Environmental testing – Part 2-52: Tests – Test Kb: Salt mist, cyclic (sodium
chloride solution)
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMD)
IEC 60068-2-64, Environmental testing – Part 2-64: Tests – Test Fh: Vibration, broadband
random and guidance
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady state
IEC 60122-1, Quartz crystal units of assessed quality – Part 1: Generic specification
IEC 60617, Graphical symbols for diagrams (available at http://std.iec.ch/iec60617)
IEC 60642, Piezoelectric ceramic resonators and resonator units for frequency control and
selection – Chapter I: Standard values and conditions – Chapter II: Measuring and test
conditions
IEC 60695-11-5, Fire hazard testing – Part 11-5: Test flames – Needle-flame test method –
Apparatus, confirmatory test arrangement and guidance
IEC 60749-28 , Semiconductor devices – Mechanical and climatic test methods – Part 28:
Electrostatic discharge (ESD) sensitivity testing direct contact – Charged device model (DC-
CDM) – device level
IEC 61000-4-2, Electromagnetic compatibility (EMC) – Part 4-2: Testing and measurement
techniques – Electrostatic discharge immunity test
IEC 61340-3-1 , Electrostatics – Part 3-1: Methods for simulation of electrostatic effects –
Human body model (HBM) electrostatic discharge test waveforms
IEC 61340-3-2 , Electrostatics – Part 3-2: Methods for simulation of electrostatic effects –
Machine model (MM) electrostatic discharge test waveforms
IEC 62761, Guidelines for the measurement method of nonlinearity for surface acoustic wave
(SAW) and bulk acoustic wave (BAW) devices in radio frequency (RF)
IEC 80000 (all parts), Quantities and units
ISO 80000 (all parts), Quantities and units
___________
To be published.
Withdrawn
3 Terms, definitions, units and graphical symbols
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1.1 General terms
3.1.1.1
surface acoustic wave
SAW
acoustic wave, propagating along a surface of an elastic material, whose amplitude decays
exponentially with the depth
[SOURCE: IEC 60862-1:2003, 2.2.1.1, modified — In the definition, "elastic substrate" has been
replaced with "elastic material" and "substrate depth" has been replaced with "the depth".
IEC 60862-1:2015, 3.1.1.1]
3.1.1.2
surface acoustic wave filter
SAW filter
filter characterized by one or more surface acoustic wave transmission line or resonant
elements, where the surface acoustic wave is usually generated by an interdigital transducer
and propagates along a material surface
[SOURCE: IEC 60862-1:2003, 2.2.1.2, modified IEC 60862-1:2015, 3.1.1.2]
3.1.1.3
bulk acoustic wave
BAW
acoustic wave, propagating inside an elastic material and then traversing the entire thickness
of the bulk
Note 1 to entry: The wave is excited by metal electrodes attached to both sides of the piezoelectric layer.
3.1.1.4
bulk acoustic wave filter
BAW filter
filter characterized by a bulk acoustic wave which is usually generated by a pair of electrodes
and propagates along a thickness direction
3.1.1.5
film bulk acoustic resonator
FBAR
thin film BAW resonator consisting of a piezoelectric layer sandwiched between two electrode
layers with stress-free top and bottom surface supported mechanically at the edge on a
substrate with cavity structure as shown in Figure 1 or membrane structure as an example
Note 1 to entry: This note applies to the French language only.

– 10 – IEC 62604-1:2022 RLV © IEC 2022
Electrodes
Piezoelectric layer
Stop etching layer
Substrate
Cavity
IEC
a) – Back-side etched
b) – Front-side etched
c) – Sacrificial-layer etched
Figure 1 – FBAR configuration
3.1.1.6
solidly mounted resonator
SMR
BAW resonator, supporting the electrode/piezoelectric layer/electrode structure by a sequence
of additional thin films of alternately low and high acoustic impedance Za with quarter
wavelength layer, and these layers act as acoustic reflectors and decouple the resonator
acoustically from the substrate, as shown in Figure 2 as an example
Note 1 to entry: This note applies to the French language only.

Electrodes
Piezoelectric layer
Low impedance layer
λ/4 reflector layers
High impedance layer
Substrate
IEC
Figure 2 – SMR configuration
3.1.2 Response characteristics related terms
3.1.2.1
reference frequency
frequency defined by the specification to which other frequencies may be referred
[SOURCE: IEC 60862-1:2003, 2.2.2.3 IEC 60862-1:2015, 3.1.2.3]
3.1.2.2
insertion attenuation
logarithmic ratio of the power delivered directly to the load impedance before insertion of the
duplexer to the power delivered to the load impedance after insertion of the duplexer
[SOURCE: IEC 60862-1:2003, 2.2.2.6 IEC 60862-1:2015, 3.1.2.6, modified– In the definition,
"filter" has been replaced with "duplexer".]
3.1.2.3
nominal insertion attenuation
insertion attenuation at a specified reference frequency
[SOURCE: IEC 60862-1:2003, 2.2.2.7 IEC 60862-1:2015, 3.1.2.7]
3.1.2.4
relative attenuation
difference between the attenuation at a given frequency and the attenuation at the reference
frequency
– 12 – IEC 62604-1:2022 RLV © IEC 2022
[SOURCE: IEC 60862-1:2003, 2.2.2.8 IEC 60862-1:2015, 3.1.2.8]
3.1.2.5
pass band
band of frequencies in which the relative attenuation is equal to or less than a specified value
[SOURCE: IEC 60862-1:2003, 2.2.2.9 IEC 60862-1:2015, 3.1.2.9]
3.1.2.6
pass bandwidth
separation of frequencies between which the relative attenuation is equal to or less than a
specified value
[SOURCE: IEC 60862-1:2003, 2.2.2.10 IEC 60862-1:2015, 3.1.2.10]
3.1.2.7
pass band ripple
maximum variation in attenuation characteristics within a specified pass band
[SOURCE: IEC 60862-1:2003, 2.2.2.11 IEC 60862-1:2015, 3.1.2.11]
3.1.2.8
minimum insertion attenuation
minimum value of insertion attenuation in the pass band
[SOURCE: IEC 60862-1:2003, 2.2.2.13 IEC 60862-1:2015, 3.1.2.13]
3.1.2.9
maximum insertion attenuation
maximum value of insertion attenuation in the pass band
[SOURCE: IEC 60862-1:2003, 2.2.2.14 IEC 60862-1:2015, 3.1.2.14]
3.1.2.10
stop band
band of frequencies in which the relative attenuation is equal to or greater than a specified
value
[SOURCE: IEC 60862-1:2003, 2.2.2.15 IEC 60862-1:2015, 3.1.2.15]
3.1.2.11
stop bandwidth
separation of frequencies between which the relative attenuation is equal to or greater than a
specified value
[SOURCE: IEC 60862-1:2003, 2.2.2.16 IEC 60862-1:2015, 3.1.2.16]
3.1.2.12
stop band rejection
minimum relative attenuation at a specified stop band
[SOURCE: IEC 60862-1:2015, 3.1.2.17]

3.1.2.13
group delay
time equal to the first derivative of the phase shift, in radians, with respect to the angular
frequency
[SOURCE: IEC 60862-1:2003, 2.2.2.18 IEC 60862-1:2015, 3.1.2.19]
3.1.2.14
trap frequency
specified frequency at which the relative attenuation is equal to or greater than a specified value
[SOURCE: IEC 60862-1:2003, 2.2.2.21 IEC 60862-1:2015, 3.1.2.22]
3.1.2.15
trap attenuation
relative attenuation at a specified trap frequency
[SOURCE: IEC 60862-1:2003, 2.2.2.22 IEC 60862-1:2015, 3.1.2.23]
3.1.2.16
transition band
band of frequencies between the cut-off frequency and the nearest point of the adjacent stop
band
[SOURCE: IEC 60862-1:2003, 2.2.2.23 IEC 60862-1:2015, 3.1.2.24]
3.1.2.17
reflectivity
dimensionless measure of the degree of mismatch between two impedances Z and Z :
a b
Z − Z
a b
,
Z + Z
a b
where Z and Z represent, respectively, the input and source impedance or the output and load
a b
impedance
Note 1 to entry: The absolute value of reflectivity is called the reflection coefficient.
[SOURCE: IEC 60862-1:2015, 3.1.2.25]
3.1.2.18
return attenuation
value of the reflection coefficient given by the sign changed expression in decibels:
Z − Z
a b
−20 log dB
Z + Z
a b
[SOURCE: IEC 60862-1:2003, 2.2.2.25, modified IEC 60862-1:2015, 3.1.2.26]
3.1.2.19
input level
power, voltage or current value applied to the input port of a duplexer/diplexer/multiplexer

– 14 – IEC 62604-1:2022 RLV © IEC 2022
[SOURCE: IEC 60862-1:2003, 2.2.2.29 IEC 60862-1:2015, 3.1.2.30, modified – In the
definition, "input terminal pair of a filter" has been replaced with "input port of a
duplexer/diplexer/multiplexer".]
3.1.2.20
output level
power, voltage or current value delivered to the load circuit
[SOURCE: IEC 60862-1:2003, 2.2.2.30, modified — In the definition, "load" has been replaced
with "load circuit". IEC 60862-1:2015, 3.1.2.31]
3.1.2.21
nominal level
power, voltage or current value at which the performance measurement is specified
[SOURCE: IEC 60862-1:2003, 2.2.2.31 IEC 60862-1:2015, 3.1.2.32]
3.1.2.22
input impedance
impedance presented by the duplexer/diplexer/multiplexer to the signal source when the output
is other ports are terminated by a specified load impedance
[SOURCE: IEC 60862-1:2003, 2.2.2.32 IEC 60862-1:2015, 3.1.2.33, modified – In the
definition, "filter" has been replaced with "duplexer/diplexer/multiplexer", "the output is
terminated" with "the other ports are terminated", and "a specified load impedance" with "a
specified impedance".]
3.1.2.23
output impedance
impedance presented by the duplexer/diplexer/multiplexer to the load when the input is other
ports are terminated by a specified source impedance
[SOURCE: IEC 60862-1:2003, 2.2.2.33 IEC 60862-1:2015, 3.1.2.34, modified – In the
definition, "filter" has been replaced with "duplexer/diplexer/multiplexer", "the input is
terminated" with "the other ports are terminated", and "a specified source impedance" with "a
specified impedance"]
3.1.2.24
terminating impedance
impedance presented to the duplexer/diplexer/multiplexer by the source or by the load
[SOURCE: IEC 60862-1:2015, 3.1.2.35, modified – In the definition, "filter" has been replaced
with "duplexer/diplexer/multiplexer".]
3.1.2.25
balanced RX port
RX port between two terminals having equal amplitudes and 180 degree different phases
3.1.2.26
operating temperature range
range of temperatures, over which the SAW or BAW duplexers will function while maintaining
its specified characteristics within specified tolerances
[SOURCE: IEC 60862-1:2003, 2.2.2.37 IEC 60862-1:2015, 3.1.2.38, modified – In the
definition, "SAW filter" has been replaced with "SAW or BAW duplexers".]

3.1.2.27
intermodulation distortion
IMD
non-linear distortion of a device response characterized by the appearance of frequencies at
the output which is equal to the differences (or sums) of integral multiples of the two or more
component frequencies present at the input
[SOURCE: IEC 60862-1:2003, 2.2.2.41 IEC 60862-1:2015, 3.1.2.42, modified — The
abbreviation "IMD" has been added. In the definition, "SAW transducer or filter" has been
replaced with "device".]
Note 1 to entry: This note applies to the French language only.
3.1.2.27
duplex image frequency
f
DIM
undesired input frequency that is converted to the receiving frequency (f ) by subtracting it from
R
twice the transmitting frequency (2f )
T
f = 2f – f
DIM T R
3.1.2.28
isolation
isolation from TX port to RX port
leakage power ratio from the TX port to the RX port in a duplexer
Note 1 to entry: Figure 3 c) gives an example of isolation response.
3.1.2.29
guard band
unused part of the radio spectrum between radio bands, for the purpose of preventing
interference
3.1.3 SAW and BAW duplexers related terms
3.1.3.1
duplexer
device used in the frequency division duplex system, which enables signals to be received and
transmitted through a common antenna simultaneously
3.1.3.2
diplexer
device which separates composite signals into two parts of two frequency domains
Note 1 to entry: This can be used to combine signals in two frequency domains into composite signals, in reverse.
3.1.3.3
multiplexer
device in which some duplexers or filters are combined to one duplexer, which enables signals
to be received and transmitted through a common antenna simultaneously
3.1.3.4
TX filter
filter used in a transmitter part to eliminate unnecessary signals
Note 1 to entry: This is a basic part of a duplexer.
Note 2 to entry: Figure 3 a) gives an example of TX filter response.

– 16 – IEC 62604-1:2022 RLV © IEC 2022
3.1.3.5
RX filter
filter used in a receiver part to eliminate unnecessary signals
Note 1 to entry: This is a basic part of a duplexer.
Note 2 to entry: Figure 3 b) gives an example of RX filter response.
3.1.3.5
phase shifter
device which changes the phase of signals, not the frequency of them
Note 1 to entry: This is a basic part of a duplexer.
3.1.3.6
stress migration
phenomenon of electrode defect caused by stress corresponding to distortion proportional to
positively correlated with the input power in the resonator
3.1.3.7
breakdown
phenomenon of failure by insulation breakdown when applying high power
3.1.3.8
void
vacancy in the IDT electrode caused by stress migration resulting from diffusing and/or transfer
of metal atoms forming part of the electrode
3.1.3.9
hillock
projection on the side or upper surface of the electrode caused by stress migration resulting
from diffusing and/or transfer of metal atoms forming part of the electrode

a) Basic TX filter response example of SAW and BAW duplexers

b) Basic RX filter response example of SAW and BAW duplexers

c) Basic isolation response example of SAW and BAW duplexers
Figure 3 – Frequency response of SAW and BAW duplexers
3.2 Units and graphical symbols
Units, graphical symbols, letter symbols and terminology shall, wherever possible, be taken
from the following International Standards:

– 18 – IEC 62604-1:2022 RLV © IEC 2022
– IEC 60027 (all parts);
– IEC 60050-561;
– IEC 60617;
– IEC 60642;
– IEC 60122-1;
– IEC 80000;
– ISO 80000.
4 Order of precedence of documents
Where any discrepancies occur for any reason, documents shall rank in the following order of
precedence:
– the detail specification;
– the sectional specification;
– the generic specification;
– any other international documents (for example, of the IEC) to which reference is made.
The same order of precedence shall apply to equivalent national documents.
5 Preferred values for ratings and characteristics
5.1 General
Values should be chosen from 5.2 to 5.8 unless otherwise stated in the detail specification.
5.2 Nominal frequency bands
Table 1 shows the frequency allocation of typical UMTS bands.
Table 1 – Frequency allocation of typical UMTS bands
Band Transmitting frequency Receiving frequency
(MHz) (MHz)
I 1 920 to 1 980 2 110 to 2 170
II 1 850 to 1 910 1 930 to 1 990
III 1 710 to 1 785 1 805 to 1 880
IV 1 710 to 1 755 2 110 to 2 155
V 824 to 849 869 to 894
VIII 880 to 915 925 to 960
5.3 Operating temperature ranges, in degrees Celsius (°C)
• −45 to +125
• −40 to +85
• −30 to +85
• −20 to +75
• −20 to +70
• −10 to +60
• 0 to +60
Other temperature ranges may be used but the lowest temperature should be not lower than –
60 °C and the highest temperature should not exceed 125 °C.
5.4 Climatic category
• 40/085/56 (climatic categories are given in accordance with Annex A of IEC 60068‑1:2013):
for ceramic enclosures.
For requirements where the operating temperature range of the SAW and BAW duplexers
is greater than −40 °C to +85 °C, a climatic category consistent with the operating
temperature range shall be specified.
• 20/085/21 (climatic categories are given in accordance with Annex A of IEC 60068‑1:2013):
for plastic packages.
5.5 Bump severity
(4 000 ± 10) bumps at 400 m/s peak acceleration in each direction along three mutually
perpendicular axes (see 8.6.5).
Pulse duration: 6 ms.
5.6 Vibration severity
a) Sinusoidal
10 Hz to 55 Hz
0,75 mm displacement amplitude
(peak value) 30 min in each of three

mutually perpendicular axes
55 Hz to 500 Hz or 55 Hz to 2 000 Hz at 1 octave/min (see 8.6.6)

100 m/s acceleration amplitude

(peak value)
or
10 Hz to 55 Hz
1,5 mm displacement amplitude
(peak value) 30 min in each of three

mutually perpendicular axes
55 Hz to 2 000 Hz at 1 octave/min (see 8.6.6)

200 m/s acceleration amplitude

(peak value)
b) Random
2 2
30 min in each of three
(19,2 m/s ) /Hz between
20 Hz to 2 000 Hz mutually perpendicular axes
62 m/s2 acceleration at 1 octave/min (see 8.6.6)

or
2 2
30 min in each of three
(19,2 m/s ) /Hz between
20 Hz to 2 000 Hz mutually perpendicular axes
at 1 octave/min (see 8.6.6)
196 m/s acceleration
or
– 20 – IEC 62604-1:2022 RLV © IEC 2022
2 2
30 min in each of three
(48 m/s ) /Hz between
20 Hz to 2 000 Hz mutually perpendicular axes
at 1 octave/min (see 8.6.6)
314 m/s acceleration
5.7 Shock severity
1 000 m/s peak acceleration for 6 ms duration; three shocks in each direction along three
mutually perpendicular axes (see 8.6.7), half sine pulse, unless otherwise stated in the detail
specification.
5.8 Fine leak rate
−1 3 3
• 10 Pa cm /s (10–6 bar cm /s);
−3 3 3
• 10 Pa cm /s (10–8 bar cm /s).
6 Marking
6.1 Duplexer marking
Surface acoustic wave and bulk acoustic wave duplexers shall be clearly and durably marked
(see 8.6.17) along with items a) to g) in the order given below and, if possible, with as many of
the remaining items as considered necessary:
a) type designation as defined in the detail specification;
b) nominal frequency in megahertz (MHz);
c) year and week of manufacture;
d) mark of conformity (unless a certificate of conformity is used);
e) factory identification code;
f) manufacturer’s name or trademark;
g) terminal identification (if applicable);
h) designation of electrical connections (if applicable);
i) serial number (if applicable);
j) surface mounted device classification (if applicable).
Where the available surface area of miniature SAW and BAW duplexers imposes practical limits
on the amount of marking, instructions on the marking to be applied shall be given in the detail
specification.
6.2 Package marking
The primary packaging containing the SAW and BAW duplexers shall be clearly marked with
the information listed in 6.1, except item g), and electrostatic sensitive device identification
where necessary.
7 Quality assessment procedures
7.1 General
Two methods are available for the approval of SAW and BAW duplexers of assessed quality:
capability approval and qualification approval.

7.2 Primary stage of manufacture
The primary stage of manufacture for a SAW or BAW duplexer is the final surface cleaning of
substrates.
7.3 Structurally similar components
The grouping of structurally similar SAW and BAW duplexers for the purpose of qualification
approval, capability approval and quality conformance inspection shall be prescribed in the
relevant sectional specification.
7.4 Subcontracting
These procedures shall be in accordance with the specified quality assessment system.
However, the final surface cleaning of the substrate and all subsequent processes shall be
carried out by the manufacturer to whom approval has been granted.
7.5 Incorporated components
Where the final component contains components of a type covered by a generic specification
in the IEC series, these shall be produced using the normal IEC release procedures.
7.6 Manufacturer’s approval
To obtain the manufacturer’s approval, the manufacturer shall meet the requirements of the
specified quality assessment system.
7.7 Approval procedures
7.7.1 General
To qualify a SA
...

IEC 62604-1 ®
Edition 2.0 2022-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of
assessed quality –
Part 1: Generic specification
Duplexeurs à ondes acoustiques de surface (OAS) et à ondes acoustiques de
volume (OAV) sous assurance de la qualité –
Partie 1: Spécification générique

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IEC 62604-1 ®
Edition 2.0 2022-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of

assessed quality –
Part 1: Generic specification
Duplexeurs à ondes acoustiques de surface (OAS) et à ondes acoustiques de

volume (OAV) sous assurance de la qualité –

Partie 1: Spécification générique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.140 ISBN 978-2-8322-3965-0

– 2 – IEC 62604-1:2022 © IEC 2022
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, units and graphical symbols . 8
3.1 Terms and definitions . 8
3.1.1 General terms . 9
3.1.2 Response characteristics related terms . 11
3.1.3 SAW and BAW duplexers related terms . 15
3.2 Units and graphical symbols . 16
4 Order of precedence of documents . 16
5 Preferred values for ratings and characteristics . 17
5.1 General . 17
5.2 Nominal frequency bands . 17
5.3 Operating temperature ranges, in degrees Celsius (°C) . 17
5.4 Climatic category . 17
5.5 Bump severity . 17
5.6 Vibration severity . 18
5.7 Shock severity . 18
5.8 Fine leak rate . 18
6 Marking . 19
6.1 Duplexer marking . 19
6.2 Package marking . 19
7 Quality assessment procedures . 19
7.1 General . 19
7.2 Primary stage of manufacture . 19
7.3 Structurally similar components . 19
7.4 Subcontracting . 19
7.5 Incorporated components . 20
7.6 Manufacturer’s approval . 20
7.7 Approval procedures . 20
7.7.1 General . 20
7.7.2 Capability approval . 20
7.7.3 Qualification approval . 20
7.8 Procedures for capability approval . 20
7.8.1 General . 20
7.8.2 Eligibility for capability approval . 21
7.8.3 Application for capability approval . 21
7.8.4 Granting of capability approval . 21
7.8.5 Capability manual . 21
7.9 Procedures for qualification approval . 21
7.9.1 General . 21
7.9.2 Eligibility for qualification approval . 21
7.9.3 Application for qualification approval . 21
7.9.4 Granting of qualification approval . 21
7.9.5 Quality conformance inspection . 21
7.10 Test procedures . 21

7.11 Screening requirements . 21
7.12 Rework and repair work . 22
7.12.1 Rework . 22
7.12.2 Repair work . 22
7.13 Certified records of released lots . 22
7.14 Validity of release . 22
7.15 Release for delivery . 22
7.16 Unchecked parameters . 22
8 Test and measurement procedures . 22
8.1 General . 22
8.2 Test and measurement conditions . 22
8.2.1 Standard conditions for testing . 22
8.2.2 Precision of measurement . 23
8.2.3 Precautions . 23
8.2.4 Alternative test methods . 23
8.3 Visual inspection . 23
8.3.1 General . 23
8.3.2 Visual test A . 23
8.3.3 Visual test B . 24
8.4 Dimensions test . 24
8.5 Electrical test procedures . 24
8.5.1 S-parameters measurement . 24
8.5.2 Intermodulation distortion measurement . 26
8.5.3 Insulation resistance . 26
8.5.4 Voltage proof . 26
8.6 Mechanical and environmental test procedures . 26
8.6.1 Sealing tests (non-destructive) . 26
8.6.2 Soldering (solderability and resistance to soldering heat) (destructive) . 27
8.6.3 Rapid change of temperature: severe shock by liquid immersion (non-
destructive). 27
8.6.4 Rapid change of temperature with prescribed time of transition (non-
destructive). 27
8.6.5 Bump (destructive) . 27
8.6.6 Vibration (destructive). 28
8.6.7 Shock (destructive) . 28
8.6.8 Free fall (destructive) . 28
8.6.9 Acceleration, steady state (non-destructive) . 29
8.6.10 Low air pressure (non-destructive) . 29
8.6.11 Dry heat (non-destructive) . 29
8.6.12 Damp heat, cyclic (destructive) . 29
8.6.13 Cold (non-destructive) . 29
8.6.14 Climatic sequence (destructive) . 29
8.6.15 Damp heat, steady state (destructive) . 30
8.6.16 Salt mist cyclic (destructive) . 30
8.6.17 Immersion in cleaning solvents (non-destructive) . 30
8.6.18 Flammability test (destructive) . 30
8.6.19 Electrostatic discharge (ESD) sensitivity test (destructive) . 30
8.7 Endurance test procedure . 31
Bibliography . 32

– 4 – IEC 62604-1:2022 © IEC 2022
Figure 1 – FBAR configuration . 10
Figure 2 – SMR configuration . 11
Figure 3 – Frequency response of SAW and BAW duplexers . 16
Figure 4 – S-parameters measurement . 25

Table 1 – Frequency allocation of typical UMTS bands . 17

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE ACOUSTIC WAVE (SAW) AND
BULK ACOUSTIC WAVE (BAW) DUPLEXERS
OF ASSESSED QUALITY –
Part 1: Generic specification
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62604-1 has been prepared by IEC technical committee 49: Piezoelectric, dielectric and
electrostatic devices and associated materials for frequency control, selection and detection. It
is an International Standard.
This second edition cancels and replaces the first edition published in 2015. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
• the term "multiplexer" has been added to Clause 3.
NOTE In this document, SAW and BAW duplexers are treated simultaneously because both duplexers are used in
the same manner especially in mobile phones and have the same requirements of characteristics, test method and
so on.
– 6 – IEC 62604-1:2022 © IEC 2022
The text of this International Standard is based on the following documents:
Draft Report on voting
49/1360/CDV 49/1375/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62604 series, published under the general title Surface acoustic
wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality, can be found on the
IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

SURFACE ACOUSTIC WAVE (SAW) AND
BULK ACOUSTIC WAVE (BAW) DUPLEXERS
OF ASSESSED QUALITY –
Part 1: Generic specification
1 Scope
This part of IEC 62604 specifies the methods of test and general requirements for SAW and
BAW duplexers of assessed quality using either capability approval or qualification approval
procedures.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology
IEC 60050-561, International electrotechnical vocabulary – Part 561: Piezoelectric, dielectric
and electrostatic devices and associated materials for frequency control, selection and
detection
IEC 60068-1:2013, Environmental testing – Part 1: General and guidance
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-6, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-7, Basic environmental testing procedures – Part 2-7: Tests – Test Ga and
guidance: Acceleration, steady state
IEC 60068-2-13, Basic environmental testing procedures – Part 2-13: Tests – Test M: Low air
pressure
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-17:1994, Basic environmental testing procedures – Part 2-17: Tests – Test Q:
Sealing
IEC 60068-2-27, Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
IEC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
IEC 60068-2-31, Environmental testing – Part 2-31: Tests – Test Ec: Rough handling shocks,
primarily for equipment-type specimens

– 8 – IEC 62604-1:2022 © IEC 2022
IEC 60068-2-45, Basic environmental testing procedures – Part 2-45: Tests – Test XA and
guidance: Immersion in cleaning solvents
IEC 60068-2-52, Environmental testing – Part 2-52: Tests – Test Kb: Salt mist, cyclic (sodium
chloride solution)
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMD)
IEC 60068-2-64, Environmental testing – Part 2-64: Tests – Test Fh: Vibration, broadband
random and guidance
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady state
IEC 60122-1, Quartz crystal units of assessed quality – Part 1: Generic specification
IEC 60617, Graphical symbols for diagrams (available at http://std.iec.ch/iec60617)
IEC 60642, Piezoelectric ceramic resonators and resonator units for frequency control and
selection – Chapter I: Standard values and conditions – Chapter II: Measuring and test
conditions
IEC 60695-11-5, Fire hazard testing – Part 11-5: Test flames – Needle-flame test method –
Apparatus, confirmatory test arrangement and guidance
IEC 60749-28, Semiconductor devices – Mechanical and climatic test methods – Part 28:
Electrostatic discharge (ESD) sensitivity testing – Charged device model (CDM) – device level
IEC 61000-4-2, Electromagnetic compatibility (EMC) – Part 4-2: Testing and measurement
techniques – Electrostatic discharge immunity test
IEC 61340-3-1 , Electrostatics – Part 3-1: Methods for simulation of electrostatic effects –
Human body model (HBM) electrostatic discharge test waveforms
IEC 61340-3-2 , Electrostatics – Part 3-2: Methods for simulation of electrostatic effects –
Machine model (MM) electrostatic discharge test waveforms
IEC 62761, Guidelines for the measurement method of nonlinearity for surface acoustic wave
(SAW) and bulk acoustic wave (BAW) devices in radio frequency (RF)
IEC 80000 (all parts), Quantities and units
ISO 80000 (all parts), Quantities and units
3 Terms, definitions, units and graphical symbols
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
___________
Withdrawn
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1.1 General terms
3.1.1.1
surface acoustic wave
SAW
acoustic wave, propagating along a surface of an elastic material, whose amplitude decays
exponentially with the depth
[SOURCE: IEC 60862-1:2015, 3.1.1.1]
3.1.1.2
surface acoustic wave filter
SAW filter
filter characterized by one or more surface acoustic wave transmission line or resonant
elements, where the surface acoustic wave is usually generated by an interdigital transducer
and propagates along a material surface
[SOURCE: IEC 60862-1:2015, 3.1.1.2]
3.1.1.3
bulk acoustic wave
BAW
acoustic wave, propagating inside an elastic material and then traversing the entire thickness
of the bulk
Note 1 to entry: The wave is excited by metal electrodes attached to both sides of the piezoelectric layer.
3.1.1.4
bulk acoustic wave filter
BAW filter
filter characterized by a bulk acoustic wave which is usually generated by a pair of electrodes
and propagates along a thickness direction
3.1.1.5
film bulk acoustic resonator
FBAR
thin film BAW resonator consisting of a piezoelectric layer sandwiched between two electrode
layers with stress-free top and bottom surface supported mechanically at the edge on a
substrate with cavity structure as shown in Figure 1 or membrane structure as an example
Note 1 to entry: This note applies to the French language only.

– 10 – IEC 62604-1:2022 © IEC 2022

a) – Back-side etched
b) – Front-side etched
c) – Sacrificial-layer etched
Figure 1 – FBAR configuration
3.1.1.6
solidly mounted resonator
SMR
BAW resonator, supporting the electrode/piezoelectric layer/electrode structure by a sequence
of additional thin films of alternately low and high acoustic impedance Za with quarter
wavelength layer, and these layers act as acoustic reflectors and decouple the resonator
acoustically from the substrate, as shown in Figure 2 as an example

Figure 2 – SMR configuration
3.1.2 Response characteristics related terms
3.1.2.1
reference frequency
frequency defined by the specification to which other frequencies may be referred
[SOURCE: IEC 60862-1:2015, 3.1.2.3]
3.1.2.2
insertion attenuation
logarithmic ratio of the power delivered directly to the load impedance before insertion of the
duplexer to the power delivered to the load impedance after insertion of the duplexer
[SOURCE: IEC 60862-1:2015, 3.1.2.6, modified – In the definition, "filter" has been replaced
with "duplexer".]
3.1.2.3
nominal insertion attenuation
insertion attenuation at a specified reference frequency
[SOURCE: IEC 60862-1:2015, 3.1.2.7]
3.1.2.4
relative attenuation
difference between the attenuation at a given frequency and the attenuation at the reference
frequency
[SOURCE: IEC 60862-1:2015, 3.1.2.8]
3.1.2.5
pass band
band of frequencies in which the relative attenuation is equal to or less than a specified value
[SOURCE: IEC 60862-1:2015, 3.1.2.9]

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3.1.2.6
pass bandwidth
separation of frequencies between which the relative attenuation is equal to or less than a
specified value
[SOURCE: IEC 60862-1:2015, 3.1.2.10]
3.1.2.7
pass band ripple
maximum variation in attenuation characteristics within a specified pass band
[SOURCE: IEC 60862-1:2015, 3.1.2.11]
3.1.2.8
minimum insertion attenuation
minimum value of insertion attenuation in the pass band
[SOURCE: IEC 60862-1:2015, 3.1.2.13]
3.1.2.9
maximum insertion attenuation
maximum value of insertion attenuation in the pass band
[SOURCE: IEC 60862-1:2015, 3.1.2.14]
3.1.2.10
stop band
band of frequencies in which the relative attenuation is equal to or greater than a specified
value
[SOURCE: IEC 60862-1:2015, 3.1.2.15]
3.1.2.11
stop bandwidth
separation of frequencies between which the relative attenuation is equal to or greater than a
specified value
[SOURCE: IEC 60862-1:2015, 3.1.2.16]
3.1.2.12
stop band rejection
minimum relative attenuation at a specified stop band
[SOURCE: IEC 60862-1:2015, 3.1.2.17]
3.1.2.13
group delay
time equal to the first derivative of the phase shift, in radians, with respect to the angular
frequency
[SOURCE: IEC 60862-1:2015, 3.1.2.19]
3.1.2.14
trap frequency
specified frequency at which the relative attenuation is equal to or greater than a specified value

[SOURCE: IEC 60862-1:2015, 3.1.2.22]
3.1.2.15
trap attenuation
relative attenuation at a specified trap frequency
[SOURCE: IEC 60862-1:2015, 3.1.2.23]
3.1.2.16
transition band
band of frequencies between the cut-off frequency and the nearest point of the adjacent stop
band
[SOURCE: IEC 60862-1:2015, 3.1.2.24]
3.1.2.17
reflectivity
dimensionless measure of the degree of mismatch between two impedances Z and Z :
a b
Z − Z
a b
,
Z + Z
a b
where Z and Z represent, respectively, the input and source impedance or the output and load
a b
impedance
Note 1 to entry: The absolute value of reflectivity is called the reflection coefficient.
[SOURCE: IEC 60862-1:2015, 3.1.2.25]
3.1.2.18
return attenuation
value of the reflection coefficient given by the sign changed expression in decibels:
Z − Z
a b
−20 log dB
Z + Z
a b
[SOURCE: IEC 60862-1:2015, 3.1.2.26]
3.1.2.19
input level
power, voltage or current value applied to the input port of a duplexer/diplexer/multiplexer
[SOURCE: IEC 60862-1:2015, 3.1.2.30, modified – In the definition, "input terminal of a filter"
has been replaced with "input port of a duplexer/diplexer/multiplexer".]
3.1.2.20
output level
power, voltage or current value delivered to the load circuit
[SOURCE: IEC 60862-1:2015, 3.1.2.31]
3.1.2.21
nominal level
power, voltage or current value at which the performance measurement is specified

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[SOURCE: IEC 60862-1:2015, 3.1.2.32]
3.1.2.22
input impedance
impedance presented by the duplexer/diplexer/multiplexer to the signal source when the other
ports are terminated by a specified impedance
[SOURCE: IEC 60862-1:2015, 3.1.2.33, modified – In the definition, "filter" has been replaced
with "duplexer/diplexer/multiplexer", "the output is terminated" with "the other ports are
terminated", and "a specified load impedance" with "a specified impedance".]
3.1.2.23
output impedance
impedance presented by the duplexer/diplexer/multiplexer to the load when the other ports are
terminated by a specified impedance
[SOURCE: IEC 60862-1:2015, 3.1.2.34, modified – In the definition, "filter" has been replaced
with "duplexer/diplexer/multiplexer", "the input is terminated" with "the other ports are
terminated", and "a specified source impedance" with "a specified impedance"]
3.1.2.24
terminating impedance
impedance presented to the duplexer/diplexer/multiplexer by the source or by the load
[SOURCE: IEC 60862-1:2015, 3.1.2.35, modified – In the definition, "filter" has been replaced
with "duplexer/diplexer/multiplexer".]
3.1.2.25
balanced RX port
RX port between two terminals having equal amplitudes and 180 degree different phases
3.1.2.26
operating temperature range
range of temperatures, over which the SAW or BAW duplexers will function while maintaining
its specified characteristics within specified tolerances
[SOURCE: IEC 60862-1:2015, 3.1.2.38, modified – In the definition, "SAW filter" has been
replaced with "SAW or BAW duplexers".]
3.1.2.27
intermodulation distortion
IMD
non-linear distortion of a device response characterized by the appearance of frequencies at
the output which is equal to the differences (or sums) of integral multiples of the two or more
component frequencies present at the input
Note 1 to entry: This note applies to the French language only.
[SOURCE: IEC 60862-1:2015, 3.1.2.42]
3.1.2.28
isolation
isolation from TX port to RX port
leakage power ratio from the TX port to the RX port in a duplexer
Note 1 to entry: Figure 3 c) gives an example of isolation response.

3.1.3 SAW and BAW duplexers related terms
3.1.3.1
duplexer
device used in the frequency division duplex system, which enables signals to be received and
transmitted through a common antenna simultaneously
3.1.3.2
diplexer
device which separates composite signals into two parts of two frequency domains
Note 1 to entry: This can be used to combine signals in two frequency domains into composite signals, in reverse.
3.1.3.3
multiplexer
device in which some duplexers or filters are combined to one duplexer, which enables signals
to be received and transmitted through a common antenna simultaneously
3.1.3.4
TX filter
filter used in a transmitter part to eliminate unnecessary signals
Note 1 to entry: This is a basic part of a duplexer.
Note 2 to entry: Figure 3 a) gives an example of TX filter response.
3.1.3.5
RX filter
filter used in a receiver part to eliminate unnecessary signals
Note 1 to entry: This is a basic part of a duplexer.
Note 2 to entry: Figure 3 b) gives an example of RX filter response.
3.1.3.6
stress migration
phenomenon of electrode defect caused by stress corresponding to distortion positively
correlated with the input power in the resonator
3.1.3.7
breakdown
phenomenon of failure by insulation breakdown when applying high power

a) Basic TX filter response example of SAW and BAW duplexers

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b) Basic RX filter response example of SAW and BAW duplexers

c) Basic isolation response example of SAW and BAW duplexers
Figure 3 – Frequency response of SAW and BAW duplexers
3.2 Units and graphical symbols
Units, graphical symbols, letter symbols and terminology shall, wherever possible, be taken
from the following International Standards:
– IEC 60027 (all parts);
– IEC 60050-561;
– IEC 60617;
– IEC 60642;
– IEC 60122-1;
– IEC 80000;
– ISO 80000.
4 Order of precedence of documents
Where any discrepancies occur for any reason, documents shall rank in the following order of
precedence:
– the detail specification;
– the sectional specification;

– the generic specification;
– any other international documents (for example, of the IEC) to which reference is made.
The same order of precedence shall apply to equivalent national documents.
5 Preferred values for ratings and characteristics
5.1 General
Values should be chosen from 5.2 to 5.8 unless otherwise stated in the detail specification.
5.2 Nominal frequency bands
Table 1 shows the frequency allocation of typical UMTS bands.
Table 1 – Frequency allocation of typical UMTS bands
Band Transmitting frequency Receiving frequency
(MHz) (MHz)
I 1 920 to 1 980 2 110 to 2 170
II 1 850 to 1 910 1 930 to 1 990
III 1 710 to 1 785 1 805 to 1 880
IV 1 710 to 1 755 2 110 to 2 155
V 824 to 849 869 to 894
VIII 880 to 915 925 to 960
5.3 Operating temperature ranges, in degrees Celsius (°C)
• −45 to +125
• −40 to +85
• −30 to +85
• −20 to +75
• −20 to +70
• −10 to +60
• 0 to +60
Other temperature ranges may be used but the lowest temperature should be not lower than –
60 °C and the highest temperature should not exceed 125 °C.
5.4 Climatic category
• 40/085/56 (climatic categories are given in accordance with Annex A of IEC 60068‑1:2013):
for ceramic enclosures.
For requirements where the operating temperature range of the SAW and BAW duplexers
is greater than −40 °C to +85 °C, a climatic category consistent with the operating
temperature range shall be specified.
• 20/085/21 (climatic categories are given in accordance with Annex A of IEC 60068‑1:2013):
for plastic packages.
5.5 Bump severity
(4 000 ± 10) bumps at 400 m/s peak acceleration in each direction along three mutually
perpendicular axes (see 8.6.5).

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Pulse duration: 6 ms.
5.6 Vibration severity
a) Sinusoidal
10 Hz to 55 Hz
0,75 mm displacement amplitude
(peak value) 30 min in each of three

mutually perpendicular axes
55 Hz to 500 Hz or 55 Hz to 2 000 Hz at 1 octave/min (see 8.6.6)

100 m/s acceleration amplitude

(peak value)
or
10 Hz to 55 Hz
1,5 mm displacement amplitude
(peak value) 30 min in each of three

mutually perpendicular axes
55 Hz to 2 000 Hz at 1 octave/min (see 8.6.6)

200 m/s acceleration amplitude

(peak value)
b) Random
2 2
30 min in each of three
(19,2 m/s ) /Hz between
20 Hz to 2 000 Hz mutually perpendicular axes
62 m/s2 acceleration at 1 octave/min (see 8.6.6)

or
2 2
30 min in each of three
(19,2 m/s ) /Hz between
20 Hz to 2 000 Hz mutually perpendicular axes
at 1 octave/min (see 8.6.6)
196 m/s acceleration
or
2 2
30 min in each of three
(48 m/s ) /Hz between
20 Hz to 2 000 Hz mutually perpendicular axes
at 1 octave/min (see 8.6.6)
314 m/s acceleration
5.7 Shock severity
1 000 m/s peak acceleration for 6 ms duration; three shocks in each direction along three
mutually perpendicular axes (see 8.6.7), half sine pulse, unless otherwise stated in the detail
specification.
5.8 Fine leak rate
−1 3 3
• 10 Pa cm /s (10–6 bar cm /s);
−3 3 3
• 10 Pa cm /s (10–8 bar cm /s).

6 Marking
6.1 Duplexer marking
Surface acoustic wave and bulk acoustic wave duplexers shall be clearly and durably marked
(see 8.6.17) along with items a) to g) in the order given below and, if possible, with as many of
the remaining items as considered necessary:
a) type designation as defined in the detail specification;
a) nominal frequency in megahertz (MHz);
b) year and week of manufacture;
c) mark of conformity (unless a certificate of conformity is used);
d) factory identification code;
e) manufacturer’s name or trademark;
f) terminal identification (if applicable);
g) designation of electrical connections (if applicable);
h) serial number (if applicable);
i) surface mounted device classification (if applicable).
Where the available surface area of miniature SAW and BAW duplexers imposes practical limits
on the amount of marking, instructions on the marking to be applied shall be given in the detail
specification.
6.2 Package marking
The primary packaging containing the SAW and BAW duplexers shall be clearly marked with
the information listed in 6.1, except item g), and electrostatic sensitive device identification
where necessary.
7 Quality assessment procedures
7.1 General
Two methods are available for the approval of SAW and BAW duplexers of assessed quality:
capability approval and qualification approval.
7.2 Primary stage of manufacture
The primary stage of manufacture for a SAW or BAW duplexer is the final surface cleaning of
substrates.
7.3 Structurally similar components
The grouping of structurally similar SAW and BAW duplexers for the purpose of qualification
approval, capability approval and quality conformance inspection shall be prescribed in the
relevant sectional specification.
7.4 Subcontracting
These procedures shall be in accordance with the specified quality assessment system.
However, the final surface cleaning of the substrate and all subsequent processes shall be
carried out by the manufacturer to whom approval has been granted.

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7.5 Incorporated components
Where the final component contains components of a type covered by a generic specification
in the IEC series, these shall be produced using the normal IEC release procedures.
7.6 Manufacturer’s approval
...