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IEC 60749-5:2003

(Main)

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

Provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 5: Essai continu de durée de vie sous température et humidité avec polarisation

Décrit un essai continu de durée de vie utilisant la température et l'humidité avec polarisation pour évaluer la fiabilité des dispositifs à semiconducteurs sous boîtier non hermétique dans les environnements humides.

General Information

Status
Published
Publication Date
16-Jan-2003
ICS
31.080.01 - Semiconductor devices in general
Technical Committee
TC 47 - Semiconductor devices
Drafting Committee
WG 2 - TC 47/WG 2
Current Stage
DELPUB - Deleted Publication
Completion Date
10-Apr-2017
Ref Project

Relations

Replaces
IEC 60749:1996/AMD2:2001 - Amendment 2 - Semiconductor devices - Mechanical and climatic test methods
Effective Date
05-Sep-2023
Replaces
IEC 60749:1996 - Semiconductor devices - Mechanical and climatic test methods
Effective Date
05-Sep-2023
Replaces
IEC PAS 62161:2000 - Steady state temperature humidity bias life test
Effective Date
05-Sep-2023
Replaces
IEC 60749:1996/AMD1:2000 - Amendment 1 - Semiconductor devices - Mechanical and climatic test methods
Effective Date
05-Sep-2023
Revised
IEC 60749-5:2017 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
Effective Date
05-Sep-2023

Buy Standard

IEC 60749-5:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test Released:1/17/2003 Isbn:2831868009IEC 60749-5:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test Released:1/17/2003 Isbn:2831868009
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IEC 60749-5:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test Released:1/17/2003 Isbn:2831868009
English and French language
13 pages
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Standards Content (Sample)


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Partie 5:
Essai continu de durée de vie sous température
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Semiconductor devices –
Mechanical and climatic test methods –
Part 5:
Steady-state temperature humidity
bias life test
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Mechanical and climatic test methods –
Part 5:
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bias life test
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électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
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IEC
IEC 60749-5:2023(Main)
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition:
a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test;
b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment;
c) replacement of references to “virtual junction” with “die”.

  • Standard
    26 pages
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  • Standard
    17 pages
    English and French language
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IEC
IEC 63287-2:2023(Main)
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile

IEC 63287-2:2023 gives guidelines for the development of reliability qualification plans using the concept of mission profile, based on the environmental conditioning and proposed usage of the product. This document is not intended for military- and space-related applications.

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    30 pages
    English and French language
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IEC
IEC 60749-37:2022(Main)
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

IEC 60749-37:2022 is available as IEC 60749-37:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition:
- correction of a previous technical error concerning test conditions;
- updates to reflect improvements in technology.

  • Standard
    67 pages
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  • Standard
    43 pages
    English and French language
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IEC
IEC 60749-10:2022(Main)
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly

IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.
This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:  
covers both unattached components and components attached to printed wiring boards;
tolerance limits modified for peak acceleration and pulse duration;
mathematical formulae added for velocity change and equivalent drop height.

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    24 pages
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IEC
IEC 60749-28:2022(Main)
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

IEC 60749-28:2022 is available as IEC 60749-28:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-28:2022 establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex J. The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels. This edition includes the following significant technical changes with respect to the previous edition:
- a new subclause and annex relating to the problems associated with CDM testing of integrated circuits and discrete semiconductors in very small packages;
- changes to clarify cleaning of devices and testers.

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    147 pages
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  • Standard
    98 pages
    English and French language
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IEC
IEC 60749-39:2021(Main)
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

IEC 60749-39:2021 is available as IEC 60749-39:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-39:2021 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. This edition includes the following significant technical changes with respect to the previous edition:
- updated procedure for "dry weight" determination.

  • Standard
    38 pages
    English language
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  • Standard
    25 pages
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IEC
IEC 63287-1:2021(Main)
Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification

IEC 63287-1:2021 gives guidelines for reliability qualification plans of semiconductor integrated circuit products. This document is not intended for military- and space-related applications.
NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this guideline adaptation based on EDR-4708, AEC Q100, JESD47 or other relevant document can also be applicable if it is specified.
NOTE 2 The Weibull distribution method used in this document is one of several methods to calculate the appropriate sample size and test conditions of a given reliability project.
This first edition of IEC 63287-1 cancels and replaces the first edition of IEC 60749-43 published in 2017. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
the document has been renamed and renumbered to distinguish it from the IEC 60749 (all parts);
a new section concerning the concept of "family" has been added with appropriate renumbering of the existing text.

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    86 pages
    English and French language
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IEC
IEC 60749-20:2020(Main)
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.

  • Standard
    82 pages
    English language
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  • Standard
    55 pages
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IEC
IEC 60749-30:2020(Main)
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

IEC 60749-30:2020 is available as IEC 60749-30:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3;
- expansion of 6.7 on solder reflow;
- inclusion of explanatory notes and clarifications.

  • Standard
    41 pages
    English language
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  • Standard
    26 pages
    English and French language
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IEC
IEC 60749-41:2020(Main)
Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices

IEC 60749-41:2020 specifies the procedural requirements for performing valid endurance, retention and cross-temperature tests based on a qualification specification. Endurance and retention qualification specifications (for cycle counts, durations, temperatures, and sample sizes) are specified in JESD47 or are developed using knowledge-based methods such as in JESD94.

  • Standard
    44 pages
    English and French language
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