IEC 60749-30:2005/AMD1:2011

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Amendement 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 30: Préconditionnement des composants pour montage en surface non hermétiques avant les essais de fiabilité

General Information

• Status: Published
• Publication Date: 24-May-2011
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 17-Aug-2020

Relations

• Amends: IEC 60749-30:2005 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• Effective Date: 05-Sep-2023
• Revised: IEC 60749-30:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60749-30 ®
Edition 1.0 2011-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Semiconductor devices – Mechanical and climatic test methods –
Part 30: Preconditioning of non-hermetic surface mount devices prior to
reliability testing
Dispositifs à semiconducteurs – Méthodes d'essais mécaniques
et climatiques –
Partie 30: Préconditionnement des composants pour montage en surface non
hermétiques avant les essais de fiabilité

IEC 60749-30:2005/A1:2011
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IEC 60749-30 ®
Edition 1.0 2011-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Semiconductor devices – Mechanical and climatic test methods –
Part 30: Preconditioning of non-hermetic surface mount devices prior to
reliability testing
Dispositifs à semiconducteurs – Méthodes d'essais mécaniques
et climatiques –
Partie 30: Préconditionnement des composants pour montage en surface non
hermétiques avant les essais de fiabilité

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE PRICE CODE
E
CODE PRIX
ICS 31.080.01 ISBN 978-2-88912-506-7

– 2 – 60749-30 Amend. 1  IEC:2011
FOREWORD
This amendment has been prepared by IEC technical committee 47: Semiconductor devices.
The text of this amendment is based on the following documents:
CDV Report on voting
47/2019/CDV 47/2075/RVC
Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________
2 Normative references
Replace the existing fourth reference with the following:
IEC 60749-20:2008, Semiconductor devices – Mechanical and climatic test methods –
Part 20: Resistance of plastic-encapsulated SMDs to the combined effects of moisture and
soldering heat
60749-30 Amend. 1  IEC:2011 – 3 –
4 Test apparatus and materials
4.2 Solder equipment
Replace the existing item d) with the following
d) Wave-solder equipment capable of maintaining the conditions of item 5.4.4 of
IEC 60749-20:2008.
5 Procedure
5.1 General
Replace the final sentence with the following:
However, the soak sequence in 5.5 needs to be consistent with the floor life information in
Tables 1 and 2.
5.5 Soak conditions for dry-packed SMDs
Replace the existing first sentence with the following:
The following soak conditions shall apply.
5.5.1 Method A for dry-packed SMDs in accordance with IEC 60749-20
Replace the existing first sentence with the following :
This test shall be carried out in accordance
...