SIST EN 61760-1:2006
(Main)Surface mounting technology -- Part 1: Standard method for the specification of surface mounting components (SMDs)
Surface mounting technology -- Part 1: Standard method for the specification of surface mounting components (SMDs)
This International Standard gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The object of this standard is to ensure that a wide variety of SMDs (passive and active) can be subjected to the same placement and mounting processes during assembly. This standard defines tests and requirements that need to be part of any SMD component general, sectional or detail specification. In addition, this standard provides component users and manufacturers with a reference set of typical process conditions used in surface mount technology. The main changes with regard to EN 61760-1:1998 concern: - requirements related to leadfree soldering; - extension of the scope to include also components mounted by gluing; - direct reference to EN 60068-2-58 for requirements on solderability and resistance to soldering heat; - classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.
Oberflächenmontagetechnik -- Teil 1: Genormtes Verfahren zur Spezifizierung oberflächenmontierbarer Bauelemente (SMDs)
Technique du montage en surface -- Partie 1: Méthode de normalisation pour la spécification des composants montés en surface (CMS)
IEC 61760-1:2006-04(en-fr) fournit un ensemble de références indiquant les conditions de processus ainsi que les conditions d'essai correspondantes à utiliser lors de l'élaboration de spécifications de composants électroniques destinés à être utilisés pour la technologie de montage en surface. Les modifications principales par rapport à l'édition précédente sont les suivantes:
- exigences relatives au brasage sans plomb;
- extension du domaine d'application destinée à inclure également les composants montés par collage;
- référence directe à la CEI 60068-2-58 pour les exigences relatives à la brasabilité et à la résistance à la chaleur de brasage;
- la classification en catégories basée sur la capacité des composants à supporter la résistance à la chaleur de brasage a été supprimée.
Tehnologija površinske montaže - 1. del: Standardna metoda za specifikacijo komponent za površinsko montažo (SMDs) (IEC 61760-1:2006)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 61760-1:2006
01-december-2006
1DGRPHãþD
SIST EN 61760-1:2001
Tehnologija površinske montaže - 1. del: Standardna metoda za specifikacijo
komponent za površinsko montažo (SMDs) (IEC 61760-1:2006)
Surface mounting technology -- Part 1: Standard method for the specification of surface
mounting components (SMDs)
Oberflächenmontagetechnik -- Teil 1: Genormtes Verfahren zur Spezifizierung
oberflächenmontierbarer Bauelemente (SMDs)
Technique du montage en surface -- Partie 1: Méthode de normalisation pour la
spécification des composants montés en surface (CMS)
Ta slovenski standard je istoveten z: EN 61760-1:2006
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
SIST EN 61760-1:2006 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN 61760-1:2006
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SIST EN 61760-1:2006
EUROPEAN STANDARD
EN 61760-1
NORME EUROPÉENNE
July 2006
EUROPÄISCHE NORM
ICS 31.240 Supersedes EN 61760-1:1998
English version
Surface mounting technology
Part 1: Standard method for the specification of
surface mounting components (SMDs)
(IEC 61760-1:2006)
Technique du montage en surface Oberflächenmontagetechnik
Partie 1: Méthode de normalisation pour Teil 1: Genormtes Verfahren zur
la spécification des composants montés Spezifizierung oberflächenmontierbarer
en surface (CMS) Bauelemente (SMDs)
(CEI 61760-1:2006) (IEC 61760-1:2006)
This European Standard was approved by CENELEC on 2006-06-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61760-1:2006 E
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SIST EN 61760-1:2006
EN 61760-1:2006 - 2 -
Foreword
The text of document 91/577/FDIS, future edition 2 of IEC 61760-1, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61760-1 on 2006-06-01.
This European Standard supersedes EN 61760-1:1998.
The main changes with regard to EN 61760-1:1998 concern:
- requirements related to leadfree soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to EN 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering
heat has been deleted.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2007-03-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2009-06-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61760-1:2006 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-1 NOTE Harmonized as EN 60068-1:1994 (not modified).
IEC 60068-2-69 NOTE Harmonized as EN 60068-2-69:1996 (not modified).
__________
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SIST EN 61760-1:2006
- 3 - EN 61760-1:2006
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60062 (mod) - Marking codes for resistors and capacitors EN 60062 2005
IEC 60068 Series Environmental testing EN 60068 Series
1) 2)
IEC 60068-2-21 - Environmental testing EN 60068-2-21 1999
Part 2-21: Tests - Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-45 1980 Environmental testing EN 60068-2-45 1992
+ A1 1993 Part 2: Tests - Test Xa and guidance: + A1 1993
Immersion in cleaning solvents
1) 2)
IEC 60068-2-58 - Environmental testing EN 60068-2-58 2004
Part 2-58: Tests - Test Td: Test methods for
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
1) 2)
IEC 60068-2-77 - Environmental testing EN 60068-2-77 1999
Part 2-77: Tests - Test 77: Body strength and
impact shock
IEC 60191-6 2004 Mechanical standardization of semiconductor EN 60191-6 2004
devices
Part 6: General rules for the preparation of
outline drawings of surface mounted
semiconductor device packages
1) 2)
IEC 60194 - Printed board design, manufacture and EN 60194 2006
assembly - Terms and definitions
1) 2)
IEC 60286-3 - Packaging of components for automatic EN 60286-3 1998
handling
Part 3: Packaging of surface mount
components on continuous tapes
1) 2)
IEC 60286-4 - Packaging of components for automatic EN 60286-4 1998
handling
Part 4: Stick magazines for electronic
components encapsulated in packages of
form E and G
1)
Undated reference.
2)
Valid edition at date of issue.
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SIST EN 61760-1:2006
EN 61760-1:2006 - 4 -
Publication Year Title EN/HD Year
1) 2)
IEC 60286-5 - Packaging of components for automatic EN 60286-5 2004
handling
Part 5: Matrix trays
1) 2)
IEC 60286-6 - Packaging of components for automatic EN 60286-6 2004
handling
Part 6: Bulk case packaging for surface
mounting components
IEC 60749 Series Semiconductor devices - Mechanical and EN 60749 Series
climatic test methods
1) 2)
IEC 61340-5-1 - Electrostatics EN 61340-5-1 2001
Part 5-1: Protection of electronic devices from
electrostatic phenomena - General
requirements
1) 2)
IEC 61760-2 - Surface mounting technology EN 61760-2 1998
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) -
Application guide
1) 2)
IEC 62090 - Product package labels for electronic EN 62090 2003
components using bar code and two-
dimensional symbologies
1)
ISO 8601 - Data elements and interchange formats - - -
Information interchange - Representation of
dates and times
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SIST EN 61760-1:2006
INTERNATIONAL IEC
STANDARD 61760-1
Second edition
2006-04
Surface mounting technology –
Part 1:
Standard method for the specification
of surface mounting components (SMDs)
IEC 2006 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale U
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
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SIST EN 61760-1:2006
– 2 – 61760-1 IEC:2006(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope and object .7
1.1 Scope.7
1.2 Object .7
2 Normative references.7
3 Terms and definitions .8
4 Requirements for component design and component specifications.10
4.1 General requirement.10
4.2 Packaging .10
4.3 Labelling of product packaging.10
4.4 Component marking .11
4.5 Storage and transportation.12
4.6 Component outline and design.12
4.7 Mechanical stress.16
4.8 Component reliability assurance .16
4.9 Additional requirements for compatibility with lead-free soldering .16
5 Specification of assembly process conditions .16
5.1 General .16
5.2 Securing the component on the substrate prior to soldering.18
5.3 Mounting methods .19
5.4 Cleaning (where applicable).20
5.5 Removal and/or replacement of SMDs .21
6 Typical process conditions .22
6.1 Soldering processes, temperature/time profiles .22
6.2 Typical cleaning conditions for assemblies .26
7 Requirements for components and component specifications related to suitability
with various mounting processes.27
7.1 General .27
7.2 Wettability .27
7.3 Resistance to dissolution of metallization .27
7.4 Resistance to soldering heat.27
7.5 Resistance to cleaning solvent.28
7.6 Soldering profiles.28
7.7 Bonding strength test for the component glue interface test.28
Bibliography .30
Figure 1 – Example of a component with marked specific orientation put in tape and tray.11
Figure 2 – Vacuum pipette, pick-up area and component compartment:
Example for a component with a flat surface.13
Figure 3 – Coplanarity of terminals .13
Figure 4 – Stable seating of component.14
Figure 5 – Unstable seating of component.14
Figure 6 – Terminals arranged peripherally in two rows.14
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SIST EN 61760-1:2006
61760-1 IEC:2006(E) – 3 –
Figure 7 – Good contrast to component body and surroundings .14
Figure 8 – Component weight/pipette suction strength .15
Figure 9 – Process steps for soldering.17
Figure 10 – Process steps for gluing.18
Figure 11 – SnPb Vapour phase soldering – Temperature/time profile
(terminal temperature).22
Figure 12 – Lead-free SnAgCu Vapour phase soldering – Temperature/time profile
(terminal temperature).23
Figure 13 – Infrared soldering, forced gas convection reflow soldering –
Temperature/time profile for SnPb solders.24
Figure 14 – Infrared soldering, forced gas convection reflow soldering –
Temperature/time profile for lead-free SnAgCu solders.25
Figure 15 – Double wave soldering for SnPb and lead-free SnAgCu solder –
Temperature/time profile (terminal temperature).26
Table 1 – Basic cleaning processes.26
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SIST EN 61760-1:2006
– 4 – 61760-1 IEC:2006(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
SURFACE MOUNTING TECHNOLOGY –
Part 1: Standard method for the specification
of surface mounting components (SMDs)
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61760-1 has been prepared by IEC technical committee 91: Surface
mounting technology.
This second edition cancels and replaces the first edition, published in 1998, and constitutes a
technical revision.
The main changes with regard to the previous edition concern:
− requirements related to leadfree soldering;
− extension of the scope to include also components mounted by gluing;
− direct reference to IEC 60068-2-58 for requirements on solderability and resistance to
soldering heat;
− classification into categories based on the component's ability to withstand resistance to
soldering heat has been deleted.
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SIST EN 61760-1:2006
61760-1 IEC:2006(E) – 5 –
The text of this standard is based on the following documents:
FDIS Report on voting
91/577/FDIS 91/588/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
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SIST EN 61760-1:2006
– 6 – 61760-1 IEC:2006(E)
INTRODUCTION
Specifications for electronic components have in the past been formulated for each component
family. The regulations for environmental tests have been selected from IEC 60068 and other
IEC and ISO publications. The overriding condition for this procedure was that all components,
once installed in a piece of equipment, had to satisfy certain criteria.
The introduction and increasing use of surface mounting components make it necessary to
extend the existing requirements to include those arising from processing during assembly.
Irrespective of the component family involved, all components on one and the same side of a
printed circuit board are exposed to the same mounting process (see flow charts in Clause 5).
Nevertheless there exists no harmonized standard that prescribes the content of a component
specification. It is the purpose of this standard to define the general requirements for
component specifications derived from the assembly processes. This is done in three steps.
In the first step general requirements for component specifications and component design
related to the handling and placement of the component on the substrate are given (Clause 4).
In the second step the definition of reference process conditions as representative of a group
of assembly conditions are given (Clauses 5 and 6).
In the third step the additional requirements resulting from these reference process conditions
are given (Clause 7).
Mixed technology boards, i.e. boards containing through-hole components and SMDs, require
additional consideration with respect to the through-hole components. These may be subject to
the same requirements as the SMDs. Persons responsible for drafting specifications for “non-
surface mounting components” wishing to include a statement on their ability to withstand
surface mounting conditions should use the classifications and tests set out in the present
standard.
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SIST EN 61760-1:2006
61760-1 IEC:2006(E) – 7 –
SURFACE MOUNTING TECHNOLOGY –
Part 1: Standard method for the specification
of surface mounting components (SMDs)
1 Scope and object
1.1 Scope
This International Standard gives a reference set of process conditions and related test
conditions to be used when compiling component specifications of electronic components that
are intended for usage in surface mount technology.
1.2 Object
The object of this standard is to ensure that a wide variety of SMDs (passive and active) can be
subjected to the same placement and mounting processes during assembly. This standard
defines tests and requirements that need to be part of any SMD component general, sectional
or detail specification. In addition, this standard provides component users and manufacturers
with a reference set of typical process conditions used in surface mount technology.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60062, Marking codes for resistors and capacitors
IEC 60068 (all parts), Environmental testing
IEC 60068-2-21, Environmental testing – Part 2: Tests – Test U: Robustness of terminations and
integral mounting devices
IEC 60068-2-45:1980, Environmental testing – Part 2: Tests – Test XA and guidance: Immersion
in cleaning solvents
Amendment 1 (1993)
IEC 60068-2-58, Environmental testing – Part 2: Tests – Test Td: Test methods for solderability,
resistance to dissolution of metallization and to soldering heat of surface mounting devices
(SMDs)
IEC 60068-2-77, Environmental testing – Part 2: Tests – Test 77: Body strength and impact shock
IEC 60191-6:2004, Mechanical standardization of semiconductor devices – Part 6: General
rules for the preparation of outline drawings of surface mounted semiconductor device
packages
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 60286-3, Packaging of components for automatic handling – Part 3: Packaging of surface
mount components on continuous tapes
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SIST EN 61760-1:2006
– 8 – 61760-1 IEC:2006(E)
IEC 60286-4, Packaging of components for automatic handling – Part 4: Stick magazines for
electronic components encapsulated in packages of form E and G
IEC 60286-5, Packaging of components for automatic handling – Part 5: Matrix trays
IEC 60286-6, Packaging of components for automatic handling – Part 6: Bulk case packaging
for surface mounting components
IEC 60749 (all parts), Semiconductor devices – Mechanical and climatic test methods
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC 61340-5-3, Electrostatics – Protection of electronic devices from electrostatic phenomena
– Test methods for packagings intended for electrostatic discharge sensitive devices
IEC 61760-2, Surface mount technology – Part 2: Transportation and storage conditions of
surface mounting devices (SMD) – Application guide
IEC 62090, Product package labels for electronic components using bar code and two
dimensional symbologies
ISO 8601, Data elements and interchange formats – Information interchange – Representation
of dates and times
3 Terms and definitions
For the purposes of this document, the following definitions apply, as do those of IEC 60194.
NOTE Use of the term “chip” as for a surface mounting component is deprecated. Only the terms "SMD" or
"surface mounting component" should be used within IEC.
3.1
adhesive
substance such as glue or cement used to bond objects together
NOTE In surface mounting technology different gluing systems are used.
− Non conductive adhesive (only for mechanical connection)
− Electrical conductive adhesive (for electrical and mechanical connection)
− Thermal conductive adhesive (for thermal and mechanical connection)
− Combination of electrical and thermal conductive adhesive.
Most used adhesives are thermal curing systems but there are also UV-curing systems in use.
3.2
centring force
force required by the pick-up tooling to centre a surface mounting device in its proper location
on a substrate
3.3
coplanarity
distance in height between the lowest and highest leads when the component is in its seating
plane
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SIST EN 61760-1:2006
61760-1 IEC:2006(E) – 9 –
3.4
dewetting
condition that results when molten solder coats a surface and then recedes to leave irregularly-
shaped mounds of solder that are separated by areas that are covered with a thin film of solder
and with the basis metal not exposed
3.5
dissolution of metallization
process of dissolving metal or a plated metal alloy, usually by introduction of chemicals. For the
purpose of this document the dissolution of metallization also includes dissolution by exposure
to molten solder
3.6
immersion attitude
positioning of an object when immersed in a solder bath
3.7
lead-free component
component where lead content in the materials is equal or less than 0,1 % by weight per
material used
3.8
Montreal protocol
agreement by industrialized nations, at a meeting held in Montreal, Canada, to eliminate
chlorofluorocarbons from all processes by 1995
3.9
pick-up force
dynamic force exerted on the body of a component – generally from above – and its seating
plane during the pick-up of the component (e.g. from a tape or tray); the maximum level is
normally taken into account
3.10
placement force
dynamic force exerted on the component body – generally from above – and its seating plane
NOTE This occurs during the period between the component’s first contact with the substrate (or the soldering
paste or adhesive etc.) and its coming to rest. The maximum level is normally taken into account.
3.11
resistance to soldering heat
ability of a component to withstand the effects of the heat generated by the soldering process
3.12
seating plane
surface on which a component rests
3.13
solderability
ability of a metal to be wetted by molten solder
3.14
solder meniscus
contour of a solder shape that is the result of the surface tension forces that take place during
wetting
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SIST EN 61760-1:2006
– 10 – 61760-1 IEC:2006(E)
3.15
stand-off
distance between seating plane of the component and the seating plane of the terminations
3.16
substrate
basic material, forming the support structure of an electronic circuit
3.17
surface mounting component
electronic component designed for mounting on to terminal pads or conducting tracks on the
surface of substrate
3.18
wetting
physical phenomenon in which surface tension of a liquid, usually when in contact with solids,
is reduced to the point where the liquid diffuses and makes intimate contact with the entire
substrate surface in the form of a thin layer
4 Requirements for
...
SLOVENSKI OSIST prEN 61760-1:2004
PREDSTANDARD
julij 2004
Surface mounting technology -- Part 1: Standard method for the specification of
surface mounting components (SMDs)
ICS 31.020 Referenčna številka
OSIST prEN 61760-1:2004(en)
© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno
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91/454/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJET DE COMITÉ POUR VOTE (CDV)
Project number 91/61760-1/Ed.2
Numéro de projet
IEC/TC or SC: Date of circulation Closing date for voting (Voting
91
Date de diffusion mandatory for P-members)
CEI/CE ou SC:
Date de clôture du vote (Vote
2004-05-21
obligatoire pour les membres (P))
2004-10-22
Titre du CE/SC: TC/SC Title: Electronics Assembly Technology
Secretary: Mr. Setsuo HARADA (Japan)
Secrétaire: E-mail: setsuo.harada@jp.sony.com
Also of interest to the following committees Supersedes document
Intéresse également les comités suivants Remplace le document
91/380/CD - 91/429/CC
Functions concerned
Fonctions concernées
Safety EMC Environment Quality assurance
Sécurité
CEM Environnement Assurance qualité
CE DOCUMENT EST TOUJOURS À L'ÉTUDE ET SUSCEPTIBLE DE THIS DOCUMENT IS STILL UNDER STUDY AND SUBJECT TO CHANGE. IT
MODIFICATION. IL NE PEUT SERVIR DE RÉFÉRENCE. SHOULD NOT BE USED FOR REFERENCE PURPOSES.
LES RÉCIPIENDAIRES DU PRÉSENT DOCUMENT SONT INVITÉS À RECIPIENTS OF THIS DOCUMENT ARE INVITED TO SUBMIT, WITH THEIR
PRÉSENTER, AVEC LEURS OBSERVATIONS, LA NOTIFICATION DES COMMENTS, NOTIFICATION OF ANY RELEVANT PATENT RIGHTS OF
DROITS DE PROPRIÉTÉ DONT ILS AURAIENT ÉVENTUELLEMENT WHICH THEY ARE AWARE AND TO PROVIDE SUPPORTING
CONNAISSANCE ET À FOURNIR UNE DOCUMENTATION EXPLICATIVE. DOCUMENTATION.
Title :
Titre :
IEC 61760-1, Ed.2: Surface mounting
technology - Part 1: Standard method for the
specification of surface mounting components
(SMDs)
Note d'introduction Introductory note
French version will be circulated later
La version française sera diffusée
ultérieurement.
ATTENTION ATTENTION
CDV soumis en parallèle au vote (CEI) Parallel IEC CDV/CENELEC Enquiry
et à l’enquête (CENELEC)
FORM CDV (IEC)
2002-01-15
---------------------- Page: 2 ----------------------
61760-1 Ed.1 /CDV © IEC 2
SURFACE MOUNTING TECHNOLOGY –
Part 1: Standard method for the specification
of surface mounting components (SMDs)
CONTENTS
Page
FOREWORD.7
INTRODUCTION.9
Clause
1 Scope of the present standard.6
2 Normative references .6
3 Definitions.7
4 Requirements for component design and component specifications. .9
4.1 General Requirement .9
4.2 Packaging.9
4.3 Labeling of product packaging.10
4.4 Component marking.10
4.5 Storage and transportation. .10
4.6 Component outline and design. .10
4.7 Mechanical stress .14
4.8 Component reliability assurance.14
4.9 Additional requirements for compatibility with leadfree soldering .15
5 Specification of assembly process conditions .15
5.1 General.15
5.2 Securing the component on the substrate prior to soldering .16
5.3 Mounting methods.17
5.4 Cleaning (where applicable) .18
5.5 Removal and/or replacement of SMDs.19
6 Typical process conditions.20
6.1 Soldering processes, temperature/time profiles .20
6.2 Typical cleaning conditions for assemblies .24
7 Requirements for components and component specifications related to suitability with
various mounting processes.25
7.1 General.25
7.2 Wettability.25
7.3 Resistance to dissolution of metallization .25
7.4 Resistance to soldering heat .25
7.5 Resistance to cleaning solvent .26
7.6 Soldering Profiles.26
7.7 Bonding strength test for the component glue interface test .26
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61760-1 Ed.2 /CDV © IEC 3
List of figures and table.
Fig. 1 – Example of a component with marked specific orientation put in tape and tray.9
Fig. 2 – Vacuum pipette, pick-up area and component compartment.11
Fig. 3 – Coplanarity of terminals .12
Fig. 4 – Stable seating of component.12
Fig. 5 – Unstable seating of component.12
Fig. 6 – Terminals arranged peripherally in two rows.13
Fig. 7 – Good contrast to component body and surroundings .13
Fig. 8 – Component weight/pipette suction strength .14
Fig. 9 – Process steps for soldering.15
Fig. 10 – Process steps for gluing .16
Fig. 11 – SnPb Vapour phase soldering,– Temperature/time profile (terminal temperature) .20
Fig. 12 – Leadfree SnAgCu Vapour phase soldering,– Temperature/time profile (terminal
temperature).21
Fig. 13 – Infrared soldering, forced gas convection reflow soldering – Temperature/time profile
for SnPb solders (terminal temperature).22
Fig. 14 – Infrared soldering, forced gas convection reflow soldering – Temperature/time profile
for Leadfree SnAgCu solders (terminal temperature).23
Fig. 15 – Double wave soldering for SnPb and Leadfree SnAgCu solder– Temperature/time
profile (terminal temperature).24
Table 1 – Basic cleaning processes 24
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61760-1 Ed.2 /CDV © IEC 4
INTERNATIONAL ELECTRO-TECHNICAL COMMISSION
___________
SURFACE MOUNTING TECHNOLOGY –
Part 1: Standard method for the specification
of surface mounting components (SMDs)
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To this
end and in addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to
technical committees; any IEC National Committee interested in the subject dealt with may participate in this
preparatory work. International, governmental and non-governmental organizations liaising with the IEC also
participate in this preparation. The IEC collaborates closely with the International Organization for Standardization
(ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation from
all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical reports or guides and they are accepted by the National Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any divergence
between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the
latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61760-1 has been prepared by IEC technical committee 91: Surface
mounting technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/134/FDIS 91/145/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
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61760-1 Ed.2 /CDV © IEC 5
(IEC 61760-1: 1998
Revision: 2003)
INTRODUCTION
Specifications for electronic components have in the past been formulated for each component
family. The regulations for environmental tests have been selected from IEC 60068 and other
IEC and ISO publications. The overriding condition for this procedure was that all components,
once installed in a piece of equipment, had to satisfy certain criteria.
The introduction and increasing use of surface mounting components make it necessary to
extend the existing requirements to include those arising from processing during assembly.
Irrespective of the component family involved, all components on one and the same side of a
printed circuit board are exposed to the same mounting process (see flow charts in Section 5).
Nevertheless there exists no harmonized standard that prescribes the content of a component
specification. It is the purpose of this standard to define the general requirements for
component specifications derived from the assembly processes. This is done in three steps.
In the first step general requirements for component specifications and component design
related to the handling and placement of the component on the substrate are given (chapter 4).
In the second step the definition of reference process conditions as representative of a group
of assembly conditions are given (Section 5 and 6).
In the third step the additional requirements resulting from these reference process conditions
are given (Section 7).
In the revised edition of 2002 besides maintenance editing following changes have been
implemented:
− Requirements related to leadfree soldering.
− Extension of the scope to include also components mounted by gluing.
− Direct reference to IEC 60068-2-58 for requirements on solderability and resistance to
soldering heat.
− The classification in categories based on the components ability to withstand resistance to
soldering heat has been deleted.
Mixed technology boards, i.e. boards containing through-hole components and SMDs, require
additional consideration with respect to the through-hole components. These may be subject to
the same requirements as the SMDs. Persons responsible for drafting specifications for “non-
surface mounting components” wishing to include a statement on their ability to withstand
surface mounting conditions should use the classifications and tests set out in the present
standard.
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61760-1 Ed.2 /CDV © IEC 6
1 Scope of the present standard
Scope
The scope of this standard is all specifications of electronic components that are intended for
usage in surface mount technology.
Purpose
The purpose of this standard is to ensure that a wide variety of SMDs (passive and active) can
be subjected to the same placement and mounting processes during assembly. Hereto this
standard defines test and requirements that need to be part of any SMD component general,
sectional or detail specification. Further this standard provides component users and
manufacturers with a reference set of typical process conditions used in surface mount
technology.
2 Normative references
The following normative documents contain provisions that, through references contained in
this text, constitute an integral part of IEC 61760-1. The versions indicated below were valid at
the time of publication of this standard. All standards are subject to revision, and parties to
agreements based on this section of IEC 61760-1are therefore requested to verify whether it is
possible to apply the most recent versions of the standards listed below. Members of IEC and
ISO maintain registers of currently valid International Standards.
IEC 60062, Marking codes for resistors and capacitors
IEC 60068 (all parts), Environmental testing
IEC 60068-1, Environmental testing – Part 1: General and guidance
IEC 60068-2-20, Environmental testing – Part 2: Tests – Test T: Soldering
IEC 60068-2-21, Environmental testing – Part 2: Tests – Test U: Robustness of terminations and
integral mounting devices
IEC 60068-2-45,Environmental testing – Part 2: Tests – Test XA and guidance:
Immersion in cleaning solvents
IEC 60068-2-77, Resistance to body impact force
IEC 60068-2-58, FDIS 2003 Environmental testing – Part 2: Tests – Test Td: Solderability,
resistance to dissolution of metallization and to soldering heat of surface mounting devices
(SMDs)
IEC 60068-2-69, Environmental testing – Part 2: Tests – Test Te: Solderability testing of
electronic components for surface mounting technology by the wetting balance method
IEC 60191-6,Mechanical standardization of semiconductor devices – Part 6: General rules for
the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60194, Terms and definitions for printed circuits
IEC 60286-3, Packaging of components for automatic handling – Part 3: Packaging of leadless
components on continuous tapes
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61760-1 Ed.2 /CDV © IEC 7
IEC 60286-4, Packaging of components for automatic handling – Part 4: Stick magazines for
electronic components encapsulated in packages of form E and G
IEC 60286-5, Packaging of components for automatic handling – Part 5: Matrix trays
IEC 60286-6,Packaging of components for automatic handling – Part 6: Bulk Case Packaging
for surface mounting components
IEC 60749 (all parts), Semiconductor devices- Mechanical and climatic test methods
IEC 61340-5-1, Electrostatics - Part 5-1: Protection of electronic devices from electrostatic
phenomena - General requirements
IEC 61340-5-3, Electrostatics - Protection of electronic devices from electrostatic phenomena -
Test methods for packagings intended for electrostatic discharge sensitive devices
IEC 61760-2, Application guide for transportation and storage conditions of surface mounting
devices
IEC 62090, Product Package Labels For Electronic Components Using Bar Code and Two
Dimensional Symbologies
ISO 8601, Data elements and interchange formats -- Information interchange -- Representation
of dates and times
3 Definitions
For the purpose of this standard, the following definitions apply, as also do those of IEC 60194.
NOTE – Use of the term “chip” as for a surface mounting component is deprecated. Only the
terms "SMD" or "surface mounting component" should be used within IEC.
3.1 Adhesive
A substance such as glue or cement used to bond objects together. In surface mounting
technology different gluing systems are used.
− Non conductive adhesive (only for mechanical connection)
− Electrical conductive adhesive (for electrical and mechanical connection)
− Thermal conductive adhesive (for thermal and mechanical connection)
− Combination of electrical and thermal conductive adhesive.
Most used adhesives are thermal curing systems but there are also UV-curing systems in use.
3.2 Centring force
The force required by the pick-up tooling to center a surface mounting device in its proper
location on a substrate.
3.3 Coplanarity
The distance in height between the lowest and highest leads when the component is in its
seating plane.
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61760-1 Ed.2 /CDV © IEC 8
3.4 Dewetting
A condition that results when molten solder coats a surface and then recedes to leave
irregularly-shaped mounds of solder that are separated by areas that are covered with a thin
film of solder and with the basis metal not exposed.
3.5 Dissolution of metallization
The process of dissolving metal or a plated metal alloy, usually by introduction of chemicals.
For the purpose of this document the dissolution of metallization also includes dissolution by
exposure to molten solder.
3.6 Immersion attitude
The positioning of an object when immersed in a solder bath.
3.7 Leadfree component
A component is defined as leadfree, when the lead content in the materials is equal or less
than 0,1 % by weight per material used.
3.8 Montreal Protocol
An agreement by industrialized nations, at a meeting held in Montreal, Canada, to eliminate
chlorofluorocarbons from all processes by 1995.
3.9 Pick-up force
A dynamic force exerted on the body of a component – generally from above – and its seating
plane during the pick-up of the component (e.g. from a tape or tray). The maximum level is
normally taken into account.
3.10 Placement force
A dynamic force exerted on the body of a component body – generally from above – and its
seating plane. This occurs during the period between the component’s first contact with the
substrate (or the soldering paste or adhesive etc.) and its coming to rest. The maximum level is
normally taken into account.
3.11 Resistance to soldering heat
The ability of a component to withstand the effects of the heat generated by the soldering
process.
3.12 Seating plane
The surface on which a component rests.
3.13 Solderability
The ability of a metal to be wetted by molten solder.
3.14 Solder meniscus
The contour of a solder shape that is the result of the surface tension forces that take place
during wetting.
3.15 Stand off
The distance between seating plane of the component and the seating plane of the
terminations.
3.16 Substrate
The basic material, forming the support structure of an electronic circuit.
3.17 Surface mounting component
An electronic component designed for mounting on to terminal pads or conducting tracks on
the surface of substrate.
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61760-1 Ed.2 /CDV © IEC 9
3.18 Wetting
A physical phenomenon in which surface tension of a liquid, usually when in contact with
solids, is reduced to the point where the liquid diffuses and makes intimate contact with the
entire substrate surface in the form of a thin layer.
4 Requirements for component design and component specifications
4.1 General Requirement
A component specification for SMDs shall, in addition to the requirements listed in Sections 4.2
to 4.10 below, contain specifications of the relevant tests and requirements from Section 7.
4.2 Packaging
Information about the packaging form including packaging dimensions, data on clearances
within the packaging shall be included in the component specification.
Component specifications shall require that, packaging for SMD applications in tapes, on reels,
in stick magazines, on tray, bulk case, or in bulk, shall comply with the relevant specification of
the IEC 60286 series (IEC 60286-3, IEC 60286-4,IEC 60286-5,IEC 60286-6).
Components that need to be entered into ESD protected production environment shall be
packaged accordingly in line with IEC 61340-5-1 and IEC 61340-5-3.
Moisture sensitive components need special packaging in line with IEC 60749.
Components with specific orientation or polarity shall be placed in the packaging with a fixed
orientation (e.g. see fig.1).
D
i
r
e
c
t
i
o
n
PIN 1
Tray
PIN 1
Fig. 1 – Example of a component with marked specific orientation put in tape and tray
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61760-1 Ed.2 /CDV © IEC 10
4.3 Labelling of product packaging
Labelling of the product packaging shall comply with ISO/IEC 62090 (2002-11): Product
Package Labels for electronic components using bar code and two dimensional symbologies.
According to IEC 62090 the product packaging shall include the following:
a)item identification (e.g. customer part number or manufacturer part number or both)
b)traceability identification (e.g. batch number or serial number)
c)quantity.
Additional to the requirements of IEC 62090 this standard prescribes that the product
packaging for moisture sensitive components shall include the following:
d)moisture sensitivity level (MSL) according to amendment 2 of IEC 60749 (IEC 60749–am2
(2001-10))
Additional to the requirements of IEC 62090 this standard recommends that the product
packaging should include the following:
e)date code (ISO 8601, and IEC 60062)
f)identification code for the manufacturer.
g) Description of the polarity of the component, if applicable.
4.4 Component marking
4.4.1 Marking of multipin components
Pin 1 (see figure 1) shall be clearly marked on a multipin component (e.g. SO-IC, QFP).
4.4.2 Marking of components with polarity
For components with polarity the polarity of the component shall be clearly marked on the
component (e.g. for Electrolytic capacitors).
4.4.3 Durability of component marking
Specifications shall require that the specified component marking shall remain legible after the
test specified in 7.5.2 has been performed. This test shall be performed after completion of the
relevant test for resistance to soldering heat or for solderability, as specified in the component
specification.
4.5 Storage and transportation
Component specifications shall refer for storage and transportation conditions to IEC 61760-2:
Application guide for transportation and storage conditions of Surface mounting devices (SMD).
The component specification shall contain information of the maximum period for storage.
Within this period the component shall comply with its specification.
4.6 Component outline and design
4.6.1 Drawing and specification
An inverted-plan view of the component showing all dimensions and tolerances of its body and
terminals shall be part of the component specification. The plan shall include reference to the
positioning of the component body and terminals on the mounting land pattern.
Where necessary (e.g. in the case of mechanically fixed components with an overall length of
more than 25 mm), the detail specification shall contain data on thermal expansion, at least
along the X and Y axes.
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61760-1 Ed.2 /CDV © IEC 11
4.6.2 Pick-up area requirements
Design of the component shall take in account that it shall be possible to grip the component
by suction and transport it to the exact placement position on the substrate. It shall be possible
to create a vacuum strong enough to fix the component in its position under the pipette. During
the total transport process, which may include optical inspection, the component shall remain
exactly in its position under the pipette, until the component is placed.
The centre of the suction area should match the centre of gravity and the geometrical centre.
The opening of the pipette (Y), the dimension (L) of the component or its pick up area (X) and
the tolerances on the position of the component inside the compartment of packaging with
length dimension (A ) and width dimension (B ) shall match in such a way, that the vacuum
0 0
needed for pick up can be created. It shall be possible to apply the vacuum irrespective of the
component’s position in its compartment.
For further requirements to the position of the component inside the packaging, see IEC
60286-3 for taping and IEC 60286-5 for matrix trays.
Note: Dimension L may be the length or the width of the component, as applicable.
Requirement: X-Y > Z
Z = (Z + Z ) = (A - L)
1 2 0
Z = (Z + Z ) = (B - L)
1 2 0
pipette
Y
Component compartment
X
Z Z
1 2
component
L
A or B
0 0
Fig. 2 – Vacuum pipette, pick-up area and component compartment: Example for a component
with a flat surface.
4.6.3 Bottom surface requirements
In cases where the component is to be bonded to the substrate with adhesive, its lower surface
(except for the terminals) must be capable of retaining the applied adhesive.
The stand-off between the lower surface of bonded components and the seating plane shall be
specified. The detail specification shall state the maximum stand-off. Normally a value of 0.3
mm should not be exceeded.
For components which are fixed by an additional fixing adhesive or in case a cleaning process
is used the minimum stand-off should be included in the component specification, because with
use of the additional fixing adhesive all pins have to be inside the material for the electrical
connection (solder paste or conductive adhesive).
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61760-1 Ed.2 /CDV © IEC 12
4.6.4 Requirements to terminals
4.6.4.1 Coplanarity
Detail specifications of multipin components intended for reflow soldering/ conductive gluing
shall state the coplanarity of the lower surfaces of all terminals in accordance with Section 2.5
of IEC 60191-6. Typical value of coplanarity needed for reflow soldering is 0,1 mm – 0,15 mm,
but depends on the size of the component and the thickness of printed solder. The components
terminals shall be sufficiently coplanar to ensure that contact is made with the solder on the
solder surfaces after solder printing or with the conductive adhesive. Detail specifications of
two pin components for mounting with conductive adhesive shall state the coplanarity of both
terminals in relation to the bottom surface of the component.
Fig. 3 – Coplanarity of terminals
4.6.4.2 Arrangement of terminals
The terminals shall be arranged in such a way that stable seating in the solder paste or glue is
ensured and tilting is avoided.
Solder paste
Fig. 4 – Stable seating of component
Fig. 5 – Unstable seating of component
Note: The land pattern of the component and its contacts must be analysed by the placement
machine. The terminals should be preferably arranged peripherally or otherwise symmetrically.
Asymmetrical arrangements of terminals can cause problems, because the identification
algorithms are not always capable of identifying asymmetrical structures. For small sized
components symmetrical terminals are needed to prevent tombstoning.
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61760-1 Ed.2 /CDV © IEC 13
Fig. 6 – Terminals arranged peripherally in two rows
4.6.4.3 Optical recognition
The optical contrast between the terminal bottom surface and the component bottom surface
shall be high enough to enable optical recognition of the position of the terminals, seen from
the bottom side. Preferably the terminal bottom surface should be reflecting (see figure 7).
Fig. 7 – Good contrast to component body and surroundings
4.6.4.4 Shape of the terminals.
The shape of the contact shall comply with that defined in the componen
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