Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)

Supersedes Clause 1 of Chapter 2 of EN 60749:1999

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren -- Teil 14: Festigkeit der Bauelementeanschlüsse (Unversehrtheit der Anschlüsse)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques -- Partie 14: Robustesse des sorties (intégrité des connexions)

Fournit plusieurs essais pour la détermination de l'intégrité entre l'interface connexion/boîtier et la connexion elle-même lorsque la ou les connexions sont pliées en raison d'un assemblage incorrect de carte suivi d'une retouche de la partie concernée pour un nouvel assemblage. Applicable à tous les dispositifs à montage par trous traversants et à montage en surface exigeant que l'utilisateur forme la connexion.

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003)

General Information

Status
Published
Publication Date
30-Jun-2004
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
01-Jul-2004
Due Date
01-Jul-2004
Completion Date
01-Jul-2004

RELATIONS

Buy Standard

Standard
SIST EN 60749-14:2004
English language
17 pages
sale 10% off
Preview
sale 10% off
Preview

e-Library read for
1 day

Standards Content (sample)

SLOVENSKI SIST EN 60749-14:2004
STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 14:
Robustness of terminations (lead integrity) (IEC 60749-14:2003)
ICS 31.080.01 Referenčna številka
SIST EN 60749-14:2004(en)

© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

---------------------- Page: 1 ----------------------
EUROPEAN STANDARD EN 60749-14
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2003
ICS 31.080.01
English version
Semiconductor devices -
Mechanical and climatic test methods
Part 14: Robustness of terminations (lead integrity)
(IEC 60749-14:2003)
Dispositifs à semiconducteurs - Halbleiterbauelemente -
Méthodes d'essais Mechanische und klimatische
mécaniques et climatiques Prüfverfahren
Partie 14: Robustesse des sorties Teil 14: Festigkeit der
(intégrité des connexions) Bauelementeanschlüsse
(CEI 60749-14:2003) (Unversehrtheit der Anschlüsse)
(IEC 60749-14:2003)

This European Standard was approved by CENELEC on 2003-10-01. CENELEC members are bound to

comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European

Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and

notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,

Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Lithuania, Luxembourg, Malta,

Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60749-14:2003 E
---------------------- Page: 2 ----------------------
EN 60749-14:2003 - 2 -
Foreword

The text of document 47/1701/FDIS, future edition 1 of IEC 60749-14, prepared by IEC TC 47,

Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by

CENELEC as EN 60749-14 on 2003-10-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2006-10-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice

The text of the International Standard IEC 60749-14:2003 was approved by CENELEC as a European

Standard without any modification.
__________
---------------------- Page: 3 ----------------------
- 3 - EN 60749-14:2003
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

This European Standard incorporates by dated or undated reference, provisions from other

publications. These normative references are cited at the appropriate places in the text and the

publications are listed hereafter. For dated references, subsequent amendments to or revisions of any

of these publications apply to this European Standard only when incorporated in it by amendment or

revision. For undated references the latest edition of the publication referred to applies (including

amendments).

NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60749-8 - Semiconductor devices - Mechanical EN 60749-8 2003
and climatic test methods
Part 8: Sealing
Undated reference.
Valid edition at date of issue.
---------------------- Page: 4 ----------------------
NORME CEI
INTERNATIONALE IEC
60749-14
INTERNATIONAL
Première édition
STANDARD
First edition
2003-08
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques
et climatiques –
Partie 14:
Robustesse des sorties
(intégrité des connexions)
Semiconductor devices –
Mechanical and climatic test methods –
Part 14:
Robustness of terminations
(lead integrity)
© IEC 2003 Droits de reproduction réservés ⎯ Copyright - all rights reserved

Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any

utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including

électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from

microfilms, sans l'accord écrit de l'éditeur. the publisher.

International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland

Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch

CODE PRIX
Commission Electrotechnique Internationale PRICE CODE
International Electrotechnical Commission
ɆɟɠɞɭɧɚɪɨɞɧɚɹɗɥɟɤɬɪɨɬɟɯɧɢɱɟɫɤɚɹɄɨɦɢɫɫɢɹ
Pour prix, voir catalogue en vigueur
For price, see current catalogue
---------------------- Page: 5 ----------------------
60749-14 © IEC:2003 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 14: Robustness of terminations
(lead integrity)
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to

technical committees; any IEC National Committee interested in the subject dealt with may participate in this

preparatory work. International, governmental and non-governmental organizations liaising with the IEC also

participate in this preparation. IEC collaborates closely with the International Organization for Standardization

(ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any

equipment declared to be in conformity with an IEC Publication.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60749-14 has been prepared by IEC technical committee 47:

Semiconductor devices.

This standard cancels and replaces IEC/PAS 62184 published in 2000. This first edition

constitutes a technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1701/FDIS 47/1707/RVD

Full information on the voting for the approval of this standard can be found in the report

on voting indicated in the above table.
---------------------- Page: 6 ----------------------
60749-14 © IEC:2003 – 5 –

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

The committee has decided that the contents of this publication will remain unchanged until 2007.

At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
---------------------- Page: 7 ----------------------
60749-14 © IEC:2003 – 7 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 14: Robustness of terminations
(lead integrity)
1 Scope

This part of IEC 60749 provides various tests for determining the integrity between the

lead/package interface and the lead itself when the lead(s) are bent due to faulty board

assembly followed by rework of the part for re-assembly. For hermetic packages, it is

recommended that this test be followed by hermeticity tests in accordance with IEC 60749-8

to determine if there are any adverse effects from the stresses applied to the seals as well

as to the leads.

This test, including each of the test conditions, is considered destructive and is only

recommended for qualification testing.

This standard is applicable to all through-hole devices and surface-mount devices requiring

lead forming by the user.
2 Normative references

The following referenced documents are indispensable for the application of this document.

For dated references, only the edition cited applies. For undated references, the latest edition

of the referenced document (including any amendments) applies.

IEC 60749-8, Semiconductor devices – Mechanical and climatic test methods – Part 8:

Sealing
3 General
3.1 Apparatus
The appropriate apparatus is described under each particular test condition.
3.2 General procedure applicable to all test conditions

The device shall be subjected to the stress described in the specified test condition and the

specified end point measurements and inspections shall be made except for initial condition-

ing unless otherwise specified. When possible, the stress shall be applied to randomly

selected leads from each device. The same leads shall not be used for more than one test

condition.
3.3 General summary

The following details, and those required by the specific test condition, shall be specified

in the relevant specification:
a) Test condition letter.

b) Sample size (combinations of number of leads per device and number of devices) and

quality level.
---------------------- Page: 8 ----------------------
60749-14 © IEC:2003 – 9 –
4 Test condition A – Tension
4.1 Purpose

This test condition provides for the application of straight tensile loading. It is designed to

check the capabilities of the device, leads, welds, and seals to withstand a straight pull.

4.2 Apparatus

The tension test requires suitable clamps and fixtures for securing the device and attaching the

specified weight without lead restriction. Equivalent linear pull test equipment may be used.

4.3 Procedure

A tension of 2,2 N ± 0,1 N (220 g ± 10 g) shall be applied without shock to each lead to be

tested in a direction parallel to the axis of the lead or terminal and the tension shall be

maintained for 30 s minimum. For leads with a diameter of less than 0,25 mm (or cross

sectional area of less than 0,05 mm ) a tension of 1 N ± 0,1 N (100 g ± 10 g) shall be applied.

The tension shall be applied as close to the end of the lead as practicable.
4.3.1 Measurements

Hermeticity test on hermetically sealed packages, visual examination and electrical measure-

ments that consist of parametric and functional tests shall be taken, as specified in the

relevant specification.
4.3.2 Failure criteria

After the removal of the stress, examine the device using a magnification between 10×

and 20×. Any evidence of breakage, loosening, or relative motion between the lead and the

device body shall be considered a device failure. When hermeticity tests are conducted

(in accordance IEC 60749-8) as a post measurement, meniscus cracks shall not be a cause

for rejection of the devices which have passed the tests. Failure to meet the requirements of

any specified post electrical measurement shall be considered a cause for failure.

4.4 Summary
The following details shall be specified in the relevant specification:
a) Weight to be attached to lead, if other than 2,2 N ± 0,1 N (220 g ± 10 g).
b) Length of time weight is to be attached, if other than 30 s.
c) Failure criteria, if other than specified in 4.3.2.
5 Test condition B – Bending stress
5.1 Purpose

This test condition provides for the application of bending stresses to determine the integrity

of leads, seals and lead plating. It is designed to check the capability of the leads, lead finish,

lead welds and seals of the devices to withstand stresses to the leads and seals which

might reasonably be expected to occur from actual handling and assembly of the devices

in application.
---------------------- Page: 9 ----------------------
60749-14 © IEC:2003 – 11 –
5.2 Apparatus

The bending test requires attaching devices, clamps, supports or other suitable hardware,

necessary to apply the bending stress through the specified bend angle.
5.3 Procedure

Each lead of the sample shall be subjected to a force sufficient to bend the lead as specified.

Any number, or all of the leads of the test device, may be bent simultaneously. Rows of leads

may be bent one row at a time. Each lead shall be bent through one cycle as follows:

Bend through the specified arc in one direction and return to the original position.

All arcs shall be made in the same plane, without lead restriction.
5.3.1 Direction of bends

Test leads shall be bent in the least rigid direction. If there is no least rigid direction, the leads

may be bent in any direction. No lead shall be bent so as to interfere with another lead.

If interference is unavoi
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.