SIST EN IEC 60749-39:2022

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2021)

IEC 60749-39:2021 is available as IEC 60749-39:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-39:2021 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. This edition includes the following significant technical changes with respect to the previous edition:
- updated procedure for "dry weight" determination.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 39: Messung des Feuchtediffusionskoeffizienten und der Wasserlöslichkeit in organischen Werkstoffen, welche bei Halbleiter-Komponenten verwendet werden (IEC 60749-39:2021)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 39: Mesure de la diffusion d'humidité et de l'hydrosolubilité dans les matériaux organiques utilisés dans les composants à semiconducteurs (IEC 60749-39:2021)

IEC 60749-39:2021 est disponible sous forme de IEC 60749-39:2021 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.

L’IEC 60749-39:2021 détaille les modes opératoires pour la mesure des propriétés caractéristiques de la diffusivité d’humidité et de l’hydrosolubilité dans les matériaux organiques utilisés dans l’encapsulation des composants à semiconducteurs. Ces deux propriétés des matériaux sont des paramètres importants pour la performance de fiabilité réelle des semiconducteurs sous boîtier en plastique après exposition à l’humidité et qui sont soumis à une refusion à température élevée au moment du brasage. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
- mise à jour du mode opératoire relatif à la détermination du "poids sec".

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 39. del: Meritve prepuščanja vlage organskih materialov in njihove vodotopnosti za polprevodniške komponente (IEC 60749-39:2021)

Ta del standarda IEC 60749 podrobno opisuje postopke za meritve prepuščanja vlage organskih materialov in njihove vodotopnosti za polprevodniške komponente, ki se uporabljajo pri embalaži polprevodniških komponent. Ti dve lastnosti materialov sta pomembna parametra za učinkovito zanesljivost polprevodnikov, pakiranih v plastiko, po izpostavljenosti vlagi in visokotemperaturnemu pretaljevanju.

General Information

• Status: Published
• Publication Date: 01-Feb-2022
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Feb-2022
• Due Date: 08-Apr-2022
• Completion Date: 02-Feb-2022
• Ref Project: EN IEC 60749-39:2022 - Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Relations

• Replaces: SIST EN 60749-39:2007 - Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
• Effective Date: 25-Jan-2022
• Revised: SIST EN 60749-39:2007 - Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
• Effective Date: 15-Sep-2020

Overview

EN IEC 60749-39:2022 (IEC 60749-39:2021 RLV) defines standardized test methods for measuring moisture diffusivity and water solubility in organic materials used for semiconductor component packaging. The standard specifies sample preparation, measurement apparatus and procedures, and data analysis needed to quantify how packaging materials absorb and release moisture - parameters critical to reliability of plastic-encapsulated semiconductors during moisture exposure and high-temperature solder reflow. This edition (Edition 2.0, 2021 published as EN IEC 60749-39:2022) includes a significant technical update to the procedure for determining dry weight.

Key Topics and Requirements

• Scope and purpose: Measurement of characteristic material properties - moisture diffusivity and water solubility - for organic mould compounds and related packaging materials.
• Apparatus requirements:
  • Analytical balance with resolution of either 0.00001 g or 0.001% of sample mass.
  • High-temperature oven (100 °C to 250 °C ±2 °C).
  • Temperature/humidity chambers (30 °C to 85 °C; 60 %RH to 85 %RH; tolerances ±2 °C and ±3 %RH).
  • Perforated trays/wire mesh, aluminium heat sink, desiccator.
• Sample geometry and preparation:
  • Flat, parallel-sided discs or coupons with linear dimensions measured to ±0.02 mm.
  • Recommended thickness 0.3–1.0 mm; maximum thickness 1.0 mm.
  • Geometric constraints to approximate one-dimensional diffusion: h < 0.05·r for discs (or equivalent for coupons).
• Procedures covered:
  • Sample processing and inspection (void-free preferred).
  • Absorption measurements (below 100 °C) and desorption measurements (above 100 °C).
  • Calculations for diffusivity, solubility, activation energy for moisture diffusion, and functional fits for solubility.
  • Updated method for determination of "dry weight."

Applications and Users

• Primary users: semiconductor manufacturers, packaging material suppliers (resin and mould-compound vendors), reliability engineers, and independent test laboratories.
• Practical uses:
  • Predicting moisture-related failure modes (popcorning, delamination) during solder reflow.
  • Specifying material selection and acceptance criteria for plastic-encapsulated SMDs.
  • Supporting reliability modeling and qualification testing for electronic assemblies.
• Benefits: standardized, reproducible data for moisture diffusivity and solubility that informs design, process control and failure-risk mitigation.

Related Standards

• IEC 60749-20 - Resistance of plastic encapsulated SMDs to combined moisture and soldering heat (referenced normative document).
• Part of the IEC 60749 series: Mechanical and climatic test methods for semiconductor devices.

Keywords: EN IEC 60749-39:2022, moisture diffusivity, water solubility, semiconductor packaging, moisture absorption, solder reflow, plastic encapsulated SMDs, reliability testing.

Standards Content (Sample)

SLOVENSKI STANDARD
01-marec-2022
Nadomešča:
SIST EN 60749-39:2007
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 39. del:
Meritve prepuščanja vlage organskih materialov in njihove vodotopnosti za
polprevodniške komponente (IEC 60749-39:2021)
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement
of moisture diffusivity and water solubility in organic materials used for semiconductor
components (IEC 60749-39:2021)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 39: Messung
des Feuchtediffusionskoeffizienten und der Wasserlöslichkeit in organischen
Werkstoffen, welche bei Halbleiter-Komponenten verwendet werden (IEC 60749-
39:2021)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
39: Mesure de la diffusion d'humidité et de l'hydrosolubilité dans les matériaux
organiques utilisés dans les composants à semiconducteurs (IEC 60749-39:2021)
Ta slovenski standard je istoveten z: EN IEC 60749-39:2022
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 60749-39

NORME EUROPÉENNE
EUROPÄISCHE NORM January 2022
ICS 31.080.01 Supersedes EN 60749-39:2006 and all of its
amendments and corrigenda (if any)
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 39: Measurement of moisture diffusivity and water solubility
in organic materials used for semiconductor components
(IEC 60749-39:2021)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 39: Mesure de la Prüfverfahren - Teil 39: Messung des
diffusivité d'humidité et de l'hydrosolubilité dans les Feuchtediffusionskoeffizienten und der Wasserlöslichkeit in
matériaux organiques utilisés dans les composants à organischen Werkstoffen, welche bei Halbleiter-
semiconducteurs Komponenten verwendet werden
(IEC 60749-39:2021) (IEC 60749-39:2021)
This European Standard was approved by CENELEC on 2022-01-03. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60749-39:2022 E

European foreword
The text of document 47/2652/CDV, future edition 2 of IEC 60749-39, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-39:2022.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-10-03
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-01-03
document have to be withdrawn
This document supersedes EN 60749-39:2006 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 60749-39:2021 was approved by CENELEC as a European
Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60749-20 - Semiconductor devices - Mechanical and EN IEC 60749-20 -
climatic test methods - Part 20: Resistance
of plastic encapsulated SMDs to the
combined effect of moisture and soldering
heat
IEC 60749-39 ®
Edition 2.0 2021-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –

Part 39: Measurement of moisture diffusivity and water solubility in organic

materials used for semiconductor components

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et

climatiques –
Partie 39: Mesure de la diffusivité d’humidité et de l’hydrosolubilité dans les

matériaux organiques utilisés dans les composants à semiconducteurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-1046-7

– 2 – IEC 60749-39:2021 © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Apparatus . 5
5 Samples . 6
6 Procedure . 6
6.1 Sample preparation . 6
6.2 Absorption measurements below 100 °C . 6
6.3 Solubility and diffusivity calculation . 9
6.4 Desorption measurements above 100 °C . 10
7 Calculation of activation energy for moisture diffusion . 11
8 Calculation of functional fit for solubility . 11
9 Summary . 11
Bibliography . 12

Figure 1 – Example of linearly increasing mass gain . 8
Figure 2 – Alternative intercept method to estimate the reversible Fickian moisture
mass . 9

IEC 60749-39:2021 © IEC 2021 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 39: Measurement of moisture diffusivity and water solubility in
organic materials used for semiconductor components

FOREWORD
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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 60749-39 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
This second edition, based on JEDEC document JESD22-A120B, cancels and replaces the
first edition published in 2006. lt is used with permission of the copyright holder, JEDEC Solid
State Technology Association. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) updated procedure for "dry weight" determination.

– 4 – IEC 60749-39:2021 © IEC 2021
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2652/CDV 47/2725/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement,
available at www.iec.ch/members_experts/refdocs. The main document types developed by
IEC are described in greater detail at www.iec.ch/standardsdev/publications.
A list of all the parts of the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IEC 60749-39:2021 © IEC 2021 – 5 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 39: Measurement of moisture diffusivity and water solubility in
organic materials used for semiconductor com
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