SIST EN IEC 60749-10:2022

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly (IEC 60749-10:2022)

This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed
wiring boards for use in electrical equipment. The method is intended to determine the
compatibility of devices and subassemblies to withstand moderately severe shocks. The use of
subassemblies is a means to test devices in usage conditions as assembled to printed wiring
boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced
by handling, transportation or field operation can disturb operating characteristics, particularly
if the shock pulses are repetitive. This is a destructive test intended for device qualification

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 10: Mechanischer Schock - Bauelemente und Unterbaugruppe (IEC 60749-10:2022)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 10: Chocs mécaniques (IEC 60749-10:2022)

L’IEC 60749-10:2022 est destinée à évaluer les dispositifs à l’état libre et ceux qui sont assemblés à des cartes à câblage imprimé pour être utilisés dans des matériels électriques. Cette méthode est destinée à déterminer la capacité des dispositifs et des sous‑ensembles à résister à des chocs d’une sévérité modérée. L’utilisation de sous‑ensembles est un moyen de soumettre aux essais des dispositifs dans des conditions d’utilisation identiques à celles des dispositifs montés sur des cartes à câblage imprimé. Les chocs mécaniques dus à l’application soudaine de forces ou à de brusques modifications de déplacements au cours de manipulations, du transport ou du fonctionnement sur le terrain peuvent perturber les caractéristiques de fonctionnement, en particulier si les impulsions de choc sont répétitives. Il s’agit ici d’un essai destructif destiné à la qualification des dispositifs.
Cette édition annule et remplace la première édition parue en 2002. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) Elle couvre à la fois les composants qui sont fixés sur des cartes à câblage imprimé et ceux qui ne le sont pas;
b) les limites des tolérances ont été modifiées pour l'accélération de crête et la durée d’impulsion;
c) des formules mathématiques ont été ajoutées concernant la variation de vitesse et la hauteur de chute équivalente.

Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 10. del: Mehanski udarci - Naprava in podsklop (IEC 60749-10:2022)

Ta del standarda IEC 60749 je namenjen vrednotenju naprav, ki so v prostem stanju ali pritrjene na plošče tiskanih vezij za uporabo v električni opremi. Metoda je predvidena za določanje združljivosti naprav in podsklopov, tako da prenesejo zmerno močne udarce. Podsklopi se uporabljajo za preskušanje naprav v pogojih uporabe, ko so pritrjene na plošče tiskanih vezij. Mehanski udarci zaradi nenadne sile ali nagle spremembe gibanja pri rokovanju, prevažanju ali uporabi na terenu lahko povzročajo spremembe v značilnostih delovanja, zlasti če se udarci ponavljajo. Gre za porušitveni preskus, ki je namenjen kvalifikaciji naprav.

General Information

• Status: Published
• Publication Date: 29-Jun-2022
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 17-Jun-2022
• Due Date: 22-Aug-2022
• Completion Date: 30-Jun-2022
• Ref Project: EN IEC 60749-10:2022 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly

Relations

• Replaces: SIST EN 60749-10:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 10: Mechanical shock
• Effective Date: 14-Jun-2022

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 60749-10:2022
01-september-2022
Nadomešča:
SIST EN 60749-10:2004
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 10. del:
Mehanski udarci - Naprava in podsklop (IEC 60749-10:2022)
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical
shock - Device and subassembly (IEC 60749-10:2022)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 10:
Mechanischer Schock - Bauelemente und Unterbaugruppe (IEC 60749-10:2022)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
10: Chocs mécaniques (IEC 60749-10:2022)
Ta slovenski standard je istoveten z: EN IEC 60749-10:2022
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 60749-10:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 60749-10:2022

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SIST EN IEC 60749-10:2022


EUROPEAN STANDARD EN IEC 60749-10

NORME EUROPÉENNE

EUROPÄISCHE NORM June 2022
ICS 31.080.01 Supersedes EN 60749-10:2002
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 10: Mechanical shock - Device and subassembly
(IEC 60749-10:2022)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 10: Chocs mécaniques - Prüfverfahren - Teil 10: Mechanischer Schock -
Dispositif et sous-ensemble Bauelemente und Unterbaugruppe
(IEC 60749-10:2022) (IEC 60749-10:2022)
This European Standard was approved by CENELEC on 2022-06-01. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 60749-10:2022 E

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SIST EN IEC 60749-10:2022
EN IEC 60749-10:2022 (E)
European foreword
The text of document 47/2752/FDIS, future edition 2 of IEC 60749-10, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-10:2022.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2023-03-01
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-06-01
document have to be withdrawn
This document supersedes EN 60749-10:2002 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 60749-10:2022 was approved by CENELEC as a European
Standard without any modification.

2

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SIST EN IEC 60749-10:2022




IEC 60749-10

®


Edition 2.0 2022-04




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE
colour

inside










Semiconductor devices – Mechanical and climatic test methods –

Part 10: Mechanical shock – Device and subassembly



Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –

Partie 10: Chocs mécaniques – Dispositif et sous-ensemble
















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.080.01 ISBN 978-2-8322-1100-4




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SIST EN IEC 60749-10:2022
– 2 – IEC 60749-10:2022 © IEC 2022
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Apparatus . 7
5 Procedure . 7
5.1 Apparatus set-up . 7
5.2 Device or subassembly in free-state . 9
5.3 Subassembly in mounted state . 9
5.4 Measurements . 10
6 Failure criteria . 10
7 Summary . 11
Bibliography . 12

Figure 1 – Live-bug orientation with solder spheres of device facing downward in either
free or mounted state . 8
Figure 2 – Dead-bug orientation with solder spheres of device facing upward in either
free or mounted state . 8

Table 1 – Device or subassembly free state test levels . 9
Table 2 – Subassembly mounted state test levels . 10

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SIST EN IEC 60749-10:2022
IEC 60749-10:2022 © IEC 2022 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 10: Mechanical shock – Device and subassembly

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 60749-10 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
This standard is based upon JEDEC document JESD22-B110. It is used with permission of the
copyright holder, JEDEC Solid State Technology Association.
This edition cancels and replaces the first edition published in 2002. This edition includes the
following significant technical changes with respect to the previous edition:
a) covers both unattached components and components attached to printed wiring boards;
b) tolerance limits modified for peak acceleration and pulse duration;
c) mathematical formulae added for velocity change and equivalent drop height.

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SIST EN IEC 60749-10:2022
– 4 – IEC 60749-10:2022 © IEC 2022
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2752/FDIS 47/2760/RVD

Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all the parts of the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

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SIST EN IEC 60749-10:2022
IEC 60749-10:2022 © IEC 2022 – 5 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 10: Mechanical shock – Device and subassembly



1 Scope
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed
wiring boards for use in electrical equipment. The method is intended to determine the
compatibility of devices and subassemblies to withstand moderately severe shocks. The use of
subassemblies is a means to test devices in usage conditions as assembled to printed wiring
boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced
by handling, transportation or field operation can disturb operating characteristics, particularly
if the shock pulses are repetitive. This is a d
...