SIST EN 60512-12-6:2002

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods -- Part 12: Soldering tests -- Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering

Details a standard test method to verify the effectiveness of the sealing of a component against flux and cleaning solvents during the machine soldering process.

Elektrisch-mechanische Bauelemente für elektronische Einrichtungen - Meß- und Prüfverfahren -- Teil 12: Prüfungen der Lötbarkeit -- Hauptabschnitt 6: Prüfung 12f: Dichtheit gegen Fluß- und Reinigungsmittel bei maschinellem Löten

Composants électromécaniques pour équipements électroniques - Procédures d'essai de base et méthodes de mesure -- Partie 12: Essais de soudure -- Section 6: Essai 12f: Etanchéité aux flux et solvants de nettoyage dans une machine à souder

Etablit une une méthode d'essai normalisée pour vérifier l'efficacité de l'étanchéité d'un composant aux flux et solvants de nettoyage lors du procédé de brasage à la machine.

Electromechanical components for electronic equipment - Basic testing procedure and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering (IEC 60512-12-6:1996)

General Information

• Status: Published
• Publication Date: 31-Aug-2002
• ICS: 31.220.01 - Electromechanical components in general
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Sep-2002
• Due Date: 01-Sep-2002
• Completion Date: 01-Sep-2002
• Ref Project: EN 60512-12-6:1996 - Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering

Overview

EN 60512-12-6:1996 (IEC 512-12-6) is a standardized test method for verifying the effectiveness of sealing against flux and cleaning solvents in machine soldering of electromechanical components. It defines procedures for flux immersion, wave-soldering, optional cleaning, recovery and inspection to determine whether components resist ingress of flux or cleaning solvents during automated soldering.

Key topics and requirements

• Scope: Applies to electromechanical components covered by IEC/TC48; may be invoked in detail specifications for similar parts.
• Specimen preparation: Components are mounted on a printed board test specimen according to the detail specification (board size, hole layout, masking). Typical board: 100 × 160 mm, 1.5 mm thick, plated-through holes, 2.50 mm or 2.54 mm grid.
• Flux immersion: Specimens are immersed in flux solution per IEC 68-2-20. Non‑activated flux is preferred; coloured or fluorescent additives (e.g., brilliant‑blue, malachite‑green, fuchsine) are recommended to improve detection of ingress.
• Machine soldering (wave/foam‑wave): Use a wave‑soldering machine with foam flux pre‑heating. Typical preheat: 70–90 °C. Preferred soldering conditions: 260 °C ± 5 °C for 5 s ± 1 s.
• Cleaning solvents and procedures: Cleaning solvents listed in the standard include alcohols (isopropyl, ethyl) and aqueous/amine/solvent mixes (see table 2). Cleaning procedures are coded (A–D): controlled immersion techniques, multi‑chamber options and optional ultrasonic cleaning (35–40 kHz). Parameters include immersion time, solvent temperature (approx. 23 ± 5 °C) and permitted solvent contamination (< 1 mg flux per litre).
• Measurements and inspection:
  • Perform initial and final electrical/mechanical measurements (e.g., contact resistance, operating force/torque).
  • After conditioning (fluxing, preheat, soldering, cleaning), allow recovery under standard atmospheric conditions (IEC 68‑1) and remeasure.
  • Visual examination: Inspect specified areas for flux or solvent residues; no residues permitted in defined areas.
• Details to specify: number of specimens, board layout, masking, specimen position, cleaning solvent/procedure, acceptance limits, and permitted deviations.

Applications and users

• Used by connector and electromechanical component manufacturers, PCB assemblers, QA and test engineers, and compliance teams to:
  • Validate component sealing during automated soldering
  • Define production acceptance criteria
  • Support design decisions for sealed contacts and housings
  • Troubleshoot flux/cleaning-related contamination failures in assembly lines

Related standards

• IEC 68‑1 (Environmental testing - General guidance)
• IEC 68‑2‑20 (Environmental testing - Test T: Soldering)

Keywords: EN 60512-12-6:1996, IEC 512-12-6, soldering tests, sealing against flux, cleaning solvents, machine soldering, wave-soldering, electromechanical components, PCB cleaning procedures.

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2002
Electromechanical components for electronic equipment - Basic testing procedure
and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing
against flux and cleaning solvents in machine soldering (IEC 60512-12-6:1996)
Electromechanical components for electronic equipment - Basic testing procedures and
measuring methods -- Part 12: Soldering tests -- Section 6: Test 12f: Sealing against flux
and cleaning solvents in machine soldering
Elektrisch-mechanische Bauelemente für elektronische Einrichtungen - Meß- und
Prüfverfahren -- Teil 12: Prüfungen der Lötbarkeit -- Hauptabschnitt 6: Prüfung 12f:
Dichtheit gegen Fluß- und Reinigungsmittel bei maschinellem Löten
Composants électromécaniques pour équipements électroniques - Procédures d'essai
de base et méthodes de mesure -- Partie 12: Essais de soudure -- Section 6: Essai 12f:
Etanchéité aux flux et solvants de nettoyage dans une machine à souder
Ta slovenski standard je istoveten z: EN 60512-12-6:1996
ICS:
31.220.01 Elektromehanske Electromechanical
komponente (sestavni deli, components in general
gradniki) na splošno
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

NORME CEI
INTERNATIONALE IEC
512-12-6
INTERNATIONAL
Première édition
STANDARD First edition
1996-01
Composants électromécaniques
pour équipements électroniques —
Procédures d'essai de base et méthodes
de mesure —
Partie 12:
Essais de soudure —
Section 6: Essai 12f — Etanchéité aux flux et solvants
de nettoyage dans une machine à souder
Electromechanical components for electronic
equipment — Basic testing procedures and
measuring methods —
Part 12:
Soldering tests —
6: Test 12f — Sealing against flux
Section
and cleaning solvents in machine soldering
— Copyright — all rights reserved
© CEI 1996 Droits de reproduction réservés
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in
utilisée sous quelque forme que ce soit et par aucun pro- any form or by any means, electronic or mechanical,
cédé, électronique ou mécanique, y compris la photocopie et including photocopying and mic rofilm, without permission
les microfilms, sans l'accord écrit de l'éditeur. in writing from the publisher.
Bureau Central de la Commission Electrotechnique Internationale 3, rue de Varembé Genève, Suisse
Commission Electrotechnique Internationale CODE PRIX
International Electrotechnical Commission P
RICE CODE
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Pour prix, voir catalogue en vigueur •
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For price, see current catalogue

512-12-6 © IEC:1996 – 3 –
CONTENTS
Page
FOREWORD 5
Clause
1 Scope and object
2 Normative references
3 Preparation of the specimen
4 Test equipment
5 Test procedure
5.1 Immersion of the specimen
5.2 Soldering
5.3 Cleaning solvents
5.4 Printed board test specimen
6 Preparation for testing
7 Requirements 13
7.1 Initial measurements
7.2 Conditioning
7.3 Recovery
7.4 Final measurements
7.5 Visual examination
8 Details to be specified
5 –
512-12-6 © IEC:1996 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
ELECTROMECHANICAL COMPONENTS
FOR ELECTRONIC EQUIPMENT -
BASIC TESTING PROCEDURES AND MEASURING METHODS -
Part 12: Soldering tests -
Section 6: Test 12f - Sealing against flux and cleaning solvents
in machine soldering
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization
comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to
promote international co-operation on all questions concerning standardization in the electrical and electronic
fields. To this end and in addition to other activities, the IEC publishes International Standards. Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt
with may participate in this preparatory work. International, governmental and non-governmental organizations
liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
The formal decisions or agreements of the IEC on technical matters, express as nearly as possible, an
2)
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the
form of standards, technical repo rts or guides and they are accepted by the National Committees in that
sense.
rnational unification, IEC National Committees undertake to apply IEC International
4) In order to promote inte
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
Attention is drawn to the possibility that some of the elements of this International Standard may be the
6)
subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 512-12-6 has been prepared by sub-committee 48B: Connectors, of
IEC technical committee 48: Electromechanical components and mechanical structures for
electronic equipment.
The text of this standard is based on the following documents:
on voting
FDIS Report
48B/464/RVD
48B/420/FDIS
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

512-12-6 © IEC:1996 – 7 –
ELECTROMECHANICAL COMPONENTS
FOR ELECTRONIC EQUIPMENT —
BASIC TESTING PROCEDURES AND MEASURING METHODS —
Part 12: Soldering tests —
Section 6: Test 12f — Sealing against flux and cleaning solvents
in machine soldering
1 Scope and object
This section of IEC 512-12, when required by the detail specification, is to be used for testing
electromechanical components within the scope of technical committee 48*. This test may also
be used for similar components when specified in a detail specification.
The object of this test is to detail a standard test method to verify the effectiveness of the
sealing of a component against flux and cleaning solvents during the machine soldering
process. The results of this test may not be representative for other fluxes; e.g. resin-reduced
foam flux, other fluxing and cleaning methods as prescribed herein.
2 Normative references
The following normative documents co
...