SIST EN IEC 60749-5:2024

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2023)

IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition:
a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test;
b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment;
c) replacement of references to “virtual junction” with “die”.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 5: Lebensdauerprüfung bei konstanter Temperatur und Feuchte unter elektrischer Beanspruchung (IEC 60749-5:2023)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 5: Essai continu de durée de vie sous température et humidité avec polarisation (IEC 60749-5:2023)

IEC 60749-5:2023 est disponible sous forme de IEC 60749-5:2023 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.

L’IEC 60749-5:2023 décrit un essai continu de durée de vie utilisant la température et l’humidité avec polarisation pour évaluer la fiabilité des dispositifs à semiconducteurs sous boîtier non hermétique dans les environnements humides. Cette méthode d’essai est considérée comme destructive. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) la spécification de l’équipement d’essai est modifiée pour exiger la nécessité de réduire le plus possible les gradients d’humidité relative et d’augmenter le plus possible la circulation d’air entre les dispositifs à semiconducteurs en essai;
b) la spécification des fixations de l’équipement d’essai est modifiée pour exiger la prévention de la condensation sur les dispositifs en essai et sur les fixations électriques reliant les dispositifs à l’équipement d’essai;
c) le remplacement des références au terme "jonction virtuelle" par "pastille".

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 5. del: Preskus življenjske dobe v dinamičnem ravnotežju vlažnosti in pri ustaljeni temperaturi (IEC 60749-5:2023)

Ta del standarda IEC 60749 določa preskus življenjske dobe v dinamičnem ravnotežju vlažnosti in pri ustaljeni temperaturi za vrednotenje zanesljivosti nehermetično pakiranih polprevodniških elementov v vlažnih okoljih.
Ta preskusna metoda se obravnava kot porušitvena.

General Information

• Status: Published
• Public Enquiry End Date: 30-Nov-2022
• Publication Date: 31-Jan-2024
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 31-Jan-2024
• Due Date: 06-Apr-2024
• Completion Date: 01-Feb-2024
• Ref Project: EN IEC 60749-5:2024 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

Relations

• Replaces: SIST EN 60749-5:2017 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2017)
• Effective Date: 01-Mar-2024

Overview

SIST EN IEC 60749-5:2024 is a European standard that specifies a mechanical and climatic test method for semiconductor devices, focusing on the steady-state temperature humidity bias life test. Developed by the Committee of European Normalization (CLC) and aligned with IEC 60749-5:2023, this standard provides protocols to evaluate the reliability of non-hermetic packaged semiconductor devices under humid environmental conditions with continuous electrical bias applied. As a destructive testing method, it accelerates moisture ingress and assesses potential failure mechanisms to ensure device longevity and robustness.

This updated edition incorporates significant technical changes for enhanced accuracy and repeatability in testing, including specifications aimed at minimizing relative humidity gradients, avoiding condensation on test devices and fixtures, and replacing the term "virtual junction" with "die."

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Key Topics

• Purpose and Scope
  SIST EN IEC 60749-5:2024 targets the assessment of environmental robustness of semiconductor devices by simulating long-term exposure to elevated temperature and humidity under electrical bias. It is especially relevant for non-hermetic packages where moisture ingress is a critical reliability concern.

• Test Conditions
  The test requires maintaining a steady-state temperature and relative humidity environment-typically around 85 °C and 85% RH-to accelerate aging and moisture penetration. The test duration and humidity levels can be adjusted as per testing requirements.

• Test Equipment Requirements

  • Test chambers must maintain precise control of temperature and relative humidity during ramp-up, steady state, and ramp-down phases.
  • The dry bulb temperature must always be higher than the wet bulb to avoid condensation.
  • Fixtures and boards should minimize contamination risks and corrosion to ensure valid test results.

• Biasing and Mounting
  Devices are electrically biased during the test to simulate operating conditions, accelerating failure mechanisms associated with moisture and heat stress. Proper device placement ensures consistent exposure and airflow, reducing relative humidity gradients within the chamber.

• Failure Criteria and Evaluation
  Devices are monitored for performance degradation or failure attributable to the combined effects of temperature, humidity, and electrical bias. Results help guide design improvements and quality controls.

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Applications

• Reliability Testing in Semiconductor Manufacturing
  SIST EN IEC 60749-5:2024 serves as a critical reference for semiconductor manufacturers seeking to qualify and validate the durability of packaged devices exposed to harsh environments, such as automotive electronics, industrial controls, and consumer electronics.

• Quality Assurance and Product Development
  By simulating extended field conditions with accelerated stress testing, companies can detect latent defects, enhance materials and packaging designs, and improve product reliability before market release.

• Component Qualification for High-Humidity Environments
  This standard is essential for devices intended for use in tropical or marine environments, HVAC systems, and any application requiring certification of moisture resistance.

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Related Standards

• IEC 60749-4: Highly Accelerated Stress Test (HAST)
  Complementary to the steady-state bias life test, IEC 60749-4 focuses on damp heat, steady-state highly accelerated stress testing aimed at faster activation of failure mechanisms. EN IEC 60749-5 prioritizes steady-state 85 °C/85% RH testing results when both are performed.

• IEC 60749 Series – Mechanical and Climatic Test Methods
  Part of the broader IEC 60749 family, which covers various environmental and mechanical stress testing protocols for semiconductor device qualification.

• JEDEC JESD22-A101
  The standard on which SIST EN IEC 60749-5:2024 is based, developed under JEDEC Solid State Technology Association guidelines, reflecting international collaboration in semiconductor testing methods.

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By adhering to SIST EN IEC 60749-5:2024, semiconductor manufacturers and testers ensure that devices meet stringent reliability requirements against moisture-induced failures, enhancing product trustworthiness and safety in critical operational environments.

Standards Content (Sample)

SLOVENSKI STANDARD
01-marec-2024
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 5. del:
Preskus življenjske dobe v dinamičnem ravnotežju vlažnosti in pri ustaljeni
temperaturi (IEC 60749-5:2023)
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state
temperature humidity bias life test (IEC 60749-5:2023)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 5:
Lebensdauerprüfung bei konstanter Temperatur und Feuchte unter elektrischer
Beanspruchung (IEC 60749-5:2023)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 5:
Essai continu de durée de vie sous température et humidité avec polarisation (IEC
60749-5:2023)
Ta slovenski standard je istoveten z: EN IEC 60749-5:2024
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 60749-5

NORME EUROPÉENNE
EUROPÄISCHE NORM January 2024
ICS 31.080.01 Supersedes EN 60749-5:2017
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 5: Steady-state temperature humidity bias life test
(IEC 60749-5:2023)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 5: Essai continu de Prüfverfahren - Teil 5: Lebensdauerprüfung bei konstanter
durée de vie sous température et humidité avec polarisation Temperatur und Feuchte unter elektrischer Beanspruchung
(IEC 60749-5:2023) (IEC 60749-5:2023)
This European Standard was approved by CENELEC on 2024-01-23. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2024 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60749-5:2024 E

European foreword
The text of document 47/2820/FDIS, future edition 3 of IEC 60749-5, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-5:2024.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-10-23
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2027-01-23
document have to be withdrawn
This document supersedes EN 60749-5:2017 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 60749-5:2023 was approved by CENELEC as a European
Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60749-4 - Semiconductor devices - Mechanical and EN 60749-4 -
climatic test methods - Part 4: Damp heat,
steady state, highly accelerated stress test
(HAST)
IEC 60749-5 ®
Edition 3.0 2023-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –

Part 5: Steady-state temperature humidity bias life test

Dispositifs à semiconducteurs – Méthodes d'essais mécaniques et climatiques –

Partie 5: Essai continu de durée de vie sous température et humidité avec

polarisation
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01  ISBN 978-2-8322-8033-1

– 2 – IEC 60749-5:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 General . 5
5 Equipment . 5
5.1 Equipment summary . 5
5.2 Temperature and relative humidity . 6
5.3 Devices under stress . 6
5.4 Minimizing release of contamination . 6
5.5 Ionic contamination . 6
5.6 Deionized water . 6
6 Test conditions . 6
6.1 Test conditions summary . 6
6.2 Temperature, relative humidity and duration . 6
6.3 Biasing guidelines . 7
6.4 Biasing choice and reporting . 7
7 Procedures . 8
7.1 Mounting . 8
7.2 Ramp-up . 8
7.3 Ramp-down . 8
7.4 Test clock . 8
7.5 Bias . 8
7.6 Read-out . 8
7.7 Handling . 8
8 Failure criteria . 9
9 Safety . 9
10 Summary . 9

Table 1 – Temperature, relative humidity and duration . 6
Table 2 – Criteria for choosing continuous or cyclical bias . 7

IEC 60749-5:2023 © IEC 2023 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 5: Steady-state temperature humidity bias life test

FOREWORD
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