EN 61189-3:1997/A1:1999

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

EN following parallel vote

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 3: Méthodes d'essai des structures d'interconnexion (cartes imprimées)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

General Information

• Status: Withdrawn
• Publication Date: 06-Sep-1999
• Withdrawal Date: 31-Jul-2002
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 01-Dec-2010
• Completion Date: 01-Dec-2010
• Ref Project: SIST EN 61189-3:2001/A1:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)

Relations

• Replaced By: EN 61189-3:2008 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
• Effective Date: 28-Jan-2023
• Amends: EN 61189-3:1997 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-marec-2001
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies - Part 3: Test methods for interconnection structures
(printed boards)
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen -- Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles -- Partie 3: Méthodes d'essai des structures
d'interconnexion (cartes imprimées)
Ta slovenski standard je istoveten z: EN 61189-3:1997/A1:1999
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
...