SIST EN 60749-23:2004

Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life

This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren -- Teil 23: Lebensdauer bei hoher Temperatur

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques -- Partie 23: Durée de vie en fonctionnemement à haute température

Cet essai est utilisé pour déterminer les effets des conditions de polarisation et de température avec le temps sur des dispositifs à semiconducteurs. Il simule les conditions de fonctionnement des dispositifs d'une manière accélérée et il est essentiellement destiné à la qualification des dispositifs et au contrôle de fiabilité.

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004)

General Information

• Status: Published
• Publication Date: 30-Jun-2004
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Jul-2004
• Due Date: 01-Jul-2004
• Completion Date: 01-Jul-2004
• Ref Project: EN 60749-23:2004 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

Relations

• Amended By: SIST EN 60749-23:2004/A1:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004/A1:2011)
• Effective Date: 01-May-2011
• Amended By: SIST EN 60749-23:2004/A1:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004/A1:2011)
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 60749-23:2004

STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 23: High
temperature operating life (IEC 60749-23:2004)
ICS 31.080.01 Referenčna številka
SIST EN 60749-23:2004(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 60749-23
NORME EUROPÉENNE
EUROPÄISCHE NORM April 2004

ICS 31.080.01


English version


Semiconductor devices –
Mechanical and climatic test methods
Part 23: High temperature operating life
(IEC 60749-23:2004)


Dispositifs à semiconducteurs –  Halbleiterbauelemente –
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques Prüfverfahren
Partie 23: Durée de vie en Teil 23: Lebensdauer bei hoher
fonctionnemement à haute température Temperatur
(CEI 60749-23:2004) (IEC 60749-23:2004)






This European Standard was approved by CENELEC on 2004-04-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60749-23:2004 E

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EN 60749-23:2004 - 2 -
Foreword
The text of document 47/1735/FDIS, future edition 1 of IEC 60749-23, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-23 on 2004-04-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-01-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2007-04-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-23:2004 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 60749-23:2004
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60747 Series Semiconductor devices – Discrete EN 60747 Series
devices and integrated circuits

1) 2)
IEC 60749-34 - Semiconductor devices - Mechanical and EN 60749-34 2004
climatic test methods
Part 34: Power cycling




1)
Undated reference.
2)
Valid edition at date of issue.

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NORME CEI
INTERNATIONALE
IEC
60749-23
INTERNATIONAL
Première édition
STANDARD
First edition
2004-02
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques et climatiques –
Partie 23:
Durée de vie en fonctionnement
à haute température
Semiconductor devices –
Mechanical and climatic test methods –
Part 23:
High temperature operating life
© IEC 2004 Droits de reproduction réservés ⎯ Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
CODE PRIX
J
PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
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Pour prix, voir catalogue en vigueur
For price, see current catalogue

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60749-23 © IEC:2004 – 3 –
CONTENTS
FOREWORD.5
1 Scope.9
2 Normative references.9
3 Terms and definitions .9
4 Test apparatus.11
4.1 Circuitry.11
4.1.1 Device schematic.11
4.1.2 Power.11
4.2 Device mounting.11
4.3 Power supplies and signal sources.11
4.4 Environmental chamber.11
5 Procedure.11
5.1 Stress duration.13
5.2 Stress conditions.13
5.2.1 Ambient temperature.13
5.2.2 Operating voltage.13
5.2.3 Biasing configurations.13
6 Cool-down.15
7 Measurements.15
8 Failure criteria.17
9 Summary.17

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60749-23 © IEC:2004 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 23: High temperature operating life
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-23 has been prepared by IEC technical committee 47:
Semiconductor devices.
This first edition is based on the IEC/PAS 62189 (2000).
The text of this standard is based on the following documents:
FDIS Report on voting
47/1735/FDIS 47/1745/RVD
Full information on the voting for the approval of this standard ca
...