SIST-TP CLC/TR 62258-3:2008

Semiconductor die products -- Part 3: Recommendations for good practice in handling, packing and storage

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, and - minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly.

Halbleiter-Chip-Erzeugnisse -- Teil 3: Empfehlungen für die Praxis bei Handhabung, Verpackung und Lagerung

Izdelki s polprevodniškimi čipi - 3. del: Priporočila za dobro prakso pri ravnanju z njimi, pakiranju in skladiščenju (IEC/TR 62258-3:2005)

General Information

• Status: Published
• Publication Date: 07-Nov-2007
• ICS: 31.080.99 - Other semiconductor devices
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 24-Oct-2007
• Due Date: 29-Dec-2007
• Completion Date: 08-Nov-2007
• Ref Project: CLC/TR 62258-3:2007 - Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage

Relations

• Replaces: SIST-TS ES 59008-4-2:2007 - Data requirements for semiconductor die -- Part 4-2: Specific requirements and recommendations - Handling and storage
• Effective Date: 01-Jan-2008

Standards Content (Sample)

SLOVENSKI STANDARD
SIST-TP CLC/TR 62258-3:2008
01-januar-2008
1DGRPHãþD
SIST-TS ES 59008-4-2:2007
,]GHONLVSROSUHYRGQLãNLPLþLSLGHO3ULSRURþLOD]DGREURSUDNVRSULUDYQDQMX]
QMLPLSDNLUDQMXLQVNODGLãþHQMX,(&75
Semiconductor die products - Part 3: Recommendations for good practice in handling,
packing and storage (IEC/TR 62258-3:2005)
Halbleiter-Chip-Erzeugnisse - Teil 3: Empfehlungen für die Praxis bei Handhabung,
Verpackung und Lagerung (IEC/TR 62258-3:2005)
Ta slovenski standard je istoveten z: CLC/TR 62258-3:2007
ICS:
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST-TP CLC/TR 62258-3:2008 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

TECHNICAL REPORT
CLC/TR 62258-3

RAPPORT TECHNIQUE
February 2007
TECHNISCHER BERICHT

ICS 31.080.99 Supersedes ES 59008-4-2:2000


English version


Semiconductor die products –
Part 3: Recommendations for good practice in handling,
packing and storage
(IEC/TR 62258-3:2005)


 Halbleiter-Chip-Erzeugnisse –
Teil 3: Empfehlungen für die Praxis
bei Handhabung,
Verpackung und Lagerung
(IEC/TR 62258-3:2005)






This Technical Report was approved by CENELEC on 2006-12-12.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland and the United Kingdom.





CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. CLC/TR 62258-3:2007 E

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CLC/TR 62258-3:2007 - 2 -
Foreword
The text of the Technical Report IEC/TR 62258-3:2005, prepared by IEC TC 47, Semiconductor devices,
was submitted to vote and was approved by CENELEC as CLC/TR 62258-3 on 2006-12-12.
This Technical Report supersedes ES 59008-4-2:2000.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the Technical Report IEC/TR 62258-3:2005 was approved by CENELEC as a Technical Report
without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 62258-2 NOTE Harmonized as EN 62258-2:2005 (not modified).
__________

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- 3 - CLC/TR 62258-3:2007
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year
IEC 60050 Series International Electrotechnical Vocabulary - -
(IEV)
1) 2)
IEC 60286-3 Packaging of components for automatic EN 60286-3
- 1998
handling -
Part 3: Packaging of surface mount
components on continuous tapes
IEC 61340-5-1 1998 Electrostatics –
+ corr. February 1999 Part 5-1: Protection of electronic devices EN 61340-5-1 2001
 from electrostatic phenomena - General + corr. April 2001
requirements
IEC 61340-5-2 1999 Electrostatics – EN 61340-5-2 2001
Part 5-2: Protection of electronic devices + corr. August 2001
from electrostatic phenomena - User
guide
1) 2)
IEC 62258-1 Semiconductor die products – EN 62258-1
- 2005
Part 1: Requirements for procurement and

use
1) 2)
ISO 14644-1 - Cleanrooms and associated controlled EN ISO 14644-1 1999
environments –
Part 1: Classification of air cleanliness


1)
Undated reference.
2)
Valid edition at date of issue.

---------------------- Page: 4 ----------------------

TECHNICAL IEC


REPORT TR 62258-3





First edition
2005-06


Semiconductor die products –
Part 3:
Recommendations for good practice
in handling, packing and storage

 IEC 2005  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale X

International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

---------------------- Page: 5 ----------------------

– 2 – TR 62258-3  IEC:2005(E)
CONTENTS

FOREWORD.4
INTRODUCTION.6

1 Scope and object.7
2 Normative references .7
3 Terms and definitions .8
4 Handling – Good practice .8
4.1 General .8
4.2 Working environmental controls.8
4.3 General handling precautions.8
4.4 Cleanroom good practice.8
5 Process handling issues .12
5.1 Wafer sawing .12
5.2 Die sorting.13
6 Die and wafer transport and storage media .16
6.1 Wafer carriers and cassettes .16
6.2 In-process carriers and transport systems .17
6.3 Packing for shipment of unsawn wafers.17
6.4 Packing for shipment of sawn wafers.18
6.5 Packing for shipment of single wafers .21
6.6 Packing for shipment of die using trays .21
6.7 Packing for shipment of die using tape-and-reel .25
6.8 Secondary packing for shipment.27
7 Storage good practice .28
7.1 Die and wafer storage .28
7.2 Short-term storage environment and conditions.28
7.3 Storage time limitations .28
7.4 Sawn wafer on wafer frame or ring .29
7.5 Die products in the production area .29
7.6 Die in tape-and-reel.29
7.7 Dry-packed die products.29
8 Traceability good practice.29
8.1 General .29
8.2 Wafer traceability .29
8.3 Die products traceability.29
8.4 Wafer and die back side marking.30
9 Guidelines for long-term storage (die banking) of bare die and wafers.30
9.1 General .30
9.2 Preparing for storage.30
9.3 Damage to die products during long-term storage .31
9.4 Long-term storage environment .31
9.5 Recommended inert atmosphere purity .32
9.6 Chemical contamination .32
9.7 Electrical effects.33

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TR 62258-3  IEC:2005(E) – 3 –
9.8 Protection from radiation.33
9.9 Periodic qualification of stored die products .33
10 Good practice for automated handling during assembly .34
10.1 Removal of die from shipping media.34
10.2 Equipment out of service .34

Annex A (informative) Planning checklist .35
Annex B (informative) Material specifications.41

Bibliography .44

Figure 1 – Bevel cut for bare die and flip-chip products.12
Figure 2 – Die eject needle .15
Figure 3 – Wafer jar structure.18
Figure 4 – Film frame.19
Figure 5 – Grip ring.20
Figure 6 – Single waffle pack .22
Figure 7 – Stacked waffle packs.23
Figure 8 – Vacuum-release trays.24
Figure 9 – Corner relief in the cavity of a chip tray.25
Figure 10 – Tape-and-reel packing structure .27
Figure 11 – Packaging material for shipment .27

Table 1 – Example die eject marks.15
Table A.1 – Planning checklist .35

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– 4 – TR 62258-3  IEC:2005(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DIE PRODUCTS –

Part 3: Recommendations for good practice
in handling, packing and storage


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a technical report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC 62258-3, which is a technical report, has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
47/1794/DTR 47/1806/RVC

Full information on the voting for the approval of this technical report can be found in the
report on voting indicated in the above table.

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TR 62258-3  IEC:2005(E) – 5 –
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 62258, as currently conceived, consists of the following parts, under the general title
1
Semiconductor die products
Part 1: Requirements for procurement and use
Part 2: Exchange data formats
Part 3: Recommendations for good practice in handling, packing and storage
Part 4: Questionnaire for die users and suppliers
Part 5: Requirements for information concerning electrical simulations
Part 6: Requirements for information concerning thermal simulations
Further parts may be added as required.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.

A bilingual version of this publication may be issued at a later date.


———————
1
At the time of writing, IEC 62258-3 is the only part in existence. Other parts are under consideration.

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– 6 – TR 62258-3  IEC:2005(E)
INTRODUCTION
Organizations that helped prepare this technical report included the ESPRIT GOOD-DIE
project, DPC, and JEITA.

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TR 62258-3  IEC:2005(E) – 7 –
SEMICONDUCTOR DIE PRODUCTS –

Part 3: Recommendations for good practice
in handling, packing and storage



1 Scope and object
This technical report has been developed to facilitate the production, supply and use of
semiconductor die products, including:
– wafers,
– singulated bare die,
– die and wafers with attached connection structures, and
– minimally or partially encapsulated die and wafers.
This report contains suggested good practice for the handling, packing and storage of die
products.
Success in manufacture of electronic assemblies containing die products is enhanced by
attention to handling, storage and environmental conditions. This report provides guidelines
taken from industry experience and is especially useful to those integrating die products into
assemblies for the first time. It is also intended as an aid to setting up and auditing facilities
that handle or use bare die products, from wafer fabrication to final assembly.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references the lasted edition
of the referenced document (including any amendments) applies.
IEC 60050 (all parts), International Electrotechnical Vocabulary
IEC 60286-3, Packaging of components for automatic handling – Part 3: Packaging of surface
mount components on continuous tapes
IEC 61340-5-1:1998, Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena – General requirements
IEC 61340-5-2:1999, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
2
IEC 62258-1, Semiconductor die products – Part 1: Requirements for procurement and use
ISO 14644-1, Cleanrooms and associated controlled environments – Part 1: Classification of
air cleanliness
———————
2
Under consideration.

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– 8 – TR 62258-3  IEC:2005(E)
3 Terms and definitions
For the purposes of this document, relevant terms which are defined in IEC 60050, together
with additional terms and acronyms as given is IEC 62258-1, shall apply.
4 Handling – Good practice
4.1 General
Contact with the exposed active surface of die products should be avoided. When contact is
absolutely necessary, only properly designed tools and materials should be used.
The working environment, including tools, materials and containers for handling and transport
of die products should provide for ESD protection (refer to IEC 61340-5-1 and IEC 61340-5-
2).
It should also be realised that die products are sensitive to certain chemicals.
4.2 Working environmental controls
The following are the typical recommended working environmental conditions for most
semiconductor technologies. Characterisation of the particular technology used should be
conducted to determine any specific environmental needs. This working environment should
not be used for storage of semiconductor die.
a) Temperature: 17 °C – 28 °C
+20
b) Humidity 40 % nominal %
−10
c) Particle count: ISO 14644-1, Class 8 or better
4.3 General handling precautions
The selection of appropriate tools is critical to successful handling of bare die and wafers.
There is a range of specialized tools available for correct handling of die and wafers. If any
tooling or equipment is found to damage die products, its use should be suspended
immediately.
Die products should never be allowed to come into contact with each other, or to be stacked
on top of each other without the use of suitable separators.
Die products should never be placed with the active side touching a hard surface. The die
surface may also be damaged if it touches a soft surface that has embedded hard particles,
such as silicon debris.
When handling wafers it is recommended that physical contact should be made only with the
outer periphery and/or the back side of the wafer.
4.4 Cleanroom good practice
Containers of bare die or wafers should only be opened in a work area with a controlled
environment, known as a cleanroom. This applies to any process that exposes the die or
wafer surface to the environment, for example quality checks, die sorting or assembly of
products containing bare die.
Personnel working in these areas need to be adequately trained to ensure that die products
are not physically damaged nor contaminated when handled in the cleanroom.

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TR 62258-3  IEC:2005(E) – 9 –
4.4.1 General
ESD damage may be reduced through the use of grounded workstations, conductive wrist
straps and/or shoe straps, conductive material totes, staticide chemicals, conductive floor
waxes, tiles, mats, ionizers, conductive packing foams, and shielded bags. These items can
also improve the efficiency of the environmental controls employed.
Bare die or wafers in process should remain in a clean environment at all times. If wafers are
to be transported between cleanrooms, a suitable wafer carrier should be used and the
container should remain closed during transportation. The container should be externally
cleaned on re-entering the cleanroom.
It is recommended that die or wafers should not be handled manually. Handling die or wafers
with bare hands should be avoided since this will cause contamination from skin oil, skin
flakes, and a variety of other contaminants from human and other sources. Even when using
gloves, handling may cause contamination by transfer of plasticizer from the glove. However,
it is acceptable to handle wafers with a gloved hand as long as the wafer is held on the edge
and the active surface is not touched at all.
All surfaces coming in contact with die products throughout the process should be clean and,
when practicable, non-metallic. Any hard material in contact with the die products may cause
scratches or chipping. These principles should be observed at all times, since if one die or
wafer becomes contaminated, the contaminants may be transferred to other surfaces, process
equipment and wafers.
Care should be taken to avoid contaminating surfaces used for product handling. Working
surfaces should not be used to hold non-clean items, such as equipment covers, internal
parts or personal belongings. Wiping a surface clean may not adequately remove oils and
residues.
4.4.2 Attire
4.4.2.1 Hats, hoods, nets, masks and shoes
Head and facial hair should be completely enclosed at all times using appropriate hoods or
nets to avoid contamination from skin particles or hair.
It is recommended that masks are worn at all times while in the production area with exposed
wafers or die to prevent contamination by spittle. Masks should cover the mouth, and ideally,
the nose and should be replaced daily or more often if they become contaminated.
Special ESD-safe cleanroom shoes should be worn within the cleanroom. These shoes should
be kept inside the cleanroom or changing area and only be taken outside the area for
cleaning or repair. Alternatively, overshoes may be used which should be discarded
immediately after use in suitable waste containers. Some overshoes are suitable for re-use
after washing, however, they are not intended to be re-used without being cleaned.
4.4.2.2 Smocks and gowns
Special smocks and gowns should be worn within the cleanroom, to cover normal clothing.
They should be selected according to the cleanroom classification and should be made of
material that is both anti-static and lint-free.
4.4.2.3 Gloves
Gloves serve as the final barrier in preventing release of skin flakes, skin oils, and other
hand-carried contaminants. Disposable vinyl gloves that are approved for cleanrooms are
appropriate for general use.

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– 10 – TR 62258-3  IEC:2005(E)
Cotton gloves or other gloves that shed lint or powder should not be worn in handling die
products, even under vinyl gloves. Polyester or nylon gloves may be worn under vinyl gloves.
Rubber gloves packed with powder should not to be used.
Gloves should be replaced each time the cleanroom is entered, or more often if they become
contaminated in any way, for example by ink or from touching the face. Gloves that have rips
or tears should be replaced immediately.
When gowning, gloves should always be put on last, after other items. Gloves should be worn
over cuffs on sleeves and should be held at the wrists only at all times.
No contact should be made with face, hair, or other potential sources of contamination by
gloved hands; such contamination can be transferred to other items, including die products,
process equipment and handling equipment.
4.4.2.4 Finger cots
Finger cots are often used instead of gloves. These offer less protection from contamination,
but are more convenient for some operations, for example wafer quality control inspection. It
is recommended that finger cots be worn on all fingers to prevent inadvertent contamination
from an uncovered finger. Finger cots should be kept and used in the cleanroom area and not
kept in the cleanroom gowning area.
Finger cots should not be re-used and should be replaced if torn or damaged. Fresh finger
cots should be used after re-entering the cleanroom.
4.4.3 Conduct
Food and drink should not be taken into the cleanroom.
Hands should be washed before gowning and entering the work area, especially after
handling foods.
Cosmetics should not be worn in the cleanroom as the chemicals they contain could damage
or contaminate die products. Excessive use of creams and lotions should also be avoided
since chemical additives may also damage or contaminate die products.
The following are some of the practices and items that should be prohibited in the controlled
environment:
a) smoking or the use of any tobacco product;
b) acts of personal hygiene or grooming;
c) hair brushes or combs;
d) chewing-gum, sweets or candy;
e) plants or cut flowers;
f) pencils or erasers;
g) paper or card products not designed for cleanroom use.
4.4.4 Tools
The use of automated equipment and vacuum tools is preferred at all times for handling die
and wafers. Any tool used should not generate ESD hazards.
Tools should only be used for their designed purpose in handling die products and should not
be used as screwdrivers, pry bars, letter openers, etc.

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TR 62258-3  IEC:2005(E) – 11 –
4.4.4.1 Pick-up tools and collets
A wafer extraction tool should be used to assist in guiding the wafer out of a cassette in order
to avoid scratching or damaging the wafer.
Vacuum wand-tips and die pick-up collets should be cleaned regularly using appropriate
materials such as isopropyl alcohol and polyester cleanroom wipes. Extreme care should be
taken in handling and cleaning die pick-up tools that touch the active surface of the die.
Wafer vacuum pick-up tools should be
...