kSIST prEN IEC 60068-2-88:2025

Environmental testing - Part 2-88: Tests - Test xd: Resistance of components and assemblies to liquid cleaning media

IEC 60068‑2-88:2025 establishes test methods for the resistance of electronic and electromechanical components, unpopulated circuit boards and assemblies to liquid cleaning media and cleaning processes, which are agreed between user and supplier for applications, where cleaning is required. These tests are not applicable to components, unpopulated circuit boards and assemblies, which are not intended to be subjected to cleaning processes.
Tests XD1 and XD2 primarily are intended for qualification testing of components and unpopulated circuit boards suitable for cleaning processes, but can be adopted as well to testing of material compatibility and specific cleaning media used in manufacturing processes of components and unpopulated circuit boards.
Test XD3 is intended to determine the resistance of electronic assemblies suitable for cleaning processes to the various cleaning processes to which they are exposed during manufacturing, including the effects of assembly and soldering processes.

Umgebungseinflüsse – Teil 2-88: Prüfungen – Prüfung XD: Beständigkeit von Bauelementen und Baugruppen gegenüber flüssigen Reinigungsmedien

Essais d’environnement - Partie 2-88: Essais - Essai xd: Résistance des composants et des assemblages aux produits de nettoyage liquides

L’IEC 60068‑2-88:2025 établit les méthodes d’essai de la résistance des composants électroniques et électromécaniques, des circuits imprimés nus et des assemblages aux produits de nettoyage liquides et aux processus de nettoyage, ayant fait l’objet d’un accord entre l’utilisateur et le fournisseur pour des applications pour lesquelles un nettoyage est exigé. Ces essais ne s’appliquent pas aux composants, aux circuits imprimés nus et aux assemblages qui ne sont pas destinés à être soumis à un processus de nettoyage.
Les essais XD1 et XD2 concernent essentiellement les essais de qualification des composants et des circuits imprimés nus prévus pour les processus de nettoyage. Toutefois, ils peuvent également être adoptés pour soumettre à essai la compatibilité des matériaux et les produits de nettoyage spécifiques utilisés dans le cadre du processus de fabrication des composants et des circuits imprimés nus.
L’essai XD3 a pour objet de déterminer la résistance des assemblages électroniques aux processus de nettoyage aux différents processus de nettoyage auxquels ils sont exposés pendant la fabrication, y compris les effets des processus d’assemblage et de brasage.

Okoljsko preskušanje - 2-88. del: Preskusi - Preskus xd: Odpornost komponent in sestavov na tekoče čistilno sredstvo

General Information

• Status: Not Published
• Public Enquiry End Date: 31-Oct-2024
• ICS: 19.040 - Environmental testing
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 5020 - Formal vote (FV) (Adopted Project)
• Start Date: 01-Apr-2025
• Due Date: 20-May-2025
• Completion Date: 09-Apr-2025
• Ref Project: FprEN IEC 60068-2-88:2025 - Environmental testing - Part 2-88: Tests – Test XD: Resistance of components and assemblies to liquid cleaning media

Standards Content (Sample)

SLOVENSKI STANDARD
oSIST prEN IEC 60068-2-88:2024
01-oktober-2024
Okoljsko preskušanje - 2-88. del: Preskusi - Preskus xd: Odpornost komponent in
sestavov na tekoče čistilno sredstvo
Environmental testing - Part 2-88: Tests - Test xd: Resistance of components and
assemblies to liquid cleaning media
Ta slovenski standard je istoveten z: prEN IEC 60068-2-88:2024
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
oSIST prEN IEC 60068-2-88:2024 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

oSIST prEN IEC 60068-2-88:2024

oSIST prEN IEC 60068-2-88:2024

91/1964/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 60068-2-88 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2024-08-23 2024-11-15
SUPERSEDES DOCUMENTS:
91/1908/CD, 91/1929/CC
IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Osamu IKEDA
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):
TC 37,TC 40,TC 46,TC 47,TC 48,TC 49,TC 51,TC 86,TC 94,TC
104,TC 107
ASPECTS CONCERNED:
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they are
aware and to provide supporting documentation.
Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some Countries” clau ses to
be included should this proposal proceed. Recipients are reminded that the CDV stage is the final stage for submitting ISC
clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).

TITLE:
ENVIRONMENTAL TESTING - Part 2-88: Tests – Test XD: Resistance of components and assemblies to liquid
cleaning media
PROPOSED STABILITY DATE: 2030
NOTE FROM TC/SC OFFICERS:
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions. You
may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without permis sion in
writing from IEC.
oSIST prEN IEC 60068-2-88:2024
91/1964/CDV – 2 – IEC CDV 60068-2-88 © IEC:2024
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 8
4 Objective and general aspects . 9
4.1 Objective . 9
4.2 General . 9
4.3 Qualification and validation process . 9
5 Test liquids . 10
5.1 Test liquid W - Water based neutral, single phase . 10
5.1.1 Preparation . 10
5.1.2 Formulation . 10
5.1.3 Specification . 10
5.2 Test liquid W - Water based alkaline . 10
5.2.1 Preparation . 10
5.2.2 Formulation . 10
5.2.3 Specification . 10
5.3 Test liquid OR – Petroleum based organic solvent, single phase . 11
5.3.1 Preparation . 11
5.3.2 Formulation . 11
5.3.3 Specification . 11
5.4 Test liquid OR – Glycol based organic solvent . 11
5.4.1 Preparation . 11
5.4.2 Formulation . 11
5.4.3 Specification . 11
5.5 Test liquid D - Deionized water . 11
5.5.1 Preparation . 11
5.5.2 Specification . 11
6 Test apparatus . 12
6.1 Containers . 12
6.2 Miscellaneous laboratory equipment . 12
6.3 Temperature controlled equipment . 12
6.4 Balance . 12
6.4.1 Thermometer . 12
6.4.2 pH meter . 12
7 Test XD Test procedure for components . 13
7.1 Object . 13
7.2 Preconditioning . 13
7.3 Initial measurements . 13
7.3.1 Visual inspection . 13
7.3.2 Electrical and mechanical measurement . 13
7.4 Conditioning. 13

oSIST prEN IEC 60068-2-88:2024
IEC CDV 60068-2-88 © IEC:2024 – 3 – 91/1964/CDV
7.4.1 Test conditions and severities. 13
7.4.2 Method 1 - Manual stirring . 14
7.4.3 Method 2 - Automatic Stirring . 14
7.5 Recovery . 15
7.6 Final measurements. 15
7.7 Information to be given in the relevant specification . 15
8 Test XD - Test procedure for circuit boards. 15
8.1 Object . 15
8.2 Preconditioning . 15
8.2.1 Drying process . 15
8.3 Initial measurements . 16
8.3.1 Initial weight . 16
8.3.2 Visual inspection . 16
8.4 Conditioning. 17
8.4.1 Test conditions and severities. 17
8.4.2 Method - Automatic Stirring . 17
8.5 Recovery . 17
8.6 Final measurements. 18
8.6.1 Final weight . 18
8.6.2 Final visual inspection . 18
8.6.3 Inspection of the white paper . 18
8.7 Information to be given in the relevant specification . 18
9 Test XD - Test procedure for assemblies . 19
9.1 Object . 19
9.2 Preconditioning . 19
9.2.1 General . 19
9.2.2 Soldering . 19
9.2.3 Preparing of a reference . 19
9.3 Initial measurements . 19
9.3.1 Visual inspection - Microscope . 19
9.3.2 Impedance spectroscopy (optional) . 20
9.3.3 Electrical function tests . 20
9.4 Conditioning. 20
9.4.1 Test parameters . 20
9.4.2 Test apparatus . 21
9.4.3 Test procedure . 21
9.5 Recovery . 21
9.6 Final measurements. 21
9.6.1 Final visual inspection . 21
9.6.2 Final impedance spectroscopy (optional) . 22
9.6.3 Final electrical function tests . 22
9.7 Information to be given in the relevant specification . 22
Annex A (normative) Qualification and process validation . 23
A.1 General . 23
A.2 Component and circuit board qualification process . 23
A.3 Cleaning process validation . 23
Annex B (informative) Typical cleaning procedures . 24
B.1 Spray-in-Air process (SIA) . 24

oSIST prEN IEC 60068-2-88:2024
91/1964/CDV – 4 – IEC CDV 60068-2-88 © IEC:2024
B.2 Dip tank process . 26
Annex C (informative) Impedance spectroscopy . 27
C.1 General description . 27
C.2 Measuring system set up . 27
C.3 Selection of measuring parameters . 27
C.4 Interpretation of impedance curves . 28
Bibliography .
...