SIST EN 62137-4:2015

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress.
This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. IEC 62137-4 includes the following significant technical changes with respect to IEC 62137:2004:
- test conditions for use of lead-free solder are included;
- test conditions for lead-free solders are added;
- accelerations of the temperature cycling test for solder joints are added.

Montageverfahren für elektronische Baugruppen - Teil 4: Oberflächenmontierbare Bauteilgehäuse mit Flächenmatrix - (Lebens)dauerprüfungen für Lötverbindungen

Technique d'assemblage des composants électroniques - Partie 4: Méthodes d'essais d'endurance des joints brasés des composants pour montage en surface à boîtiers de type matriciel

L'IEC 62137-4:2014 spécifie la méthode d'essai des joints brasés des boîtiers de type matriciel montés sur la carte de câblage imprimé, visant à évaluer la durabilité des joints brasés par rapport aux contraintes thermiques et mécaniques. La présente partie de l'IEC 62137 s'applique aux dispositifs à semiconducteurs pour montage en surface avec boîtiers de type matriciel (FBGA, BGA, FLGA et LGA) incluant les boîtiers de type à bornes périphériques (SON et QFN) qui sont destinés à être utilisés dans des matériels électriques ou électroniques industriels ou grand public. L'IEC 62137-4 inclut les modifications techniques majeures suivantes par rapport à l'IEC 62137:2004:
- les conditions d'essai pour l'utilisation d'une soudure sans plomb ont été incluses;
- les conditions d'essai pour des soudures sans plomb ont été ajoutées;
- les accélérations de l'essai de cycle de température pour des joints brasés ont été ajoutées.

Tehnologija elektronskega sestavljanja - 4. del: Metode za preskušanje vzdržljivosti kositrnih spojev elementov za površinsko montažo z okrovi z matričnimi priključki v ravnini

Ta del standarda IEC 62137 določa metode za preskušanje kositrnih spojev elementov za površinsko montažo z okrovi z matričnimi priključki v ravnini, ki so montirani na ploščo tiskanega vezja, za oceno vzdržljivosti kositrnih spojev pri toplotno-mehanskih obremenitvah. Ta del standarda IEC 62137 velja za polprevodniške elemente za površinsko montažo z okrovi z matričnimi priključki v ravnini (FBGA, BGA, FLGA in LGA), vključno s perifernimi priključki
(SON in QFN), ki so namenjeni uporabi v električni in elektronski industrijski in zabavni elektroniki.
Dejavnik pospešenega slabšanja kositrnih spojev priključkov pri preskusu kroženja temperature zaradi toplotne obremenitve pri montaži je opisan v dodatku A. Dodatek H ponuja nekaj razlag v povezavi z različnimi tipi mehanskih obremenitev pri montaži. Preskusna metoda, določena s tem standardom, ni namenjena oceni polprevodniških elementov.
OPOMBA 1 Pogoji pri montaži, materiali za spajkanje itd. pomembno vplivajo na rezultat preskusa, določenega s tem standardom. Zato preskus, opisan s tem standardom, ni mišljen kot preskus, ki je namenjen zagotavljanju zmožnosti montaže paketov.
OPOMBA 2 Ta preskusna metoda ni nujna, če kositrni spoji niso izpostavljeni obremenitvi (mehanski ali drugi) pri uporabi na terenu in obdelavi po montaži.

General Information

• Status: Published
• Publication Date: 13-Aug-2015
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 11-Feb-2015
• Due Date: 18-Apr-2015
• Completion Date: 14-Aug-2015
• Ref Project: EN 62137-4:2014 - Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

Relations

• Replaces: SIST EN 62137:2005 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
• Effective Date: 01-Sep-2015
• Corrected By: SIST EN 62137-4:2015/AC:2015 - Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
• Effective Date: 01-Sep-2015

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2015
1DGRPHãþD
SIST EN 62137:2005
7HKQRORJLMDHOHNWURQVNHJDVHVWDYOMDQMDGHO0HWRGH]DSUHVNXãDQMH
Y]GUåOMLYRVWLNRVLWUQLKVSRMHYHOHPHQWRY]DSRYUãLQVNRPRQWDåR]RNURYL]
PDWULþQLPLSULNOMXþNLYUDYQLQL
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area
array type package surface mount devices
Montageverfahren für elektronische Baugruppen - Teil 4: Oberflächenmontierbare
Bauteilgehäuse mit Flächenmatrix - (Lebens)dauerprüfungen für Lötverbindungen
Technique d'assemblage des composants électroniques - Partie 4: Méthodes d'essais
d'endurance des joints brasés des composants pour montage en surface à boîtiers de
type matriciel
Ta slovenski standard je istoveten z: EN 62137-4:2014
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 62137-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
December 2014
ICS 31.190
English Version
Electronics assembly technology -
Part 4: Endurance test methods for solder joint of area array type
package surface mount devices
(IEC 62137-4:2014)
Technique d'assemblage des composants électroniques - Montageverfahren für elektronische Baugruppen -
Partie 4: Méthodes d'essais d'endurance des joints brasés Teil 4: Oberflächenmontierbare Bauteilgehäuse mit
des composants pour montage en surface à boîtiers de Flächenmatrix - (Lebens-)Dauerprüfungen für
type matriciel Lötverbindungen
(CEI 62137-4:2014) (IEC 62137-4:2014)
This European Standard was approved by CENELEC on 2014-11-13. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62137-4:2014 E
Foreword
The text of document 91/1188/FDIS, future edition 1 of IEC 62137-4, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 62137-4:2014.

The following dates are fixed:
(dop) 2015-08-13
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2017-11-13
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62137-4:2014 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-1:1988+A1:1992 NOTE Harmonized as EN 60068-1:1994 (not modified).
IEC 60068-2-2 NOTE Harmonized as EN 60068-2-2.
IEC 60068-2-6 NOTE Harmonized as EN 60068-2-6.
IEC 60068-2-21:2006 NOTE Harmonized as EN 60068-2-21:2006 (not modified).
IEC 60068-2-27 NOTE Harmonized as EN 60068-2-27.
IEC 60068-2-44:1995 NOTE Harmonized as EN 60068-2-44:1995 (not modified).
IEC 60068-2-58:2004 NOTE Harmonized as EN 60068-2-58:2004 (not modified).
1)
IEC 60068-2-78:2001 NOTE Harmonized as EN 60068-2-78:2001 (not modified).
IEC 60749-1:2002 NOTE Harmonized as EN 60749-1:2003 (not modified).
IEC 60749-20:2008 NOTE Harmonized as EN 60749-20:2009 (not modified).
IEC 60749-20-1:2009 NOTE Harmonized as EN 60749-20-1:2009 (not modified).
IEC 61188-5-8 NOTE Harmonized as EN 61188-5-8.
IEC 61189-3:2007 NOTE Harmonized as EN 61189-3:2008 (not modified).
IEC 61189-5 NOTE Harmonized as EN 61189-5.
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1.
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2.
IEC 61760-1:2006 NOTE Harmonized as EN 61760-1:2006 (not modified).
IEC 62137-1-3 NOTE Harmonized as EN 62137-1-3.
IEC 62137-1-4:2009 NOTE Harmonized as EN 62137-1-4:2009 (not modified).

1)
Superseded by EN 60068-2-78:2013 (IEC 60068-2-78:2012): DOW = 2015-12-03.

- 3 - EN 62137-4:2014
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu
Publication Year Title EN/HD Year

IEC 60068-2-14 -  Environmental testing - EN 60068-2-14 -
Part 2-14: Tests - Test N: Change of
temperature
IEC 60191-6-2 -  Mechanical standardization of EN 60191-6-2 -
semiconductor devices -
Part 6-2: General rules for the preparation
of outline drawings of surface mounted
semiconductor device packages - Design
guide for 1,50 mm, 1,27 mm and 1,00 mm
pitch ball and column terminal packages
IEC 60191-6-5 -  Mechanical standardization of EN 60191-6-5 -
semiconductor devices -
Part 6-5: General rules for the preparation
of outline drawings of surface mounted
semiconductor device packages - Design
guide for fine-pitch ball grid array (FBGA)
IEC 60194 -  Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions
IEC 61190-1-3 -  Attachment materials for electronic EN 61190-1-3 -
assembly -
Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-
fluxed solid solders for electronic soldering
applications
IEC 61249-2-7 -  Materials for printed boards and other EN 61249-2-7 -
interconnecting structures -
Part 2-7: Reinforced base materials, clad
and unclad - Epoxide woven E-glass
laminated sheet of defined flammability
(vertical burning test), copper-clad
IEC 61249-2-8 -  Materials for printed boards and other EN 61249-2-8 -
interconnecting structures -
Part 2-8: Reinforced base materials, clad
and unclad - Modified brominated epoxide
woven fibreglass reinforced laminated
sheets of defined flammability (vertical
burning test), copper-clad
Publication Year Title EN/HD Year

IEC 62137-3 2011 Electronics assembly technology - EN 62137-3 2012
Part 3: Selection guidance of
environmental and endurance test
methods for solder joints
IEC 62137-4 ®
Edition 1.0 2014-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Electronics assembly technology –

Part 4: Endurance test methods for solder joint of area array type package

surface mount devices
Technique d'assemblage des composants électroniques –

Partie 4: Méthodes d'essais d'endurance des joints brasés des composants

pour montage en surface à boîtiers de type matriciel

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX X
ICS 31.190 ISBN 978-2-8322-1873-0

– 2 – IEC 62137-4:2014 © IEC 2014
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms definitions and abbreviations . 9
3.1 Terms and definitions . 9
3.2 Abbreviations . 9
4 General . 9
5 Test apparatus and materials . 10
5.1 Specimen . 10
5.2 Reflow soldering equipment . 10
5.3 Temperature cycling chamber . 10
5.4 Electrical resistance recorder . 10
5.5 Test substrate . 10
5.6 Solder paste . 11
6 Specimen preparation . 11
7 Temperature cycling test . 13
7.1 Pre-conditioning . 13
7.2 Initial measurement . 13
7.3 Test procedure . 13
7.4 End of test criteria. 15
7.5 Recovery . 15
7.6 Final measurement . 15
8 Temperature cycling life . 15
9 Items to be specified in the relevant product specification . 15
Annex A (informative) Acceleration of the temperature cycling test for solder joints . 17
A.1 General . 17
A.2 Acceleration of the temperature cycling test for an Sn-Pb solder joint . 17
A.3 Temperature cycling life prediction method for an Sn-Ag-Cu solder joint . 18
A.4 Factor that affects the temperature cycling life of the solder joint . 22
Annex B (informative) Electrical continuity test for solder joints of the package . 23
B.1 General . 23
B.2 Package and daisy chain circuit . 23
B.3 Mounting condition and materials . 23
B.4 Test method . 23
B.5 Temperature cycling test using the continuous electric resistance monitoring
system . 23
Annex C (informative) Reflow solderability test method for package and test substrate
land . 25
C.1 General . 25
C.2 Test equipment . 25
C.2.1 Test substrate. 25
C.2.2 Pre-conditioning oven . 25
C.2.3 Solder paste . 25
C.2.4 Metal mask for screen pr
...