Aerospace series - Quality management systems - Data Matrix Quality Requirements for Parts Marking

This standard defines uniform Quality and Technical requirements relative to metallic parts marking performed in using "Data Matrix symbology" used within the aerospace industry. The ISO/IEC 16022 specifies general requirements (data character encodation, error correction rules, decoding algorithm, etc.). In addition to ISO/IEC 16022 specification, part identification with such symbology is subject to the following requirements to ensure electronic reading of the symbol. The marking processes covered by this standard are as follows: -Dot peening -Laser -Electro-chemical etching Further marking processes will be included if required. This standard does not specify information to be encoded Unless specified otherwise in the contractual business relationship, the company responsible for the design of the part shall determine the location of the Data Matrix Marking. Symbol position should allow optimum illumination from all sides for readability.

Luft- und Raumfahrt - Qualitätsmanagementsystem - Data Matrix Qualitätsanforderungen für Teilemarkierung

Diese Norm legt einheitliche Qualitätsanforderungen und die technischen Lieferbedingungen in Bezug auf die Markierung von metallischen Teilen unter Anwendung der „Data-Matrix-Symbologie (Codeschemata)“ fest, die in der Luft- und Raumfahrtindustrie eingesetzt wird. ISO/IEC 16022 legt die allgemeinen Anforderungen (Daten¬zeichen¬codierung, Regeln zur Fehlerkorrektur, Decodieralgorithmus usw.) fest. Ergänzend zur ISO/IEC 16022-Spezi¬fikation unterliegt die Teilekennzeichnung mit einem derartigen Codeschema den folgen¬den Anforderungen, um ein elektronisches Lesen des Symbols sicherzustellen.
Folgende Markierverfahren sind in der vorliegenden Norm enthalten:
   Nadelprägung (Punktprägung);
   Lasergravur;
   elektrochemische Gravur.
Bei Bedarf werden weitere Markierverfahren aufgenommen.
Die vorliegende Norm legt nicht die zu codierenden Angaben fest.
Falls in der vertraglichen Geschäftsbeziehung nicht anders festgelegt, muss das für die Gestaltung des Teils verantwortliche Unternehmen die Lage der Data-Matrix-Markierung bestimmen. Die Lage des Symbols sollte zur besseren Lesbarkeit eine optimale Beleuchtung von allen Seiten ermöglichen.

Série aérospatiale - Systèmes de management de la qualité - Exigences qualité du marquage des pièces en code-barres Data Matrix

Aeronavtika - Sistem vodenja kakovosti - Zahteve za kakovost črtne kode Data Matrix za označevanje delov

General Information

Status
Withdrawn
Publication Date
25-Jun-2009
Withdrawal Date
05-Mar-2017
Technical Committee
Current Stage
9900 - Withdrawal (Adopted Project)
Start Date
03-Mar-2017
Due Date
26-Mar-2017
Completion Date
06-Mar-2017

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SLOVENSKI STANDARD
SIST EN 9132:2009
01-september-2009
$HURQDYWLND6LVWHPYRGHQMDNDNRYRVWL=DKWHYH]DNDNRYRVWþUWQHNRGH'DWD
0DWUL[]DR]QDþHYDQMHGHORY
Aerospace series - Quality management systems - Data Matrix Quality Requirements for
Parts Marking
Luft- und Raumfahrt - Qualitätsmanagementsystem - Data Matrix
Qualitätsanforderungen für Teilemarkierung
Série aérospatiale - Systèmes de management de la qualité - Exigences qualité du
marquage des pièces en code-barres Data Matrix
Ta slovenski standard je istoveten z: EN 9132:2006
ICS:
03.120.10 Vodenje in zagotavljanje Quality management and
kakovosti quality assurance
49.020 Letala in vesoljska vozila na Aircraft and space vehicles in
splošno general
SIST EN 9132:2009 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 9132:2009

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SIST EN 9132:2009
EUROPEAN STANDARD
EN 9132
NORME EUROPÉENNE
EUROPÄISCHE NORM
April 2006
ICS 03.120.10; 49.020

English Version
Aerospace series - Quality management systems - Data Matrix
Quality Requirements for Parts Marking
Série aérospatiale - Systèmes de management de la Luft- und Raumfahrt - Qualitätsmanagementsystem - Data
qualité - Exigences qualité du marquage des pièces en Matrix Qualitätsanforderungen für Teilemarkierung
code-barres Data Matrix
This European Standard was approved by CEN on 3 February 2006.
CEN members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national
standards may be obtained on application to the Central Secretariat or to any CEN member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN member into its own language and notified to the Central Secretariat has the same status as the official
versions.
CEN members are the national standards bodies of Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France,
Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania,
Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom.
EUROPEAN COMMITTEE FOR STANDARDIZATION
COMITÉ EUROPÉEN DE NORMALISATION
EUROPÄISCHES KOMITEE FÜR NORMUNG
Management Centre: rue de Stassart, 36  B-1050 Brussels
© 2006 CEN All rights of exploitation in any form and by any means reserved Ref. No. EN 9132:2006: E
worldwide for CEN national Members.

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SIST EN 9132:2009
EN 9132:2006 (E)
Contents Page
Foreword .3
1 Introduction.4
2 Normative references.4
3 Marking requirements.5
4 Marking verification.19
5 Marking validation and monitoring.19
Annex A (informative) Dot peening data capacity guidelines for selected surface textures.20
Annex B (informative) Dot peening – Recommendation for stylus grinding .22
Annex C (informative) Examples of required tolerances with reference to the nominal module
sizes for dot peening .23
(informative)
Annex D Examples of methodology for checking dot peen characteristics .25
Annex E (informative) Visual quality guidelines – Electro chemical etching .29


2

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SIST EN 9132:2009
EN 9132:2006 (E)
Foreword
This European Standard (EN 9132:2006) has been prepared by the European Association of Aerospace
Manufacturers - Standardization (AECMA-STAN).
After enquiries and votes carried out in accordance with the rules of this Association, this Standard has
received the approval of the National Associations and the Official Services of the member countries of
AECMA, prior to its presentation to CEN.
This European Standard shall be given the status of a national standard, either by publication of an identical
text or by endorsement, at the latest by October 2006, and conflicting national standards shall be withdrawn at
the latest by October 2006.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. CEN [and/or CENELEC] shall not be held responsible for identifying any or all such patent rights.
According to the CEN/CENELEC Internal Regulations, the national standards organizations of the following
countries are bound to implement this European Standard: Austria, Belgium, Cyprus, Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,
Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden,
Switzerland and the United Kingdom.

3

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SIST EN 9132:2009
EN 9132:2006 (E)
1 Introduction
1.1 Scope
This standard defines uniform Quality and Technical requirements relative to metallic parts marking performed
in using "Data Matrix symbology" used within the aerospace industry. The ISO/IEC 16022 specifies general
requirements (data character encodation, error correction rules, decoding algorithm, etc.). In addition to
ISO/IEC 16022 specification, part identification with such symbology is subject to the following requirements to
ensure electronic reading of the symbol.
The marking processes covered by this standard are as follows:
 Dot peening
 Laser
 Electro-chemical etching
Further marking processes will be included if required.
This standard does not specify information to be encoded
Unless specified otherwise in the contractual business relationship, the company responsible for the design of
the part shall determine the location of the Data Matrix Marking. Symbol position should allow optimum
illumination from all sides for readability.
1.2 Convention
The following conventions are used in this standard:
 The words “shall” and “must” indicate mandatory requirements.
 The word “should” indicates requirements with some flexibility allowed in compliance methodology.
Producers choosing other approaches to satisfy a “should” must be able to show that their approach
meets the intent of the requirement of this standard.
 The words “typical”, “example”, “for reference” or “e.g.” indicate suggestions given for guidance only.
 Appendices to this document are for information only and are provided for use as guidelines.
 Dimensions used in this document are as follows. Metric millimetre sizes followed by Inches in brackets
unless otherwise stated.
2 Normative references
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
ISO/IEC 16022, Information Technology — International Symbology Specification — Data Matrix.
EN 9102, Aerospace series — Quality Systems — First article inspection.
4

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SIST EN 9132:2009
EN 9132:2006 (E)
3 Marking requirements
3.1 General requirements
 Rows and columns:
Rows and columns connected with Data Matrix symbology shall conform to ECC200 in the ISO/IEC 16022
 Square versus rectangle:
Matrix may be square or rectangular within ECC200 requirements.
Square is preferred for easier reading.
 Quiet zone:
The quiet zone (margin) around the matrix shall be equal to or greater than one (1) module size.
 Round surface:
If the marking is made on round/curved surface, the symbol coverage shall be equal to or less than 16 %
of the diameter (or 5 % of circumference).
 Symbol size:
To facilitate electronic reading of symbol, the overall symbol size should be less than one 25,4 mm
(1.000 inch), outside dimension, longest side. Irrespective of matrix size used, the requirements included
in this standard shall be applied.
 Angular distortion of the symbol:
Angular deviation of 90-degree axes between row and column shall not exceed ± 7 degrees (see Figure 1
below).

Figure 1 — Angle of distortion
5

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SIST EN 9132:2009
EN 9132:2006 (E)
3.2 Dot peening
3.2.1 Description of process
Dot-peen marking technology typically produces round indentations on a part’s surface with a pneumatically or
electromechanically driven pin, otherwise known as a stylus. Critical to the readability of dot-peen marked
symbols are the indented dot’s shape, size, and spacing. The dot size and appearance are determined mostly
by the stylus cone angle, marking force, and material hardness. The indented dot created should be suitable
to trap or reflect light and large enough to be distinguishable from the parts surface roughness. It should also
have spacing wide enough to accommodate varying module sizes, placement, and illumination.
The issues involved in marking and reading dot-peen-marked symbols on metals are different than symbols
printed on paper. The first fundamental difference is that the contrast between dark and light fields is created
by artificial illumination of the symbol. Therefore, the module’s shape, size, spacing, and part surface finish
can all affect symbol readability.
The key to a successful dot-peen marking and reading project is to control the variables affecting the
consistency of the process. Symbol reading verification systems can provide feedback of the process
parameters to some extent. Marking system operating and maintenance procedures must be established to
help ensure consistent symbol quality. Regular maintenance schedules should be established to check for
issues such as stylus wear.
Additional processes, like machining dedicated surfaces, may be necessary to improve the symbol readability.
Cleaning the part surfaces prior to marking with an abrasive pad to remove coatings, rust, and discoloration,
or using an air knife to blow away excess machining fluids, debris, or oil can also increase the symbol
readability.
3.2.2 Instructions for determination of marking parameters
Determination of Determine minimum module size according to the surface

module size texture. See Table 1, Figure 2 (inch) or Figure 3 (mm).
Calculate dot size with regard to the above minimum module
Calculation of
size in choosing stylus angle (60°, 90° or 120°) depending on

optimum dot size
maximum depth allowed by Engineering Design requirements.
See Table 2 for the optimum dot size.
Determine matrix size depending on the information coded in
Determination of
the matrix. (Reference tables in Annex A for minimum matrix
matrix size
size based on available marking area).
Machine
Set up machine (e.g. in height, air pressure, force, etc.) for

set-up
desired dot geometry.

6

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SIST EN 9132:2009
EN 9132:2006 (E)
3.2.3 Requirements
 Data Matrix Symbol Nominal Module Size:
The surface texture of the part affects the quality of a Data Matrix symbol produced by dot peening. Table
1 and Figures 2 and 3 show the minimum readable module size requirements to the surface texture of the
part. The Engineering Design authority shall approve changes to the minimum module size.
Table 1 — Minimum readable module size by surface texture (Ra)
Surface Texture (Ra) Minimum module size
Microinches Micrometres Inches Millimetres
32 0,8 0.0075 0,19
63 1,6 0.0087 0,22
95 2,4 0.0122 0,31
125 3,2 0.0161 0,41
250 6,3 0.0236 0,60


0.02 50

0.02 00
0.01 50
0.01 00
0.00 50
0.00 00
0 50 100 150 200 250 300
S u rfac e T e x tu re R a (µ in c h )

Figure 2 — Minimum module size (inch) by surface texture (µinch)

7

Minimum Cell Size [inch]

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SIST EN 9132:2009
EN 9132:2006 (E)
0,70
0,65
0,60
0,55
0,50

0,45
0,40
0,35
0,30
0,25
0,20

0,15
0,10
0,05
0,00
0,00 1,00 2,00 3,00 4,00 5,00 6,00 7,00
S u rface T e xtu re R a (µ m )

Figure 3 — Minimum module size (mm) by surface texture (µm)
 Data capacity:
For information, tables in Annex A for Dot Peening show the symbol size and the data capacity compared
to the nominal module size and the number of rows and columns relative to surface texture. These tables
are based on practical testing.
 Data Matrix symbol quality requirements:
Below are the symbol quality requirements of the Data Matrix and marking equipment but these may vary
according to the design requirements and responsibility.
Dot depth is subject to Engineering Design requirements. The Dot depth is based upon the requirements
for process, environment survivability and other material considerations.
Stylus radius is also an Engineering Design requirement. The maximum tolerance shall not exceed 10 %
of the Stylus radius.
Surface colour and colour consistency may be specified as an Engineering Design requirement. In
order to maximize readability, variation in surface colour should be minimized.
Stylus cone angle (Ref α in Annex B) is an Engineering Design requirement. The cone angles permitted
are 60°, 90° and 120°. The tolerance on the cone angle shall be ± 2°. For general quality of mark and
stylus life, stylus cone angle of 120° is preferred.
Stylus point finish shall be polished. Surface texture shall not exceed 32 µinch or 0,8 µm. Guidance
instructions for grinding are given in Annex B.
Stylus point concentricity should be 0,04 mm (0.0016") total indicator reading, or 0,02 mm (0.0008")
radial point displacement. Point concentricity is referenced to stylus centerline. Hand held grinding of
stylus points is not permitted.
Dot size shall not exceed 105 % of the nominal module size and shall not be less than 60 % of the
nominal module size. The ovality (see Figure 4 below) of the dot shall not exceed 20 % of the module
size. No more than 2 % of the total number of modules may contain dots that are outside of these ranges.
The minimum dot size shall not be less than 0,132 mm (0.0054") unless approved by Engineering Design
authority.
8

Minimum Cell Size [mm]

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SIST EN 9132:2009
EN 9132:2006 (E)
D
1
Key
1 Module
D – d ≤≤ 20 % of the module size
≤≤
Figure 4 — Definition of ovality
Table 2 gives limits for dot size and dot centre offset useable whatever the nominal module size.
Table 2 — Limits for dot size and dot centre offset
Characteristic Requirement
Stylus angle 120°, 90°, 60°
Stylus point radius Subject to engineering design requirements
Dot size (% of the nominal module size) 60 % to 105 %
Dot centre offset (% of the nominal module size) 0 % to 20 %
Angle of distortion
± 7°

Figures 5 and 6 show definition of nominal module size, dot centre offset and dot size.
Nominal Module Size

Figure 5 — Definition of nominal module size, dot size and dot centre offset
9
d

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SIST EN 9132:2009
EN 9132:2006 (E)

Figure 6 — Detail definition of dot size

Annex C (Table C.1 in inches and Table C.2 in millimetres) contains examples of required tolerances in
comparison to the nominal module sizes.
 Data Matrix symbology marking on coloured or coated surfaces:
When marking is located on a coloured or coated surface, the marking parameters should be validated in
an actual production line environment on production or representative parts. The marking process must
demonstrate all requirements contained herein, and shall be verified and validated as per Clauses 4 and 5.
 Data Matrix symbology marking on surfaces which are subject to further surface treatments by abrasive
methods:
Surface treatments like shot peening and spindle deburr can affect the quality of a Data Matrix symbol.
Therefore the marking parameters should be validated in an actual production line environment on
production parts post-surface treatment. The marking process must demonstrate all requirements
contained herein, and shall be verified and validated as per Clauses 4 and 5.
3.3 Laser
3.3.1 Description of process
Laser marking
Laser marking is a process, which uses the thermal
energy of the laser beam to vaporize, melt / bond or
change the condition of the surface.
Due to the interaction of the laser beam with the
material surface, laser marking must not be used in the
following circumstances unless specifically approved
by Engineering Design authority:
1)
a) Classified components
b) Titanium alloys
NOTE 1 Any deviation from the above list requires
Engineering Design Authority.
Figure 7

1) Parts classification is the responsibility of the Engineering Design Authority and will be determined by results of an
appropriate failure annalysis. Parts classification refers to the component type, the failure of which will seriously hamper
operation. Parts classification will be instructed by component definition.
10

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SIST EN 9132:2009
EN 9132:2006 (E)

General information
Laser
beam
Any laser marking system consists of a laser source
(Nd:YAG, CO etc.) and a beam delivery system
2
(optics). The laser beam will be generated as a
Final lens
cone of light, which is focused by the beam delivery
system such that a parallel beam of light will be
Working
delivered at a particular distance from the final lens
distance
(working distance). The beam remains parallel for a
set distance before beginning to diverge again, this
Depth of
distance being defined as the depth of field of the
field
Laser spot
laser, again being dependent on the particular
size
optical configuration. The diameter of the beam is
known as the laser spot size. All of these
parameters are dependent on the particular optical
configuration of the laser marking station.

Figure 8 — Diagram illustrating typical laser
beam profile at working range
In theory, to ensure acceptable quality of the mark, the laser must impinge on the surface to be marked where
the beam is parallel i.e. nominally at the working distance of the final lens. Any height variation in the surface
to be marked (due to part curvature or other geometrical changes) should not exceed the depth of field –
deviations from this will lead to loss of clarity of the mark as the beam goes out of focus. Additionally it should
be noted that, as the laser spot size determines the area of impingement of the beam, it is not possible to
create a Data Matrix where the nominal module size is less than the laser spot size.
Laser etching/engraving
This mark involves the use of the laser to locally vaporize and melt material, leaving an engraved mark. As the
laser beam generates intense heat, there will be remnants of re-solidified material (recast layer) within the
mark. In addition, a local change in the microstructural characteristics may be observed, (Heat-Affected Zone),
dependent on material type. Where previous experience indicates a component experiences extreme levels of
stress, caution is advised as to the suitability of this method. Additionally, the high heat input of the laser may,
in certain circumstances, cause distortion of the component outside drawing limits, which may also render this
marking method unsuitable. Laser etching/engraving may also be used to selectively remove a paint or other
coating from a component. However consideration should be given to the possibility of localized corrosion if
the coating was originally applied as a form of corrosion protection. An increase in the depth of mark will tend
to improve in-service readability. However it may have a detrimental effect on local surface integrity, which is
also affected by extent of recast layer, heat-affected zone and microcracking. It is therefore the responsibility
of the design authority to define acceptable depth limits, dependent on component usage.
NOTE 2 Not all laser marking stations can produce an engraved mark on metallic materials, it depends on the lasing
medium.
Laser marking enhancers
Materials and methods exist that can assist in laser marking by the following:
 Increase mark contrast
 Allow for marking a wider range of items
 Improve laser marking cycle time
 Reduce the amount of laser power required
11

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SIST EN 9132:2009
EN 9132:2006 (E)
1) Laser bonding
This mark involves the use of a bonding medium, which is applied to the surface to be marked. The
laser fired at this locally bonds the medium to the metal substrate, leaving a raised mark. The
remains of the medium are then removed. Due to the fact that the mark is raised above the surface it
should not be used on contact surfaces. In addition, the mark should not be used in areas where
fretting of the mark or adjacent parts could be initiated.
NOTE 3 This marking process requires additional consumables. Careful control of the process is also
required as the laser needs to melt the medium without melting the underlying substrate. If the latter occurs, an
agglomeration of re-solidified medium and substrate is found immediately below the mark, and it is impossible to
quantify the effects on material properties.
2) Laser marking - Paint pigmentation.
Chemicals can be added in small amounts to some plastics that will react by changing colour when
contacted with a laser. This can be exploited by incorporating them into a paint which, when
contacted by the laser, will cause a local colour change through the paint without removing any of it
ie no resultant loss of corrosion protection. In some instances, prolonged exposure to natural light
may cause the colour contrast to reduce over time and so consideration should be given to the
required life of the mark.
Laser discoloration
This mark uses a lower energy density than marks involving material removal. The heat from the laser
discolours the material surface without associated metal removal, resulting in a mark that is flush and smooth.
Variations in colour change may be achieved by varying the laser parameters, and a variety of cosmetic
effects can be obtained, however normal aerospace applications will require a high contrast mark. As the
mark relies on thermally induced surface discoloration, it is unsuitable for applications where the component
operating temperature results in significant oxidation of the part, parts which are exposed to an aggressive
environment in operation or rework, or where the risk of fretting of the mark is present. Due to its relatively
non-aggressive application it can be considered suitable for thin sections and cooler components.
3.3.2 Limitations
Laser marking shall be permissible only if specified by the component definition and if it conforms to
Engineering Design requirements. Where laser marking is to be used on components in single crystal
materials or titanium alloys proof must be furnished that the process does not adversely affect the
component's properties, with this requirement applying in addition to the test requirements as per Clauses 4
and 5. Marking parts with laser must be described in a separate internal specification.
3.3.3 Instructions for determination of marking parameters
Determine matrix size (Length and width) according to the surface
texture and the number of characters coded in the matrix. The matrix
Determination of
size is a result of the module size and the number of characters in the
matrix size
matrix and is calculated according to the ECC200 code automatically.
Set up machine (e.g. in height, frequency, repetition of marking, etc.) for
Machine

desired Matrix geometry.
set-up
Load and Mark

Inspection
Inspect in accordance with this specification.
12

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SIST EN 9132:2009
EN 9132:2006 (E)
3.3.4 Requirements
Module depth is subject to Engineering Design requirements. The module depth is based upon the
requirements for process, environment survivability and other material considerations.
Surface colours and mark contrast will affect the readability of component identification. In general, dark
colours are applied to light surfaces and light markings applied to dark surfaces. The minimum contrast level
between the marking and its substrate as a grey density difference should be no less than 20 %. Contrast
levels can be checked using a Scale of Grey Density (see Figure 9).
Density Scale %

Figure 9 — A Scale of Grey Density
In order to maximize readability, original surface discoloration should be minimized.
The module fill shall be 60 % – 105 % of the nominal module size for acceptable quality. Thus an overlapping
of 5 % is permitted between modules.







Nominal Module Size

Figure 10 — Diagram showing laser marking with acceptable fill of modules

3.3.5 Metallographic
To determine marking parameters, which meet the requirements of Clause 4, process trials shall be
performed. In the course of these process trials representative transverse micro sections shall be evaluated to
make sure that the marking depth of plain-text markings and the depth and shape of Data Matrix symbols are
within the specified tolerances defined by Engineering Design authority. In addition, the acceptance limits for
width of recast layer and crack depth must be adhered to. Definitions of module depth and width are illustrated
below:
13

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SIST EN 9132:2009
EN 9132:2006 (E)
 Module depth refers to the maximum depth achieved by the laser in an engraved mark.
y y y
x
First pulse spike
(a) (b) (c)
Figure 11 — Diagram showing different laser engraved module profiles,
all of these will have the same module depth (x)
NOTE The maximum depth of engraving determines the effect on material properties. Any in-service degradation
of the component, which results in material surface removal (e.g. erosion, oxidation etc.) will obviously reduce the
effective depth of the laser mark. If the module depth is not uniform across the module, loss of depth may also result
in reduction of module fill. This could impact the readability of the mark in service. It is therefore desirable to make the
module depth consistent across the module where possible.
Figure 11 (a) shows a typical module profile for a very small module size (typically 0,1 mm / 0.004”)
where the laser traverse spirals into the centre of the module.
Figure 11 (b) shows a typical module profile for a larger module size (typically 0,2 mm / 0.008”) where the
laser traverses along the module in a series of parallel tracks.
Figure 11 (c) shows a typical module profile using a pulsed laser to engrave a mark where first pulse
suppression is not effectively employed.
 Module width (y) refers to the width of material removed on an engraved mark. It also refers to the width
of coloration on a discolored mark, the width of deposited material on a bonded mark.
Process trials shall generally be performed for all materials intended for laser marking. If different components
from the same material are laser marked, process trials are required only on one of these components or on a
representative sample. Each individual laser workstation should be validated.
In the course of the process trials the following parameters shall be specified as a minimum:
 Laser workstation (identification of laser marking facility)
 Lens focal length (in mm / inches)
 Feed rate (in mm per sec / inches per min)
 Frequency (in Hz)
 Laser power (or a proportional value)
 Marking frequency (repetition of marking / number of passes)
The results of the process trials shall be documented in a test report. If one of the above parameters is
changed, the process trials must be repeated.
14

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SIST EN 9132:2009
EN 9132:2006 (E)
3.3.6 Quality assurance
Maintenance of the laser marking facilities shall be in accordance with the group responsible for the
maintenance schedule. Care shall be taken to make sure that the laser source meets the specified
requirements.
To ensure a uniform laser marking quality, specimens shall be marked for at least one material at specified
intervals consistent with Engineering Design authority quality requirements. Transverse micro sections shall
be prepared and examined to validate that the requirements of Clause 5 are met. The results shall be
documented.
Prior to re-using a laser marking facility after prolonged disuse, re-location, after repairs of laser source, beam
guide system or optical elements, at least three different
...

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