SIST EN 60749-16:2004

Semiconductor devices - Mechanical and climatic test methods -- Part 16: Particle impact noise detection (PIND)

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren -- Teil 16: Nachweis des Teilchen-Aufprallgeräusches (PIND)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques -- Partie 16: Détection de bruit d'impact de particules (PIND)

Définit un essai permettant de détecter la présence de particules libres à l'intérieur d'un dispositif à cavité, comme des particules de céramique, des éléments de fil de liaison ou des boules de brasure (granulés).

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003)

General Information

• Status: Published
• Publication Date: 30-Jun-2004
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Jul-2004
• Due Date: 01-Jul-2004
• Completion Date: 01-Jul-2004
• Ref Project: EN 60749-16:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

Standards Content (Sample)

SIST EN 60749-16:2004SLOVENSKIjulij 2004
STANDARDSemiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003)©
Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljenoReferenčna številkaSIST EN 60749-16:2004(en)ICS31.080.01







EUROPEAN STANDARD
EN 60749-16 NORME EUROPÉENNE EUROPÄISCHE NORM
April 2003 CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-16:2003 E
ICS 31.080.01
English version
Semiconductor devices -
Mechanical and climatic test methods Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003)
Dispositifs à semiconducteurs -
Méthodes d'essais mécaniques
et climatiques Partie 16: Détection de bruit d'impact
de particules (PIND) (CEI 60749-16:2003)
Halbleiterbauelemente -
Mechanische und klimatische PrüfverfahrenTeil 16: Nachweis des Teilchen-Aufprallgeräusches (PIND) (IEC 60749-16:2003)
This European Standard was approved by CENELEC on 2003-03-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.



EN 60749-16:2003 - 2 - Foreword
The text of document 47/1662/FDIS, future edition 1 of IEC 60749-16, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-16 on 2003-03-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop) 2003-12-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow) 2006-03-01 __________
Endorsement notice
The text of the International Standard IEC 60749-16:2003 was approved by CENELEC as a European Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1:2001 (not modified). __________



NORMEINTERNATIONALECEIIECINTERNATIONALSTANDARD60749-16Première éditionFirst edition2003-01Dispositifs à semiconducteurs –Méthodes d'essais mécaniques et climatiques –Partie 16:Détection de bruit d'impact de particules (PIND)Semiconductor devices –Mechanical and climatic test methods –Part 16:Particle impact noise detection (PIND)Pour prix, voir catalogue en vigueurFor price, see current catalogue IEC 2003
Droits de reproduction réservés
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Copyright - all rights reservedAucune partie de cette publication ne peut être reproduite niutilisée sous quelque forme que ce soit et par aucun procédé,électronique ou mécanique, y compris la photocopie et lesmicrofilms, sans l'accord écrit de l'éditeur.No part of this publication may be reproduced or utilized in anyform or by any means, electronic or mechanical, includingphotocopying and microfilm, without permission in writing fromthe publisher.International Electrotechnical Commission,
3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: [phone]
Telefax: [phone]
E-mail: [e-mail]
Web: www.iec.chCODE PRIXPRICE CODEGCommission Electrotechnique InternationaleInternational Electrotechnical CommissionМеждународная Электротехническая Комиссия



60749-16  IEC:2003– 3 –INTERNATIONAL ELECTROTECHNICAL COMMISSION____________SEMICONDUCTOR DEVICES –MECHANICAL AND CLIMATIC TEST METHODS –Part 16: Particle impact noise detection (PIND)FOREWORD1)The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprisingall national electrotechnical committees (IEC National Committees). The object of the IEC is to promoteinternational co-operation on all questions concerning standardization in the electrical and electronic fields. Tothis end and in addition to other activities, the IEC publishes International Standards. Their preparation isentrusted to technical committees; any IEC National Committee interested in the subject dealt with mayparticipate in this preparatory work. International, governmental and non-governmental organizations liaisingwith the IEC also participate in this preparation. The IEC collaborates closely with the InternationalOrganization for Standardization (ISO) in accordance with conditions determined by agreement between thetwo organizations.2)The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, aninternational consensus of opinion on the relevant subjects since each technical committee has representationfrom all interested National Committees.3)The documents produced have the form of recommendations for international use and are published in the formof standards, technical specifications, technical reports or guides and they are accepted by the NationalCommittees in that sense.4)
In order to promote international unification, IEC National Committees undertake to apply IEC InternationalStandards transparently to the maximum extent possible in their national and regional standards. Anydivergence between the IEC Standard and the corresponding national or regional standard shall be clearlyindicated in the latter.5)
The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for anyequipment declared to be in conformity with one of its standards.6)
Attention is drawn to the possibility that some of the elements of this International Standard may be the subjectof patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.International Standard IEC 60749-16 has been prepared by IEC technical committee 47:Semiconductor devices.The text of this standard is based on the following documents:FDISReport on voting47/1662/FDIS47/1679/RVDFull information on the voting for the approval of this standard can be found in the report onv
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