Standard Specification for Type 58 Borosilicate Sealing Glass

ABSTRACT
This specification covers type 58 borosilicate sealing glass for use in electronic applications. The glass material shall conform to the chemical composition requirements prescribed. The material shall conform to the physical and electrical properties prescribed. The glass shall have a finish that ensures smooth, even surfaces and freedom from cracks, checks, bubbles, and other flaws of a character detrimental to the strength or life of the component or device for which its use is intended. The softening point and annealing point shall be tested to meet the requirements prescribed. The thermal expansion coefficient of the glass material shall be determined using the required procedure. The contracting coefficient of the glass material shall be tested to meet the requirements prescribed. The thermal contraction match between the glass and a sealing alloy may be determined by preparing and testing an assembly to meet the requirements prescribed.
SCOPE
1.1 This specification covers Type 58 borosilicate sealing glass for use in electronic applications.
Note 1—This specification is primarily intended to consider glass as most generally used, that is, glass in its transparent form as normally encountered in fabricating electronic devices. X1.3 refers to a sealing alloy that is compatible with this glass. Type 58 glass in other forms such as powdered, crushed, sintered, fibrous, etc., are excluded. The requirements of this specification, as applied to these forms, must be established in the raw glass prior to its conversion.

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ASTM F105-72(2010) - Standard Specification for Type 58 Borosilicate Sealing Glass
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NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation:F105 −72(Reapproved2010)
StandardSpecification for
Type 58 Borosilicate Sealing Glass
ThisstandardisissuedunderthefixeddesignationF105;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 3. Ordering Information
1.1 This specification covers Type 58 borosilicate sealing 3.1 Orders for material under this specification shall include
glass for use in electronic applications. the following information:
3.1.1 Form,
NOTE 1—This specification is primarily intended to consider glass as
3.1.2 Type of glass,
most generally used, that is, glass in its transparent form as normally
3.1.3 Dimensions,
encountered in fabricating electronic devices. X1.3 refers to a sealing
alloy that is compatible with this glass. Type 58 glass in other forms such
3.1.4 Marking and packaging, and
as powdered, crushed, sintered, fibrous, etc., are excluded. The require-
3.1.5 Certification (if required).
ments of this specification, as applied to these forms, must be established
in the raw glass prior to its conversion.
4. Chemical Composition
2. Referenced Documents 4.1 The typical chemical composition of this glass is as
2 follows (Note 2):
2.1 ASTM Standards:
Weight %
C336 Test Method for Annealing Point and Strain Point of
Glass by Fiber Elongation
Major Constituents:
C338 Test Method for Softening Point of Glass
Silica (SiO ) 65.0
Alumina (Al O)7.5
2 3
C598 Test Method for Annealing Point and Strain Point of
Boron oxide (B O ) 18.0
2 3
Glass by Beam Bending
Soda (Na O) 2.0
D150 Test Methods forAC Loss Characteristics and Permit- Potash (K O) 3.0
Barium oxide (BaO) 3.0
tivity (Dielectric Constant) of Solid Electrical Insulation
Minor Constituents:
D257 Test Methods for DC Resistance or Conductance of
Lithium oxide (Li O) 0.6
Insulating Materials Fluorine (F) 0.6, max
Reducible oxides (Note 3) 0.05, max
E29 Practice for Using Significant Digits in Test Data to
Determine Conformance with Specifications
NOTE 2—Major constituents may be adjusted to give the desired
electricalandphysicalpropertiestotheglass.However,nochangeshallbe
E228 Test Method for Linear Thermal Expansion of Solid
made that alters any of these properties without due notification of, and
Materials With a Push-Rod Dilatometer
approval by, the user.
F14 Practice for Making and Testing Reference Glass-Metal
NOTE 3—Total of arsenic trioxide (As O ), antimony trioxide (Sb O ),
2 3 2 3
Bead-Seal
and lead oxide (PbO).
F15 Specification for Iron-Nickel-Cobalt Sealing Alloy
5. Physical Requirements
F140 Practice for Making Reference Glass-Metal Butt Seals
and Testing for Expansion Characteristics by Polarimetric
5.1 The material shall conform to the physical properties
Methods
prescribed in Table 1. For electrical properties see Table 2, and
F144 Practice for Making Reference Glass-Metal Sandwich
its Footnote A.
Seal and Testing for Expansion Characteristics by Polari-
6. Finish and Workmanship
metric Methods
6.1 The glass shall have a finish that ensures smooth, even
surfaces and freedom from cracks, checks, bubbles, and other
This specification is under the jurisdiction of ASTM Committee C14 on Glass
flaws of a character detrimental to the strength or life of the
and Glass Products and is the direct responsibility of Subcommittee C14.04 on
Physical and Mechanical Properties.
component or device for which its use is intended.
Current edition approved April 1, 2010. Published May 2010. Originally
approved in 1968. Last previous edition approved in 2005 as F105 – 72 (2005).
7. Test Methods
DOI: 10.1520/F0105-72R10.
For referenced ASTM standards, visit the ASTM website, www.astm.org, or 7.1 Softening Point—Test Method C338.
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
7.2 Annealing Point—Test Method C336 and Test Method
Standards volume information, refer to the standard’s Document Summary page on
the ASTM website. C598.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
F105−72(Reapproved2010)
TABLE 1 Physical Requirements
A
Property ASTM Test Method Condition Value
Softening point C338 see 7.1 715 ± 10°C
Annealing point C336 or C598 see 7.2 480 ± 10°C
Thermal expansion coefficient E228 see 7.3 4.65 ± 0.20 ppm/°C
0 to 300°C
Contraction coefficient E228 see 7.4 5.8 ± 0.20 ppm/°C
(annealing point minus 15 to 30°C)
A
Test methods and conditions are detailed in the appropriately referenced section of this specification.
A
TABLE 2 Electrical Properties
mal contraction curve and calculate the mean coefficient of
ASTM Test Condition,
linear thermal contraction between a point 15°C below the
Property Typical Value
Method °C
annealing point and 30°C in accordance with Procedure B of
Volume resistivity (dc) D257 25 log R (Ω·cm)
Test Method E228.
17.0
250 log R (Ω·cm)
7.5 Bead Seal Test—Thethermalcontractionmatchbetween
9.1
the glass and a sealing alloy may be determined by preparing
350 log R (Ω·cm)
...

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