ASTM B813-00(2009)
(Specification)Standard Specification for Liquid and Paste Fluxes for Soldering of Copper and Copper Alloy Tube
Standard Specification for Liquid and Paste Fluxes for Soldering of Copper and Copper Alloy Tube
ABSTRACT
This guide establishes the requirements and test methods for liquid and paste fluxes for joining by soldering of copper and copper alloy tube and fittings in plumbing, heating, air conditioning, mechanical, fire sprinkler, and other similar systems. There shall be a clear indication that in the areas of flux reaction, the sheets shall show a corrosion and residue-free surface comparable with the unwetted areas as determined by visual inspection. Samples of flux taken for the purpose of the tests listed in this specification shall be selected from the stock of the manufacturer and shall be representative of the material being evaluated. The specimen shall undergo the spreading test wherein the oven shall be equipped with a sight glass for visible control of the melting of the solder. The specimen shall then pass the aggressiveness test wherein the aggressiveness of the flux is determined by means of a resistivity test of an aqueous solution of the flux residue. The conductivity cell to be used shall be kept immersed in distilled water at ambient temperature for a given minimum number of hours before use. Resistivity tests shall be performed for both soldered and unsoldered specimen. The specimen shall then undergo corrosive test by being dipped onto ethanol.
SCOPE
1.1 This specification establishes the requirements and test methods for liquid and paste fluxes for joining by soldering of copper and copper alloy tube and fittings in plumbing, heating, air conditioning, mechanical, fire sprinkler, and other similar systems.
Note 1—This specification does not apply to fluxes intended for electronic applications.
1.2 Solder fluxes are to be tested in accordance with the requirements of this specification by an independent testing laboratory. Testing, measuring equipment, and inspection facilities shall be of sufficient accuracy and quality to comply with the requirements of this specification.
1.3 Units—The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
1.4 The following hazard caveat pertains to Sections 11-19. This standard does not purport to address the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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Designation: B813 – 00 (Reapproved 2009)
Standard Specification for
Liquid and Paste Fluxes for Soldering of Copper and
Copper Alloy Tube
This standard is issued under the fixed designation B813; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
INTRODUCTION
This specification covers a series of specific requirements for liquid and paste fluxes. It also
incorporates a series of test methods that establish the procedures on how to measure these properties.
Theformatofthisspecificationinitiallydefinesthespecificationrequirementsfollowedbythespecific
test methods in the order in which they are to be performed.
1. Scope 2.2 ASTM Standards:
B32 Specification for Solder Metal
1.1 This specification establishes the requirements and test
B88 Specification for Seamless Copper Water Tube
methods for liquid and paste fluxes for joining by soldering of
B88M Specification for Seamless CopperWaterTube (Met-
copper and copper alloy tube and fittings in plumbing, heating,
ric)
air conditioning, mechanical, fire sprinkler, and other similar
B152/B152M Specification for Copper Sheet, Strip, Plate,
systems.
and Rolled Bar
NOTE 1—This specification does not apply to fluxes intended for
B280 Specification for Seamless Copper Tube forAir Con-
electronic applications.
ditioning and Refrigeration Field Service
1.2 Solder fluxes are to be tested in accordance with the
B846 Terminology for Copper and Copper Alloys
requirements of this specification by an independent testing
D130 Test Method for Corrosiveness to Copper from Pe-
laboratory. Testing, measuring equipment, and inspection fa-
troleum Products by Copper Strip Test
cilities shall be of sufficient accuracy and quality to comply
D1200 Test Method for Viscosity by Ford Viscosity Cup
with the requirements of this specification.
2.3 Other:
1.3 Units—The values stated in SI units are to be regarded
1986 Amendments to the Safe Drinking Water Act
as standard. No other units of measurement are included in this
3. General Requirements
standard.
1.4 The following hazard caveat pertains to Sections 11-19.
3.1 The flux shall be suitable for joining copper tube and
This standard does not purport to address the safety problems,
fittings by soldering in the size ranges shown in Table 1 of
if any, associated with its use. It is the responsibility of the user
Specifications B88 and B88M and Tables 4 and 5 of Specifi-
of this standard to establish appropriate safety and health
cation B280.
practices and determine the applicability of regulatory limita-
3.2 The flux shall remain active over the temperature range
tions prior to use.
of the soldering operation, removing and excluding oxides
from the metal surfaces in the joint.
2. Referenced Documents
2.1 The following documents of the issue in effect on the
date of materials purchase form a part of this specification to
the extent referenced herein:
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
This specification is under the jurisdiction of Committee B05 on Copper and contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
CopperAlloys and is the direct responsibility of Subcommittee B05.04 on Pipe and Standards volume information, refer to the standard’s Document Summary page on
Tube. the ASTM website.
Current edition approved Feb. 15, 2009. Published February 2009. Originally AvailablefromU.S.GovernmentPrintingOfficeSuperintendentofDocuments,
´1
approved in 1991. Last previous edition approved in 2000 as B813 – 00 . DOI: 732 N. Capitol St., NW, Mail Stop: SDE, Washington, DC 20401, http://
10.1520/B0813-00R09. www.access.gpo.gov.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
B813 – 00 (2009)
3.3 The flux shall be suitable for use with all solders listed
Classification Description
in Table 5 of Specification B32 as well as the more recently
1 Slight tarnish
developed solder alloys suitable for the applications in the
2 Moderate tarnish
scope of this specification.
3 Dark tarnish
3.4 The flux shall allow the solder to adequately wet and
8. Viscosity Requirements
spread on the surfaces being soldered.
3.5 The flux residue shall be water flushable after soldering. 8.1 The viscosity of liquid fluxes shall be less than 180 s as
determined using a No. 2 Ford flow cup in accordance with
3.6 The flux residue shall not be corrosive after soldering.
3.7 The flux shall not release toxic fumes during the Section 18.
soldering operation or toxic substances into the water in the
9. Residue Flushing Requirements
completed system.
3.8 The flux shall adhere to the copper and copper alloys 9.1 Flushing of the residue shall be determined by weight
under anticipated temperature, joint geometry, joint position, loss.
job site, and weather conditions. 9.2 The loss of weight of each sheet shall be determined by
3.9 The flux shall not contain more than 0.2 % lead in comparing the average weight before and after the test proce-
accordance with the 1986 Amendments to the Safe Drinking
dure. The weight loss of the flux residue shall be more than
Water Act. 99 % in accordance with Section 19.
~c 2 a!
% Weight Loss ~d! 5 100 2 3 100 (2)
4. Terminology
~b 2 a!
4.1 For terms related to copper and copper alloys, refer to
where:
Terminology B846 for terms specific to this standard.
a = weight of degreased, flushing-test sheet, g;
4.2 Definition:
b = weight of degreased, flushing-test sheet plus the
4.2.1 flux, n—a chemically active substance that is used to
weight of applied flux, g; and
remove and exclude oxides from the joint area during heating
c = weight of dried, flushing-test sheet after flushing, g.
and that ensures that the melted solder will wet the surfaces to
be joined.
10. Sampling
10.1 Samples of flux taken for the purpose of the tests listed
5. Spreading Factor
in this specification shall be selected from the stock of the
5.1 Spreading of the solder is determined by measuring the
manufacturer and shall be representative of the material being
height (h) of a solder bead on a standard test sheet following
evaluated.
the specified heating cycle. Spread factor (SF) is calculated as
follows:
11. Specimen Preparation
SF 5 100 ~1.0 2 h! (1) 11.1 Standard Quantity of Solder Metal—A standard quan-
tity of solder metal shall be a sample of 60:40 tin-lead (Alloy
Grade Sn60), measuring 6.0 mm in diameter by 0.86 mm in
where:
thickness, weighing approximately 0.21 g, that has been
h = the maximum height of the solder bead, mm.
degreased with trichloroethylene.
5.2 A flux is considered to have acceptably influenced the
11.2 Standard Quantity of Flux—Astandardquantityofflux
spreading of solder on the copper surfaces when the average
shall be 0.003 mL as measured by a precision pipet or other
spreading factor is at least 50 (see Section 13).
volumetric measuring devices with equivalent precision.
5.3 The spreading test shall show a balanced action by
11.3 Standard Test Sheet—A standard test sheet shall be a
forming a regular and even solder layer.
piece of copper 35 by 35 by 1 mm thick of Copper UNS No.
C12200 (deoxidized high residual phosphorus) produced in
6. Aggressiveness Requirements
accordance with Specifications B152/B152M.
6.1 From a standard test sheet on which a specimen has
11.3.1 Preparation:
been prepared with solder (see Section 15), the resistivity of
11.3.1.1 The sheet is abraded three times with a waterproof
the aqueous solution shall be more than 100 000 V cm.
sand or emery paper (Grit No. 360), each time perpendicular to
6.2 From a standard test sheet on which a specimen has
the previous direction. One corner of each test sheet shall be
beenpreparedwithoutsolder(seeSection16),theresistivityof
bent upwards to permit handling. It is degreased with calcium
the aqueous solution shall be more than 85 000 V cm.
carbonate mixed with water to a paste consistency with which
the test sheet is rubbed using a wad of cotton. The residue is
7. Corrosiveness Requirements
flushed off by a strong jet of tap water. The test sheet is
7.1 There shall be a clear indication that in the areas of flux considered to be degreased when it is completely moistened by
reaction, the sheets shall show a corrosion and residue-free water when flushed.
surface comparable with the unwetted areas as determined by 11.3.1.2 In any of the following steps in which the test
visual inspection in accordance with Section 17. sheets must be handled, use forceps or laboratory tongs. The
7.2 Corrosiveness shall be reported in accordance with one sheet is then etched for 15 s in an etching solution formulated
of the classifications listed as follows (see Test Method D130): as follows:
B813 – 00 (2009)
(a) Etching Solution—(1-L etching solution contains 200-g 13.3.2 The period for which the test sheet shall be outside
chromic acid anhydride (CrO ) and 125-mL sulfuric acid the oven for application of the solder metal shall not exceed 10
(specific gravity 1.84) reagent grade, balance distilled water, s.
diluted to 1 L.) 13.3.3 Remove test sheet from the ethanol, allow to dry, and
(b)Finally,thesheetisrinsedthoroughlywithdistilledwater apply a standard quantity of flux. Spread the flux with a
(60 to 70°C), immersed in ethanol (ACS Grade), and allowed standard quantity of solder metal to an area of about 15 mm in
to dry. diameter and then remove the solder metal.
11.4 Resistivity Test Specimen—The resistivity test speci- 13.3.4 Heat the test sheet with flux for 30 s in an oven at
men is the condition of the standard test sheet on which have 275°C. Afterwards, replace the standard quantity of solder
been deposited standard quantities of flux and solder metal metal that was used to spread the flux on the test sheet and heat
before they are placed in the oven. the assembly for 3 min at a temperature of 275°C in the oven.
11.4.1 Preparation: 13.3.5 After the test specimen has cooled to room tempera-
11.4.1.1 Remove test sheet from the liquid ethanol, allow to ture and been cleaned, measure the solder height by means of
dry, and apply a standard quantity of flux. With a standard a flat micrometer three times, average the values, and calculate
quantity of solder metal, spread the flux to an area of about 15 the spreading factor as in 5.1.
mm in diameter. 13.4 Calculation—After five tests, the highest and lowest
11.4.1.2 Placethetestsheetwithfluxandsoldermetalinthe figures are excluded. Calculate the average of the remaining
oven where it remains for 3 min at a temperature of 275°C three.
from the time the solder melts. Remove the specimen and
14. Aggressiveness Test
allow to cool to ro
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