ASTM F72-17e1

Standard Specification for Gold Wire for Semiconductor Lead Bonding

ABSTRACT
This specification covers round drawn/extruded gold wires for internal semiconductor device electrical connections. The wires are available in four classifications, namely: copper-modified wire, beryllium-modified wire, high-strength wire, and special purpose wire. Aptly sampled wires shall be examined by test methods suggested herein, and each class shall conform correspondingly to specified requirements for chemical composition, mechanical properties (breaking load and elongation), dimension (diameter and weight), and workmanship and finish. The wires shall also undergo wire curl, wire axial twist, and wire roundness tests.
SCOPE
1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strength wire, and (4) special purpose wire.  
Note 1: Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties, or both. This practice is known variously as “modifying,” “stabilizing,” or “doping.” The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, “high-strength” and “special purpose” wire, the identity of modifying additives is not restricted.  
1.2 The values stated in SI units shall be regarded as the standard.  
1.2.1 A mixed system of metric and inch-pound units is in widespread use for specifying semiconductor lead-bonding wire. SI-equivalent values of other commonly used units are denoted by parentheses in text and tables.  
1.3 The following hazard caveat pertains only to the test method portion, Section 9, of this specification.  This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

General Information

• Status: Historical
• Publication Date: 30-Nov-2017
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: F01 - Electronics
• Drafting Committee: F01.03 - Metallic Materials, Wire Bonding, and Flip Chip

Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
´1
Designation:F72 −17
Standard Specification for
1
Gold Wire for Semiconductor Lead Bonding
This standard is issued under the fixed designation F72; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1
ε NOTE—In 9.3.1, the reference to Test Methods E16 was corrected to Test Methods F16 editorially in March 2020.
1. Scope 2. Referenced Documents
2
1.1 This specification covers round drawn/extruded gold 2.1 ASTM Standards:
wire for internal semiconductor device electrical connections. F16 Test Methods for Measuring Diameter or Thickness of
Four classifications of wire are distinguished, (1) copper- Wire and Ribbon for Electronic Devices and Lamps
modified wire, (2) beryllium-modified wire, (3) high-strength F205 Test Method for Measuring Diameter of Fine Wire by
wire, and (4) special purpose wire. Weighing
F219 Test Methods of Testing Fine Round and Flat Wire for
NOTE 1—Trace metallic elements have a significant effect upon the
Electron Devices and Lamps
mechanical properties and thermal stability of high-purity gold wire. It is
F584 Practice for Visual Inspection of Semiconductor Lead-
customary in manufacturing to add controlled amounts of selected
3
impurities to gold to modify or stabilize bonding wire properties, or both.
Bonding Wire (Withdrawn 2015)
This practice is known variously as “modifying,” “stabilizing,” or
“doping.” The first two wire classifications denoted in this specification
3. Ordering Information
refer to wire made with either of two particular modifiers, copper or
3.1 Orders for material under this specification shall include
beryllium, in general use. In the third and fourth wire classifications,
“high-strength” and “special purpose” wire, the identity of modifying the following information:
additives is not restricted.
3.1.1 Classification: copper-modified, beryllium-modified,
high strength, or special purpose,
1.2 The values stated in SI units shall be regarded as the
3.1.2 Quantity,
standard.
3.1.3 Purity (Section 4),
1.2.1 A mixed system of metric and inch-pound units is in
3.1.4 Type, hard, stress relieved, or annealed (Section 5),
widespread use for specifying semiconductor lead-bonding
3.1.5 Breaking load and percentage elongation range (Sec-
wire. SI-equivalent values of other commonly used units are
tion 5),
denoted by parentheses in text and tables.
3.1.6 Wire diameter (Section 6),
1.3 The following hazard caveat pertains only to the test
3.1.7 Spool type, length of wire per spool, and type of wind
method portion, Section 9, of this specification. This standard
(Section 11),
does not purport to address all of the safety concerns, if any,
3.1.8 Despooling, left-handed unwind or right-handed un-
associatedwithitsuse.Itistheresponsibilityoftheuserofthis
wind (Section 11), and,
standard to establish appropriate safety, health, and environ-
3.1.9 Packaging and marking (Section 12).
mental practices and determine the applicability of regulatory
limitations prior to use.
4. Chemical Composition
1.4 This international standard was developed in accor-
4.1 Beryllium-modified material shall conform to the
dance with internationally recognized principles on standard-
chemical requirements specified in Table 1.
ization established in the Decision on Principles for the
4.2 High-strength material shall conform to the chemical
Development of International Standards, Guides and Recom-
requirements specified in Table 2.
mendations issued by the World Trade Organization Technical
Barriers to Trade (TBT) Committee.
4.3 Special purpose material shall be in accordance with
Table 3.
1
This specification is under the jurisdiction of ASTM Committee F01 on
2
Electronics and is the direct responsibility of Subcommittee F01.03 on Metallic For referenced ASTM standards, visit the ASTM website, www.astm.org, or
Materials, Wire Bonding, and Flip Chip. contact ASTM Customer Service at [e-mail]. For Annual Book of ASTM
Current edition approved Dec. 1, 2017. Published January 2018. Originally Standards volume information, refer to the standard’s Document Summary page on
approved in 1966. Last previous edition approved in 2006 as F72 – 06 which was the ASTM website.
3
withdrawn January 2015 and reinstated in December 2017. DOI: 10.1520/F0072- The last approved version of this historical standard is referenced on
17E01. www.astm.org.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
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F72−17
TABLE 1 Chemical Requirements, Beryllium-Modified Gold TABLE 5 Breaking Load and Elongation of Stress Rel
...

This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
´1
Designation: F72 − 17 F72 − 17
Standard Specification for
1
Gold Wire for Semiconductor Lead Bonding
This standard is issued under the fixed designation F72; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1
ε NOTE—In 9.3.1, the reference to Test Methods E16 was corrected to Test Methods F16 editorially in March 2020.
1. Scope
1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four
classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strength wire, and (4)
special purpose wire.
NOTE 1—Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary
in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties, or both. This practice is known
variously as “modifying,” “stabilizing,” or “doping.” The first two wire classifications denoted in this specification refer to wire made with either of two
particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, “high-strength” and “special purpose” wire, the
identity of modifying additives is not restricted.
1.2 The values stated in SI units shall be regarded as the standard.
1.2.1 A mixed system of metric and inch-pound units is in widespread use for specifying semiconductor lead-bonding wire.
SI-equivalent values of other commonly used units are denoted by parentheses in text and tables.
1.3 The following hazard caveat pertains only to the test method portion, Section 9, of this specification. This standard does
not purport to address all of the safety, health, and environmental safety concerns, if any, associated with its use. It is the
responsibility of the user of this standard to establish appropriate safety safety, health, and healthenvironmental practices and
determine the applicability of regulatory limitations prior to use.
1.4 This international standard was developed in accordance with internationally recognized principles on standardization
established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued
by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
2. Referenced Documents
2
2.1 ASTM Standards:
E16F16 Method of Free Bend Test for Ductility of WeldsTest Methods for Measuring Diameter or Thickness of Wire and Ribbon
for Electronic Devices and Lamps (Withdrawn 1978)
F205 Test Method for Measuring Diameter of Fine Wire by Weighing
F219 Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
3
F584 Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015)
3. Ordering Information
3.1 Orders for material under this specification shall include the following information:
3.1.1 Classification: copper-modified, beryllium-modified, high strength, or special purpose,
3.1.2 Quantity,
3.1.3 Purity (Section 4),
3.1.4 Type, hard, stress relieved, or annealed (Section 5),
3.1.5 Breaking load and percentage elongation range (Section 5),
3.1.6 Wire diameter (Section 6),
1
This specification is under the jurisdiction of ASTM Committee F01 on Electronics and is the direct responsibility of Subcommittee F01.03 on Metallic Materials, Wire
Bonding, and Flip Chip.
Current edition approved Dec. 1, 2017. Published January 2018. Originally approved in 1966. Last previous edition approved in 2006 as F72 – 06 which was withdrawn
January 2015 and reinstated in December 2017. DOI: 10.1520/F0072-17.10.1520/F0072-17E01.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at [e-mail]. For Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
3
The last approved version of this historical standard is referenced on www.astm.org.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1

---------------------- Page: 1 ----------------------
´1
F72 − 17
3.1.7 Spool type, length of wire per spool, and type of wind (Section 11),
3.1.8 Despooling, left-handed unwind or right-handed un-
wind (Section 11), a
...