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ASTM D2739-97(2010)

(Test Method)

Standard Test Method for Volume Resistivity of Conductive Adhesives

Standard Test Method for Volume Resistivity of Conductive Adhesives

SIGNIFICANCE AND USE
Accurate measurement of the volume resistivity of conductive adhesives is important, particularly with respect to applications in electronic packaging techniques. This method measures the resistance of conductive adhesives used in thin films as part of a bonded assembly. This does not imply that the measured results are applicable to different configurations with different metals. This method may be used for acceptance testing and for screening materials.
SCOPE
1.1 This test method covers the determination of the volume resistivity of resin-based conductive adhesives in the cured condition. The test is made on a thin adhesive layer as prepared in a bonded specimen. This test method is used for conductive adhesives that are cured either at room temperature or at elevated temperatures.
1.2 The values stated in either SI or other units shall be regarded separately as standard. SI equivalents to screw threads are shown in the figures.
1.3 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

Status
Historical
Publication Date
30-Sep-2010
ICS
83.180 - Adhesives
Technical Committee
D14 - Adhesives
Drafting Committee
D14.80 - Metal Bonding Adhesives
Current Stage
Ref Project

Relations

Replaces
ASTM D2739-97(2004) - Standard Test Method for Volume Resistivity of Conductive Adhesives
Effective Date
01-Oct-2010
Replaced By
ASTM D2739-97(2017) - Standard Test Method for Volume Resistivity of Conductive Adhesives
Effective Date
01-Nov-2017

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ASTM D2739-97(2010) - Standard Test Method for Volume Resistivity of Conductive AdhesivesASTM D2739-97(2010) - Standard Test Method for Volume Resistivity of Conductive Adhesives
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ASTM D2739-97(2010) - Standard Test Method for Volume Resistivity of Conductive Adhesives
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Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: D2739 − 97 (Reapproved 2010)
Standard Test Method for
1
Volume Resistivity of Conductive Adhesives
This standard is issued under the fixed designation D2739; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 3.1.2 conductivity, n—theratioofthecurrentdensitycarried
through a specimen to the potential gradient paralleling the
1.1 Thistestmethodcoversthedeterminationofthevolume
current. This is numerically equal to the conductance between
resistivity of resin-based conductive adhesives in the cured
opposite faces of a unit cube of liquid. It is the reciprocal of
condition.Thetestismadeonathinadhesivelayerasprepared
resistivity. D2864, D27
in a bonded specimen. This test method is used for conductive
3.1.3 resistivity, volume, n—theratiooftheelectricpotential
adhesives that are cured either at room temperature or at
gradient to the current density when the gradient is parallel to
elevated temperatures.
the current in the material. D1566, D11
1.2 The values stated in either SI or other units shall be
regarded separately as standard. SI equivalents to screw
4. Summary of Test Method
threads are shown in the figures.
4.1 Thevolumeresistivityofadhesivelayerscuredbetween
1.3 This standard does not purport to address the safety
metal adherends is measured on a resistance bridge. Tensile
concerns, if any, associated with its use. It is the responsibility
5
adhesion plugs (Fig. 1) are described in this test method.Any
of the user of this standard to establish appropriate safety and
other test specimens and materials can be used as long as
health practices and determine the applicability of regulatory
similar precautions (see Section 7) are observed regarding
limitations prior to use.
preparation and tolerances.
2. Referenced Documents
5. Significance and Use
2
2.1 ASTM Standards:
5.1 Accurate measurement of the volume resistivity of
D618Practice for Conditioning Plastics for Testing
conductive adhesives is important, particularly with respect to
D907Terminology of Adhesives
applications in electronic packaging techniques. This method
2.2 Federal Specification:
measures the resistance of conductive adhesives used in thin
3
QQ-B-626 Composition 22
filmsaspartofabondedassembly.Thisdoesnotimplythatthe
2.3 ASTM Adjuncts:
measuredresultsareapplicabletodifferentconfigurationswith
4
Assembly Jig
different metals. This method may be used for acceptance
testing and for screening materials.
3. Terminology
6. Apparatus
3.1 Definitions:
6
3.1.1 Many terms in this test method are defined in Termi-
6.1 Kelvin (Resistance) Bridge,calibratedto1%accuracy.
nology D907.
6.2 With the agreement of the interested parties, any metal
tensile adhesion plugs (Fig. 1) can be used to prepare the
tensile adhesion specimens.
1
This test method is under the jurisdiction of ASTM Committee D14 on
Adhesives and is the direct responsibility of Subcommittee D14.80 on Metal
NOTE 1—Different metals will inherently provide different resistance
Bonding Adhesives.
values. The measured resistance is dependent on resistance at the
Current edition approved Oct. 1, 2010. Published October 2010. Originally
adhesive-adherend interface due to metal oxide formation. The extent of
approved in 1968. Last previous edition approved in 2004 as D2739–97(2004).
oxide formation varies with locality and laboratory conditions. Brass,
DOI: 10.1520/D2739-97R10.
conforming to Federal Specification QQ-B-626 Composition 22, is a
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
convenient metal. However, in order to minimize oxide formation,
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
Standards volume information, refer to the standard’s Document Summary page on
the ASTM website.
3 5
Available from Standardization Documents Order Desk, DODSSP, Bldg. 4, Plugs to accommodate banana plug—No. 192, Herman H. Smith, Inc., or
Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http:// equivalent.
6
dodssp.daps.dla.mil. Satisfactory resistance bridges are made by: Leads and Northup Co. Bridge
4
Detailed drawings of the assembly jig are available from ASTM International Catalog No. 4306, Minneapolis Honeywell Division Catalog No. 1622, and Biddle
Headquarters. Order Adjunct No. ADJD2739. Original adjunct produced in 1987. Instruments Catalog No. 603282.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1

---------------------- Page: 1 ----------------------
D2739 − 97 (2010)
FIG. 1 Brass Tensile Adhesion Specimens with Electrical Connections
esp
...

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This specification provides the means to measure and evaluate the performance of adhesives for structural or semistructural bonding of wood-to-wood in manufactured homes. Wood as used in this specification includes lumber, plywood, particleboard, gypsum board, and all materials having woodbased surfaces at the bondline. The adhesives can be classified according to resistance to deformation: Group A or structural, and Group B or semistructural. Also, the adhesives may be designated into three types, according to their recommended use based on their resistance to water and water vapor: Type 1 for interior and exterior use, Type 2 for weather-protected interior use, and Type 3 for interior use only. Different tests shall be performed in order to determine the following properties of adhesives: shear strength, gap-filling ability, total deformation resistance, moisture and temperature limitation during fabrication, high-temperature resistance, low-temperature resistance, moisture resistance, aging, oxidation resistance, and mold resistance.
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1.1.1 The performance of the adhesives is measured in the following tests:    
Number  
Test  
Section  
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High Temperature  
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Type 2 Qualification  
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9  
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4.1 These test methods are designed to be used to determine the susceptibility of the adhesive film to biodegradation and whether the adhesive will carry into the bond line sufficient anti-fungal properties to prevent growth of fungi frequently present on the gluing equipment, on adherends, or in the adhesive as applied.  
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This test method covers the determination of the comparative cleavage strength properties of metal-to-metal adhesive bonds. The testing machine shall be capable of maintaining the rate of loading and shall compose of fixed member, movable member, and grips. Test specimens shall consist of metal pieces glued together according to the prescribed dimensions indicated in this standard method. Recommended metal specimens are the following: brass, copper, aluminum, steel, and phosphor bronze. Bonding and conditioning of specimen shall be done according to the procedure specified by the manufacturer of the adhesive. Testing procedure shall be in accordance to the load rate limits specified in this standard method. Cleavage strength shall be expressed in pounds per inch and shall be reported in three significant figures in addition to the following information: adhesive identification, preparation method, adhesive layer thickness, conditioning procedure used, testing room condition, specimen number, and loading rate.
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1.4 The values stated in SI units are to be regarded as the standard. The inch-pound units given in parentheses are for information only.  
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