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ASTM D5127-12

(Guide)

Standard Guide for Ultra-Pure Water Used in the Electronics and Semiconductor Industries

Standard Guide for Ultra-Pure Water Used in the Electronics and Semiconductor Industries

SIGNIFICANCE AND USE
This guide recommends the water quality required for the electronics and microelectronics industries. High-purity water is required to prevent contamination of products during manufacture, since contamination can lead to an unacceptable, low yield of electronic devices.
The range of water purity is defined in accordance with the manufacturing process. The types of ultra-pure water are defined with respect to device line width. In all cases, the water-quality recommendations apply at the point of distribution.
The limits on the impurities are related to current contamination specifications and to available analytical methods (either performed in a suitable clean laboratory or by on-line instrumentation). On-line and off-line methods are used in accordance with current industry practice. Concentration of the sample may be required to measure the impurities at the levels indicated in Table 1.
TABLE 1 Requirements for Water at the Point of Distribution in the Electronics and Semiconductor IndustriesA  ParameterType E-1Type E-1.1Type E-1.2BType E-1.3BType E-2Type E-3Type E-4 Linewidth (microns)1.0–0.50.35–0.250.18–0.090.065–0.0325.0–1.0>5.0 Resistivity, 25°C (On-line)18.118.218.218.216.5120.5 TOC (μg/L) (on-line for 10 ppb)5211503001000 On-line dissolved oxygen (μg/L)2510310 On-Line Residue after evaporation (μg/L)10.50.1 On-line particles/L (micron range) >0.05 μm500C  0.05–0.11000200N/AC  0.1–0.21000350100N/A  0.2–0.550010010N/A  0.5-1.0200505N/A  1.0100201N/A SEM particles/L (micron range)  0.1–0.21000700250N/A  0.2–0.5500400100N/A3000  0.5–11005030N/A10 000  10503010N/A100 000 Bacteria in CFU/Volume  100 mL Sample531N/A1050100  1 L Sample101 10 L Sample 1 Silica – total (μg/L)5310.510501000 Silica – dissolved (μg/L)310.50.5 Anions and Ammonium by IC (μg/L)  Ammonium0.10.100.050.050  Bromide0.10.050.020.050  Chloride0.10.050.020.0501101000  Fluoride0.10.050.030.050  Nitrate0.10.050.020.05015500  Nitrite0.10.050.020.050  Phosphate0.10.050.020.05015500  Sulfate0.1...
SCOPE
1.1 This guide provides recommendations for water quality related to electronics and semiconductor-industry manufacturing. Seven classifications of water are described, including water for line widths as low as 0.032 micron. In all cases, the recommendations are for water at the point of distribution (POD).
1.2 Water is used for washing and rinsing of semiconductor components during manufacture. Water is also used for cleaning and etching operations, making steam for oxidation of silicon surfaces, preparing photomasks, and depositing luminescent materials. Other applications are in the development and fabrication of solid-state devices, thin-film devices, communication lasers, light-emitting diodes, photo-detectors, printed circuits, memory devices, vacuum-tube devices, or electrolytic devices.
1.3 Users needing water qualities different from those described here should consult other water standards, such as Specification D1193 and Guide D5196.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

Status
Historical
Publication Date
14-Jun-2012
ICS
13.060.25 - Water for industrial use
71.100.99 - Other products of the chemical industry
Technical Committee
D19 - Water
Drafting Committee
D19.02 - Quality Systems, Specification, and Statistics
Current Stage
Ref Project

Relations

Replaces
ASTM D5127-07 - Standard Guide for Ultra-Pure Water Used in the Electronics and Semiconductor Industries
Effective Date
15-Jun-2012
Referred By
ASTM D5544-16 - Standard Test Method for On-Line Measurement of Residue After Evaporation of High-Purity Water
Effective Date
15-Jun-2012
Referred By
ASTM D7980-15(2023) - Standard Guide for Ion-Chromatographic Analysis of Anions in Grab Samples of Ultrapure Water (UPW) in the Semiconductor Industry
Effective Date
15-Jun-2012
Referred By
ASTM D5196-06(2018) - Standard Guide for Bio-Applications Grade Water
Effective Date
15-Jun-2012

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ASTM D5127-12 - Standard Guide for Ultra-Pure Water Used in the Electronics and Semiconductor IndustriesASTM D5127-12 - Standard Guide for Ultra-Pure Water Used in the Electronics and Semiconductor Industries
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ASTM D5127-12 - Standard Guide for Ultra-Pure Water Used in the Electronics and Semiconductor Industries
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Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: D5127 − 12
StandardGuide for
Ultra-Pure Water Used in the Electronics and
1
Semiconductor Industries
This standard is issued under the fixed designation D5127; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope D2791TestMethodforOn-lineDeterminationofSodiumin
Water
1.1 This guide provides recommendations for water quality
D3919Practice for Measuring Trace Elements in Water by
related to electronics and semiconductor-industry manufactur-
Graphite Furnace Atomic Absorption Spectrophotometry
ing. Seven classifications of water are described, including
D4191TestMethodforSodiuminWaterbyAtomicAbsorp-
water for line widths as low as 0.032 micron. In all cases, the
tion Spectrophotometry
recommendations are for water at the point of distribution
D4192Test Method for Potassium in Water by Atomic
(POD).
Absorption Spectrophotometry
1.2 Water is used for washing and rinsing of semiconductor
D4327Test Method forAnions in Water by Suppressed Ion
components during manufacture. Water is also used for clean-
Chromatography
ing and etching operations, making steam for oxidation of
D4453Practice for Handling of High Purity Water Samples
silicon surfaces, preparing photomasks, and depositing lumi-
D4517Test Method for Low-Level Total Silica in High-
nescent materials. Other applications are in the development
Purity Water by Flameless Atomic Absorption Spectros-
and fabrication of solid-state devices, thin-film devices, com-
copy
munication lasers, light-emitting diodes, photo-detectors,
D5173Test Method for On-Line Monitoring of Carbon
printed circuits, memory devices, vacuum-tube devices, or
Compounds in Water by Chemical Oxidation, by UV
electrolytic devices.
Light Oxidation, by Both, or by High Temperature Com-
bustion Followed by Gas Phase NDIR or by Electrolytic
1.3 Users needing water qualities different from those de-
scribed here should consult other water standards, such as Conductivity
D5196Guide for Bio-Applications Grade Water
Specification D1193 and Guide D5196.
D5391Test Method for Electrical Conductivity and Resis-
1.4 This standard does not purport to address all of the
tivity of a Flowing High Purity Water Sample
safety concerns, if any, associated with its use. It is the
D5462Test Method for On-Line Measurement of Low-
responsibility of the user of this standard to establish appro-
Level Dissolved Oxygen in Water
priate safety and health practices and determine the applica-
D5542Test Methods for TraceAnions in High Purity Water
bility of regulatory limitations prior to use.
by Ion Chromatography
D5544Test Method for On-Line Measurement of Residue
2. Referenced Documents
After Evaporation of High-Purity Water
2
2.1 ASTM Standards:
D5673Test Method for Elements in Water by Inductively
D1129Terminology Relating to Water
Coupled Plasma—Mass Spectrometry
D1193Specification for Reagent Water
D5996Test Method for MeasuringAnionic Contaminants in
D1976Test Method for Elements in Water by Inductively-
High-Purity Water by On-Line Ion Chromatography
Coupled Argon Plasma Atomic Emission Spectroscopy
D5997 Test Method for On-Line Monitoring of Total
Carbon,InorganicCarboninWaterbyUltraviolet,Persul-
fate Oxidation, and Membrane Conductivity Detection
1
This guide is under the jurisdiction ofASTM Committee D19 on Water and is
F1094Test Methods for Microbiological Monitoring of
thedirectresponsibilityofSubcommitteeD19.02onQualitySystems,Specification,
Water Used for Processing Electron and Microelectronic
and Statistics.
Devices by Direct Pressure Tap Sampling Valve and by
Current edition approved June 15, 2012. Published July 2012. Originally
approved in 1990. Last previous edition approved in 2007 as D5127–07. DOI: the Presterilized Plastic Bag Method
10.1520/D5127-12.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or 3. Terminology
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
3.1 Definitions—For definitions of terms used in this guide
Standards volume information, refer to the standard’s Document Summary page on
the ASTM website. refer to Terminology D1129.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1

---------------------- Page: 1 ----------------------
D5127 − 12
3.2 Definitions of Terms Specific to This Standard: 5.1.7 Type E-4—This grade may be classified as water used
3.2.1 total bacterial counts, n—total number of cultureable in preparation of plating solutions and for other applications
microorganisms present in the named sample, excluding obli- where the water being
...

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4.1 This guide recommends the water quality required for the electronics and microelectronics industries. High-purity water is required to prevent contamination of products during manufacture, since contamination can lead to an unacceptable, low yield of electronic devices.  
4.2 The range of water purity is defined in accordance with the manufacturing process. The types of ultra-pure water are defined with respect to device line width. In all cases, the water-quality recommendations apply at the point of distribution.  
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1.1 This specification covers UNS N06002, UNS N06030, UNS N06035, UNS N06022, UNS N06200, UNS N10362, UNS N06230, UNS N06600, UNS N06617, UNS N06625, UNS N08020, UNS N08026, UNS N08024, UNS N08120, UNS N08926, UNS N08367, UNS N10242, UNS N10276, UNS N10665, UNS N10675, UNS N12160, UNS R20033, UNS N06059, UNS N06686, UNS N10629, UNS N08031, UNS N06045, UNS N06025, UNS N06699, and UNS R305562 billets and bars for reforging.  
1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.  
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Safety Data Sheet (SDS) for this product/material as provided by the manufacturer, to establish appropriate safety, health, and environmental practices, and determine the applicability of regulatory limitations prior to use.  
1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

  • Technical specification
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    English language
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  • Technical specification
    5 pages
    English language
    sale 15% off