ASTM F458-13
(Practice)Standard Practice for Nondestructive Pull Testing of Wire Bonds1,2
Standard Practice for Nondestructive Pull Testing of Wire Bonds1,2
SIGNIFICANCE AND USE
4.1 The nondestructive wire-bond pull test provides a screen for evaluating wire-bond quality and is capable of detecting weak or nonadherent bonds.
4.2 The test is not destructive and does not damage acceptable wire bonds.
4.3 This practice provides a procedure for identifying a bonding situation that requires corrective action.
4.4 The purpose of this practice is to identify wire bonds that may fail during subsequent screening procedures or field operation.
4.5 The procedure is to be applied after bonding and before any further treatment.
SCOPE
1.1 This practice covers nondestructive testing of individual wire bonds made by either ultrasonic, thermal compression or thermosonic techniques. The test is intended to reveal (by breaking) nonacceptable wire bonds but is designed to avoid damage to acceptable wire bonds. Note 1—Common usage at the present time considers the term “wire bond” to include the entire interconnection: both welds and the intervening wire span.
1.2 The practice covers wire bonds made with small-diameter (from 0.0007 to 0.003-in. (18 to 76-μm)) wire such as the type used in integrated circuits and hybrid microcircuits, system in package, and so forth.
1.3 This practice can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling to be placed under the wire.
1.4 While the procedure is applicable to wire of any composition and metallurgical state, criteria are given only for gold and aluminum wire.
1.5 A destructive pull test is used on wire bonds of the same type and geometry to provide the basis for the determination of the nondestructive pulling force to be used in this practice. This may only be used if the sample standard deviation, s, of the pulling forces required to destroy at least 25 of the same wire bonds tested by the destructive pull-test method is less than or equal to 0.25 of the sample average, x. If s > 0.25 x, this practice may not be used. Note 2—If s > 0.25 x, some aspect of the bonding process is out of control. Following corrective action, the destructive pull-test measurements should be repeated to determine if the s ≤0.25 x criterion is met.
1.6 The nondestructive wire-bond pull test is to be performed before any other treatment or screening following bonding and at the same point in processing as the accompanying destructive test. Preferably, this is done immediately after bonding.
1.7 The procedure does not ensure against wire-bond failure modes induced after the test has been performed.
1.8 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.
1.9 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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Designation: F458 − 13
Standard Practice for
1,2
Nondestructive Pull Testing of Wire Bonds
ThisstandardisissuedunderthefixeddesignationF458;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope bonding and at the same point in processing as the accompa-
nying destructive test. Preferably, this is done immediately
1.1 Thispracticecoversnondestructivetestingofindividual
after bonding.
wire bonds made by either ultrasonic, thermal compression or
thermosonic techniques. The test is intended to reveal (by 1.7 Theproceduredoesnotensureagainstwire-bondfailure
breaking) nonacceptable wire bonds but is designed to avoid modes induced after the test has been performed.
damage to acceptable wire bonds.
1.8 The values stated in inch-pound units are to be regarded
as standard. The values given in parentheses are mathematical
NOTE 1—Common usage at the present time considers the term “wire
bond” to include the entire interconnection: both welds and the interven-
conversions to SI units that are provided for information only
ing wire span.
and are not considered standard.
1.2 The practice covers wire bonds made with small-
1.9 This standard does not purport to address all of the
diameter(from0.0007to0.003-in.(18to76-µm))wiresuchas
safety concerns, if any, associated with its use. It is the
the type used in integrated circuits and hybrid microcircuits,
responsibility of the user of this standard to establish appro-
system in package, and so forth.
priate safety and health practices and determine the applica-
bility of regulatory limitations prior to use.
1.3 This practice can be used only when the loop height of
the wire bond is large enough to allow a suitable hook for
2. Referenced Documents
pulling to be placed under the wire.
3
2.1 ASTM Standards:
1.4 While the procedure is applicable to wire of any
F459Test Methods for Measuring Pull Strength of Micro-
composition and metallurgical state, criteria are given only for
electronic Wire Bonds
gold and aluminum wire. 4
2.2 Military Standard:
1.5 Adestructivepulltestisusedonwirebondsofthesame
MIL-STD-883Method 2023
typeandgeometrytoprovidethebasisforthedeterminationof
3. Summary of Practice
thenondestructivepullingforcetobeusedinthispractice.This
may only be used if the sample standard deviation, s,ofthe 3.1 The use of nondestructive wire-bond pull tests is predi-
pulling forces required to destroy at least 25 of the same wire cated on data obtained from destructive pull tests on typical
bonds tested by the destructive pull-test method is less than or samplesselectedfromalot.Themaximumsafenondestructive
equal to 0.25 of the sample average, x¯.If s > 0.25 x¯, this pull-force levels are determined as a function of the metallur-
practice may not be used. gical properties of the wire and from the calculated mean (x¯)
and standard deviation (s) of the destructive pull-test data
NOTE 2—If s > 0.25 x¯, some aspect of the bonding process is out of
determined in accordance with Test Methods F459.
control. Following corrective action, the destructive pull-test measure-
ments should be repeated to determine if the s ≤ 0.25 x¯ criterion is met.
3.2 In some cases, rather than use a calculated nondestruc-
1.6 The nondestructive wire-bond pull test is to be per- tive pull force, a fixed pull force may be agreed upon by test
formed before any other treatment or screening following participants. This value may be based upon industry practice,
or some other accepted value, such as that in MIL STD 883,
Method 2023. All other parts of the present ASTM standard
1
This practice is under the jurisdiction ofASTM Committee F01 on Electronics
will apply.
andisthedirectresponsibilityofSubcommitteeF01.03onMetallicMaterials,Wire
Bonding, and Flip Chip.
3
Current edition approved Jan. 1, 2013. Published January 2013. Originally For referenced ASTM standards, visit the ASTM website, www.astm.org, or
approvedin1976asF458–76T.Lastpreviouseditionapprovedin2006asF458– contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
06. DOI: 10.1520/F0458-13. Standards volume information, refer to the standard’s Document Summary page on
2
This procedure, with current status and limitations, was published in: Harman, the ASTM website.
4
G. G., Wire Bonding in Microelectronics, 3rd Edition, McGraw Hill, 2010, AvailablefromStandardizationDocumentsOrderDesk,Bldg.4SectionD,700
Appendix 4B.2. Robbins Ave., Philadelphia, PA 19111–5094, Attn: NPODS.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-
...
This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation: F458 − 06 F458 − 13
Standard Practice for
1,2
Nondestructive Pull Testing of Wire Bonds
This standard is issued under the fixed designation F458; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the Department of Defense.
1. Scope
1.1 This practice covers nondestructive testing of individual wire bonds made by either ultrasonic, thermal compression or
thermosonic techniques. The test is destructive to intended to reveal (by breaking) nonacceptable wire bonds but is designed to
avoid damage to acceptable wire bonds.
NOTE 1—Common usage at the present time considers the term “wire bond” to include the entire interconnection: both welds and the intervening wire
span.
1.2 The practice covers wire bonds made with small-diameter (from 0.0007 to 0.003-in. (18 to 76-μm)) wire of such as the type
used in integrated circuits and hybrid microcircuits.microcircuits, system in package, and so forth.
1.3 This practice can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling
to be placed under the wire.
1.4 While the procedure is applicable to wire of any composition and metallurgical state, criteria are given only for gold and
aluminum wire.
1.5 A destructive pull test is used on wire bonds of the same type and geometry to provide the basis for the determination of
the nondestructive pulling force to be used in this practice. This may only be used if the sample standard deviation, s, of the pulling
forces required to destroy at least 25 of the same wire bonds tested by the destructive pull-test method is less than or equal to 0.25
of the sample average, x¯. If s > 0.25 x¯, this practice may not be used.
NOTE 2—If s > 0.25 x¯, some aspect of the bonding process is out of control. Following corrective action, the destructive pull-test measurements should
be repeated to determine if the s≤0.25 x¯ criterion is met.
1.6 The nondestructive wire-bond pull test is to be performed before any other treatment or screening following bonding and
at the same point in processing as the accompanying destructive test. Preferably, this is done immediately after bonding.
1.7 The procedure does not ensure against wire-bond failure modes induced after the test has been performed.
1.8 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information
only.mathematical conversions to SI units that are provided for information only and are not considered standard.
1.9 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility
of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory
limitations prior to use.
2. Referenced Documents
3
2.1 ASTM Standards:
F459 Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
4
2.2 Military Standard:
MIL-STD-883 Method 2023
1
This practice is under the jurisdiction of ASTM Committee F01 on Electronics and is the direct responsibility of Subcommittee F01.07 on Wire Bonding, Flip Chip, and
Tape Automated Bonding.
Current edition approved Jan. 1, 2006Jan. 1, 2013. Published January 2006 January 2013. Originally approved in 1976 as F458 – 76 T. Last previous edition approved
in 20012006 as F458 – 84F458 (2001). – 06. DOI: 10.1520/F0458-06.10.1520/F0458-13.
2
This procedure, with current status and limitations, was published in: Harman, G. G., Wire Bonding in Microelectronics, 3rd Edition, McGraw Hill, 2010, Appendix 4B.2.
3
For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
4
Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700 Robbins Ave., Philadelphia, PA 19111–5094, Attn: NPODS.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1
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F458 − 13
3. Summary of Practice
3.1 The use of nondestructive wire-bond pull tests is predicated on data obtained from destructive pull te
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