ASTM F2074-00

Standard Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers (Withdrawn 2003)

SCOPE
This standard was transferred to SEMI (www.semi.org) May 2003
1.1 This guide defines standardized positions for measuring diameter of circular wafers of silicon and other semiconducting materials that contain flats or notches on the periphery. It was developed for use with silicon wafers with standard diameter and flat positions as given in SEMI Specifications M1.
1.2 It may be applied to other semiconductor wafers if the flat locations are properly taken into account.
1.3 Wafers of any size can be measured provided that suitable test jigs and instruments are available.
1.4 Roundness of wafers cannot be determined from measurements made solely at the positions defined in this guide. No information is provided concerning the diameter of the wafer at points other than those measured.

General Information

• Status: Withdrawn
• Publication Date: 09-Dec-2000
• Withdrawal Date: 09-May-2003
• ICS: 29.045 - Semiconducting materials
• Technical Committee: F01 - Electronics

Standards Content (Sample)

NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
Designation: F 2074 – 00
Standard Guide for
Measuring Diameter of Silicon and Other Semiconductor
Wafers
This standard is issued under the fixed designation F 2074; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
INTRODUCTION
This guide is proposed to replace ASTM Test Method F 613-93, Standard Test Method for
Measuring Diameter of Semiconductor Wafers. That test method is being withdrawn because the
reported measurement precision achievable with that test method is not adequate for current wafer
technology. This guide is intended to be used with measurement technology appropriate for the
application, but it includes no recommendations as to such measurement technology.
1. Scope 3.1.2 indent—of a semiconductor wafer, an edge defect that
extends from the front surface to the back surface.
1.1 This guide defines standardized positions for measuring
diameter of circular wafers of silicon and other semiconducting
4. Significance and Use
materials that contain flats or notches on the periphery. It was
4.1 The diameter of semiconductor wafers is an important
developed for use with silicon wafers with standard diameter
parameter in microelectronic fabrication. Wafer diameters must
and flat positions as given in SEMI Specifications M1.
conform to the limits specified in SEMI M1; or other agreed
1.2 It may be applied to other semiconductor wafers if the
upon limits, or product that is otherwise suitable may not fit
flat locations are properly taken into account.
correctly in process equipment.
1.3 Wafers of any size can be measured provided that
4.2 Cam-follower edge rounding usually results in wafers
suitable test jigs and instruments are available.
that are circular. However, wafers ground with edge-follower
1.4 Roundness of wafers cannot be determined from mea-
edge rounding equipment may be elliptically shaped. Measure-
surements made solely at the positions defined in this guide.
ments made at the three positions specified in this guide do not
No information is provided concerning the diameter of the
provide complete information about the roundness of the
wafer at points other than those measured.
wafer.
2. Referenced Documents
5. Interferences
2.1 SEMI Standards
5.1 If an indent or uneven edge occurs at the periphery of
Specifications M1, for Polished Monocrystalline Silicon
the wafer at the measurement position, the resulting diameter
Wafers
measurement will be in error.
Specification M20, for Establishing a Wafer Coordinate
5.2 If the wafer is not circular, the measured diameter may
System
differ from that found by other means.
3. Terminology
6. Measurement Positions
3.1 Definitions:
6.1 Measure the diameter at positions listed in Table 1. See
3.1.1 diameter—of a semiconductor wafer, the linear di-
Fig. 1. The angular positions in this table are given in degrees
mension across the surface of a circular wafer that contains the
from the x-axis as defined in SEMI M20.
wafer center and excludes flats or other peripheral fiduciary
6.2 Calculate the diameter of the wafer as the a
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