IEC 62899-503-3:2021(E) specifies a measuring method of contact resistance for printed thin film transistors (TFTs) by the transfer length method (TLM). The method requires the fabrication of a test element group (TEG) with varying channel length (L) between source and drain electrodes. The method is intended for quality assessment of TFT electrode contacts and is suited for determining whether the contact resistance lies within a desired range.

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    13 pages
    English language
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IEC 62899-503-1:2020(E) specifies a test method for displacement current measurement (DCM) for printed thin film transistors (TFTs) or organic thin film transistors (OTFTs).

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    15 pages
    English language
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IEC TR 60146-1-2:2019 is available as IEC TR 60146-1-2:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC TR 60146-1-2:2019 gives guidance on variations to the specifications given in IEC 60146-1-1:2009 to enable the specification to be extended in a controlled form for special cases. Background information is also given on technical points, which facilitates the use of IEC 60146-1-1:2009. This technical report primarily covers line commutated converters and is not in itself a specification, except as regards certain auxiliary components, in so far as existing standards may not provide the necessary data. This fifth edition includes the following significant technical changes with respect to the previous edition:
a) addition of annexes concerning the applications of converter transformers and of fuses for overcurrent protection;
b) changes of calculation methods related the inductive voltage regulation and changes of description on transformer losses to be consistent with the latest transformer standards;
c) addition and updates of references based on the latest information.

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    105 pages
    English language
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IEC 62899-203:2018(E) defines terms and specifies standard methods for characterisation and evaluation. This document is applicable to semiconductor inks and semiconductive layers that are made from semiconductor inks.

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    22 pages
    English language
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IEC/TR 62572-4:2013(E) which is a technical report, provides guidelines for optical connector end-face cleaning methods for receptacle style optical transceivers. It includes details about handling receptacle style optical transceivers, internal structures of optical transceivers, information on cleaning tools and machines, applicable cleaning methods and cleaning procedures. Receptacle style optical transceivers as well as optical fibre patch cords are handled by operators and maintenance staff of optical network systems. This technical report may be used as a guideline to prepare instruction manuals for the operators and maintenance staff of optical network systems. Keywords: optical connector end-face cleaning methods, receptacle style optical transceivers, optical network systems.

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    23 pages
    English language
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IEC 60146-1-1:2009 specifies the requirements for the performance of all semiconductor power converters and semiconductor power switches using controllable and/or non-controllable electronic valve devices. It is primarily intended to specify the basic requirements for converters in general and the requirements applicable to line commutated converters for conversion of a.c. power to d.c. power or vice versa. Parts of this standard are also applicable to other types of electronic power converter provided that they do not have their own product standards. This fourth edition constitutes a technical revision and introduces five main changes: - re-edition of the whole standard according to the current directives; - correction of definitions and addition of new terms, especially terms concerning EMC, harmonic distortion and insulation co-ordination; - the service condition tolerances have been revised according to the IEC 61000 series; - the insulation tests have been revised considering the insulation co-ordination; - addition of three annexes.

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    99 pages
    English language
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IEC 60146-1-1:2009 specifies the requirements for the performance of all semiconductor power converters and semiconductor power switches using controllable and/or non-controllable electronic valve devices. It is primarily intended to specify the basic requirements for converters in general and the requirements applicable to line commutated converters for conversion of a.c. power to d.c. power or vice versa. Parts of this standard are also applicable to other types of electronic power converter provided that they do not have their own product standards. This fourth edition constitutes a technical revision and introduces five main changes:
- re-edition of the whole standard according to the current directives;
- correction of definitions and addition of new terms, especially terms concerning EMC, harmonic distortion and insulation co-ordination;
- the service condition tolerances have been revised according to the IEC 61000 series;
- the insulation tests have been revised considering the insulation co-ordination;
- addition of three annexes.

  • Standard
    189 pages
    English and French language
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