ASTM C881/C881M-14
(Specification)Standard Specification for Epoxy-Resin-Base Bonding Systems for Concrete
Standard Specification for Epoxy-Resin-Base Bonding Systems for Concrete
ABSTRACT
This specification covers two-component, epoxy-resin bonding systems for application to Portland-cement concrete, which are able to cure under humid conditions and bond to damp surfaces. The epoxy-resin bonding systems are classified according to type, grade, class, and color. The bonding systems can be classified as Type I, Type II, Type III, Type IV, Type V, Type VI, and Type VII according to their physical requirements. According to their flow characteristics and viscosity, the bonding systems can be classified as Grade 1, Grade 2, and Grade 3. Also, in accordance with the range of temperatures for which they are suitable, these materials can be designated as Class A, Class B, Class C, Class D, Class E, and Class F. Classes A, B, and C are defined for Types I through V, and Classes D, E, and F are defined for Types VI and VII. Epoxy resin systems are normally unpigmented, but they can be colored or darkened. These bonding systems shall be furnished in two components for combining immediately prior to use in accordance with written instructions formulated Component A shall contain an epoxy resin with or without a reactive diluent. Component B shall contain one or more curing agents, which on mixing with Component A shall cause the mixture to harden. A suitable inert filler may be uniformly incorporated in one or both components. The filler shall be either nonsettling or readily dispersible in any component in which it is incorporated. All systems shall cure under humid conditions, and bond to damp surfaces. Different test methods shall be performed to determine the following properties: consistency, gel time, filler content, epoxy equivalent, viscosity, absorption, bond strength, thermal compatibility, heat deflection temperature, linear coefficient of shrinkage, compressive yield strength and modulus, tensile strength and elongation at break, and contact strength.
SCOPE
1.1 This specification covers two-component, epoxy-resin bonding systems for application to portland-cement concrete, which are able to cure under humid conditions and bond to damp surfaces.
1.2 This specification does not cover epoxy-resin-base bonding systems that have been modified by addition of components such as cement, fine aggregate, or fiber reinforcement. Additional testing may be required to meet applicable specifications for these applications.
1.3 This specification does not address the effects of creep on epoxy-resin-base bonding systems while under load or the potential for creep rupture. Additional testing is required for applications where creep and creep rupture are critical.
1.4 The values stated in either SI units or inch-pound units are to be regarded separately as standard. Some values have only SI units because the inch-pound equivalents are not used in practice. Within the text, the SI units are shown in brackets. The values stated in each system may not be exact equivalents; therefore, each system shall be used independently of the other. Combining values from the two systems may result in non-conformance with this standard.
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazards statements, see Section 9.
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Designation: C881/C881M −14
StandardSpecification for
Epoxy-Resin-Base Bonding Systems for Concrete
This standard is issued under the fixed designation C881/C881M; the number immediately following the designation indicates the year
of original adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.
A superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope* C884/C884MTest Method for Thermal Compatibility Be-
tween Concrete and an Epoxy-Resin Overlay
1.1 This specification covers two-component, epoxy-resin
D570Test Method for Water Absorption of Plastics
bonding systems for application to portland-cement concrete,
D638Test Method for Tensile Properties of Plastics
which are able to cure under humid conditions and bond to
D648Test Method for Deflection Temperature of Plastics
damp surfaces.
Under Flexural Load in the Edgewise Position
1.2 This specification does not cover epoxy-resin-base
D695Test Method for Compressive Properties of Rigid
bonding systems that have been modified by addition of
Plastics
components such as cement, fine aggregate, or fiber reinforce-
D2556Test Method for Apparent Viscosity of Adhesives
ment. Additional testing may be required to meet applicable
HavingShear-Rate-DependentFlowPropertiesUsingRo-
specifications for these applications.
tational Viscometry
D2566Test Method for Linear Shrinkage of Cured Thermo-
1.3 This specification does not address the effects of creep
on epoxy-resin-base bonding systems while under load or the setting Casting Resins During Cure (Withdrawn 1993)
potential for creep rupture. Additional testing is required for
applications where creep and creep rupture are critical. 3. Terminology
1.4 The values stated in either SI units or inch-pound units 3.1 Definitions of Terms Specific to This Standard:
are to be regarded separately as standard. Some values have
3.1.1 binder, n—the cementitious part of a grout, mortar, or
only SI units because the inch-pound equivalents are not used
concrete that binds the aggregate or filler into a cohesive mass.
in practice. Within the text, the SI units are shown in brackets.
3.1.2 bonding system, n—the product resulting from the
Thevaluesstatedineachsystemmaynotbeexactequivalents;
combination of all the components supplied for use as a
therefore,eachsystemshallbeusedindependentlyoftheother.
bonding material.
Combining values from the two systems may result in non-
3.1.3 component, n—a constituent that is intended to be
conformance with this standard.
combined with one or more other constituents to form a
1.5 This standard does not purport to address all of the
bonding system.
safety concerns, if any, associated with its use. It is the
responsibility of the user of this standard to establish appro- 3.1.4 contact strength, n—bond strength measured by slant
priate safety and health practices and determine the applica- shear after a specified contact and cure time.
bility of regulatory limitations prior to use.Forspecifichazards
3.1.5 contact time, n—specified time between when the
statements, see Section 9.
epoxy system is applied and when the two segments are
bonded together and still achieve a specified bond strength
2. Referenced Documents
after a specified curing time and temperature.
2.1 ASTM Standards:
3.1.6 curing agent, n—a substance that causes the conver-
C882Test Method for Bond Strength of Epoxy-Resin Sys-
sion of a fluid resin system to a solid cured resin by means of
tems Used With Concrete By Slant Shear
a chemical reaction.
3.1.7 epoxy equivalent, n—the weight of resin containing
This specification is under the jurisdiction of ASTM Committee C09 on
one molecular weight of epoxy groups.
Concrete and ConcreteAggregatesand is the direct responsibility of Subcommittee
C09.25 on Organic Materials for Bonding.
3.1.8 epoxy resin, n—a resin that contains or did contain
Current edition approved Nov. 15, 2014. Published January 2015. Originally
epoxy groups principally responsible for its polymerization.
approved in 1978. Last previous edition approved in 2013 as C881/C881M–13.
DOI: 10.1520/C0881_C0881M-14.
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
Standards volume information, refer to the standard’s Document Summary page on The last approved version of this historical standard is referenced on
the ASTM website. www.astm.org.
*A Summary of Changes section appears at the end of this standard
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
C881/C881M − 14
3.1.9 filler, n—a finely divided solid, predominantly passing 4.4 Classes—Classes A, B, and C are defined for Types I
the No. 200 [75-µm] sieve, that is used to improve certain through V, and Classes D, E, and F are defined for Types VI
properties of the bonding system or to reduce cost. and VII, in accordance with the range of temperatures for
which they are suitable (Note 2).
3.1.10 formulator, n—the agency responsible for preparing
4.4.1 Class A—For use below 40 °F [4 °C] the lowest
the separate components and for recommending the propor-
allowabletemperaturetobedefinedbythemanufacturerofthe
tions to be used in preparing the final bonding system.
product.
3.1.11 lot or batch, n—that quantity of manufactured mate-
4.4.2 Class B—Forusebetween40and60°F[4and15°C].
rial which has been subjected to the same unit chemical or
4.4.3 Class C—For use above 60 °F [15 °C] the highest
physical processes intended to make the final product substan-
allowabletemperaturetobedefinedbythemanufacturerofthe
tially uniform.
product.
3.1.12 manufacturer, n—a producer of a basic constituent
4.4.4 Class D—Forusebetween40and65°F[4and18°C]
part of a component.
for Type VI and VII applications.
4.4.5 Class E—For use between 60 and 80 °F [15 and 30
3.1.13 reactive diluent, n—a relatively free flowing liquid
°C] for Type VI and VII applications.
usedtoreducetheviscosityoftheliquidresinorresinmixture,
4.4.6 Class F—Foruseabove75°F[25°C]forTypeVIand
and which contains reactive groups that cause it to become an
VII applications, the highest allowable temperature to be
integral part of the cured resin.
defined by the manufacturer of the product.
3.1.14 working (pot) life, n—the time after mixing during
which a bonding system or mixture containing it retains NOTE 2—The temperature in question is usually that of the surface of
the hardened concrete to which the bonding system is to be applied. This
sufficient workability for proper use.
temperature may be considerably different from that of the air. Where
unusual curing rates are desired it is possible to use a class of bonding
4. Classification
agent at a temperature other than that for which it is normally intended.
For example, a Class A system will cure rapidly at room temperature.
4.1 This specification provides for the classification of
epoxy-resin bonding systems by type, grade, class, and color. 4.5 Color—Epoxyresinsystemsarenormallyunpigmented,
but they can be colored or darkened. If a specific color is
4.2 Types—Seventypesofsystemsthataredistinguishedby
desired, it should be so stated by the purchaser.
the requirements of Table 1 are recognized:
4.2.1 Type I—For use in non-load bearing application for
5. Ordering Information
bonding hardened concrete to hardened concrete and other
5.1 The purchaser shall specify the type, grade, class, and
materials,andasabinderinepoxymortarsorepoxyconcretes.
color of bonding system desired and the size of units in which
4.2.2 Type II—For use in non-load bearing applications for
the components shall be furnished. Special requirements re-
bonding freshly mixed concrete to hardened concrete.
garding filling of either the components or the final bonding
4.2.3 Type III—For use in bonding skid-resistant materials
system should be stated. The product furnished under this
tohardenedconcreteandasabinderinepoxymortarsorepoxy
specification is intended to be resistant to moisture and
concretes used on traffic bearing surfaces (or surfaces subject
therefore should be suitable for either indoor or outdoor
to thermal or mechanical movements).
exposure.
4.2.4 Type IV—For use in load bearing applications for
bonding hardened concrete to hardened concrete and other 5.2 Thepurchasermayspecifyaminimumgeltimeof5min
materials and as a binder for epoxy mortars and concretes. for Types I and IV when automatic proportioning, mixing, and
dispensing equipment are used.
4.2.5 Type V—For use in load bearing applications for
bonding freshly mixed concrete to hardened concrete.
6. Materials and Manufacture
4.2.6 Type VI—For bonding and sealing segmental precast
elements, as in segment-by-segment erection, and for span-by-
6.1 The systems covered by this specification shall be
span erection when temporary post tensioning is applied.
furnished in two components for combining immediately prior
4.2.7 Type VII—For use as a nonstress carrying sealer for
touseinaccordancewithwritteninstructionsoftheformulator.
segmental precast elements when temporary post tensioning is
Component A shall contain an epoxy resin with or without a
not applied as in span-by-span erection.
reactive diluent. Component B shall contain one or more
curing agents, which on mixing with ComponentAshall cause
NOTE 1— Epoxy resin systems will adhere to a wide variety of
the mixture to harden.Asuitable inert filler may be uniformly
materials, including wood, metals, masonry, and most plastics.
Polyethylene, TFE-fluorocarbon, cellophane, and greased or waxed sur- incorporated in one or both components. The filler shall be
faces are among the few materials to which these systems will not adhere.
either nonsettling or readily dispersible in any component in
which it is incorporated. All systems shall cure under humid
4.3 Grades—Three grades of systems are defined according
conditions, and bond to damp surfaces.
to their flow characteristics and are distinguished by the
viscosity and consistency requirements of Table 1.
7. Chemical Composition
4.3.1 Grade 1—Low viscosity.
4.3.2 Grade 2—Medium viscosity.
7.1 The epoxy resin constituent of ComponentAshall have
4.3.3 Grade 3—Non-sagging consistency. an epoxy equivalent of 155 to 275.
C881/C881M − 14
TABLE 1 Physical Requirements of Bonding Systems
Type
Property
I II III IV V VI VII
Viscosity, P [Pa·s]:
Grade 1, max 20[2.0] 20[2.0] 20[2.0] 20[2.0] 20[2.0] . .
Grade 2, min 20[2.0] 20[2.0] 20[2.0] 20[2.0] 20[2.0] . .
max 100[10] 100[10] 100[10] 100[10] 100[10] . .
Consistency, in
[mm]:
1 1 1 1 1 1 1
Grade 3, Types I, ⁄4 [6.0] ⁄4 [6.0] ⁄4 [6.0] ⁄4 [6.0] ⁄4 [6.0] ⁄4 [6.0] ⁄4 [6.0]
II, III, IV, V, VI,
VII,
max
Gel time, minutes, 30 30 30 30 30 30 30
min
Bond strength, min,
psi [MPa]:
2 days 1000[7.0] . . 1000[7.0] . 1000[7.0] .
(moist
cure)
14 days (moist 1500[10.0] 1500[10.0] 1500[10.0] 1500[10.0] 1500[10.0] . 1000[7.0]
cure)
Absorption, 24 h 1 1 1 1 1 . .
max, %
Heat Deflection
Temperature, min,
°F [°C]:
7 days . . . 120[50] 120[50] . .
14 days . . . . . 120[50] 120[50]
Thermal . . passes test . . . .
compatibility
Linear coefficient of 0.005 0.005 . 0.005 0.005 . .
shrinkage on
cure,
max
Compressive Yield
Strength, min,
psi
[MPa]:
24 h . . . . . 2000[14.0] .
36 h . . . . . . 1000[7.0]
48 h . . . . . 6000[40.0] .
72 h . . . . . . 2000[14.0]
7 days 8000[55.0] 5000[35.0] . 10 000[70.0] 8000[55.0] . .
Compressive
Modulus, psi
[MPa]
Min 150 000[1000] 90 000[600] . 200 000[1400] 150 000[1000] . .
Max . . 130 000[896] . . . .
Tensile Strength, 7 5000[35.0] 2000[14.0] . 7000[50.0] 6000[40.0] . .
days min, psi
A
[MPa]
Elongation at 1 1 30 1 1 . .
A
Break, %, min
Contact strength,
psi
[MPa] min
2 days . . . . . 1000[7.0] .
14 days . . . . . . 1000[7.0]
A
Not required for Viscosity Grade 3 Systems.
8. Physical Properties skin,itshallberemovedimmediatelywithadryclothorpaper
towel,andtheareaofcontactwashedthoroughlywithsoapand
8.1 A mixture of Components A and B in the proportions
water.Solventsshall notbeused,becausetheycarrytheirritant
recommendedbytheformulatorshallconformtotheproperties
into the skin. Cured epoxy resins are innocuous.
prescribed in Table 1.
10. Sampling
9. Safety Hazards
9.1 Caution: Epoxy resins contain irritants, especially to 10.1 Take a representative sample of each of the two
the skin, eyes, and respiratory system. Persons handling these components from a well-blended lot prior to packaging or by
materials shall use appropriate protective clothing, including withdrawingsamplesfromnofewerthan5%ofthecontainers
rubber or plastic gloves. If an epoxy resin should contact the comprisingthelotorshipment.Unlessthesamplesofthesame
C881/C881M − 14
component taken from containers show visual evidence of 11.2.3 Significance and Use—This test method is used to
variability, they may be combined into a single composite determine compliance with the requirements of the specifica-
sample. In place of the foregoing, packaged materials may be tion.
sampled by a random selection of containers of each compo- 11.2.4 Apparatus:
nent from each lot, provided such a procedure is acceptable to
11.2.4.1 Paper cup—8 oz. [approximately 250 cm ] un-
the purchaser.
waxed paper cup
11.2.4.2 Mixing blade—Ordinary wooden tongue depressor
11. Test Methods
or stick of similar size.
11.2.5 Conditioning—Condition the individual components
11.1 Consistency—Test Method to Determine The Consis-
andanyequipmentwithwhichtheywillcomeincontacttothe
tency of an Epoxy Resin System.
temperaturessetforthin11.1,dependingontheclassofsystem
11.1.1 Scope—This test provides a method for determining
in question, or to the temperature at which the material will be
the consistency of Grade 3 epoxy resin systems.
used, providing that temperature is within the ranges estab-
11.1.2 Significance and Use—This test method is used to
lishedin4.4forTypesI,II,III,andV.ForTypeVIandVIIuse
determine compliance with the requirements of the specifica-
the highest temperature of the specified class (Note 2). Prepare
tion.
60gofthebondingsystemforTypesIthroughVand1gal[4.0
11.1.3 Apparatus:
L] for Types VI and VII using the procedures set forth in 11.1.
11.1.3.1 Paper cup—Approximately 3 oz. [approximately
11.2.6 Procedure—Transfer as much as possible of the
0.100L] unwaxed paper cup.
sample into an 8-oz [approximately 250-cm ] unwaxed paper
11.1.3.2 Mixing blade—Ordinary wooden tongue depressor
cup and set it on a wooden surface in a location maintaine
...
This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation: C881/C881M − 13 C881/C881M − 14
Standard Specification for
Epoxy-Resin-Base Bonding Systems for Concrete
This standard is issued under the fixed designation C881/C881M; the number immediately following the designation indicates the year
of original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval.
A superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope*
1.1 This specification covers two-component, epoxy-resin bonding systems for application to portland-cement concrete, which
are able to cure under humid conditions and bond to damp surfaces.
1.2 This specification does not cover epoxy-resin-base bonding systems that have been modified by addition of components
such as cement, fine aggregate, or fiber reinforcement. Additional testing may be required to meet applicable specifications for
these applications.
1.3 This specification does not address the effects of creep on epoxy-resin-base bonding systems while under load or the
potential for creep rupture. Additional testing is required for applications where creep and creep rupture are critical.
1.4 The values stated in either SI units or inch-pound units are to be regarded separately as standard. Some values have only
SI units because the inch-pound equivalents are not used in practice. Within the text, the SI units are shown in brackets. The values
stated in each system may not be exact equivalents; therefore, each system shall be used independently of the other. Combining
values from the two systems may result in non-conformance with this standard.
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility
of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory
limitations prior to use. For specific hazards statements, see Section 9.
2. Referenced Documents
2.1 ASTM Standards:
C882 Test Method for Bond Strength of Epoxy-Resin Systems Used With Concrete By Slant Shear
C884/C884M Test Method for Thermal Compatibility Between Concrete and an Epoxy-Resin Overlay
D570 Test Method for Water Absorption of Plastics
D638 Test Method for Tensile Properties of Plastics
D648 Test Method for Deflection Temperature of Plastics Under Flexural Load in the Edgewise Position
D695 Test Method for Compressive Properties of Rigid Plastics
D1084D2556 Test MethodsMethod for Apparent Viscosity of Adhesives Having Shear-Rate-Dependent Flow Properties Using
Rotational Viscometry
D2566 Test Method for Linear Shrinkage of Cured Thermosetting Casting Resins During Cure (Withdrawn 1993)
3. Terminology
3.1 Definitions of Terms Specific to This Standard:
3.1.1 binder, n—the cementitious part of a grout, mortar, or concrete that binds the aggregate or filler into a cohesive mass.
3.1.2 bonding system, n—the product resulting from the combination of all the components supplied for use as a bonding
material.
3.1.3 component, n—a constituent that is intended to be combined with one or more other constituents to form a bonding system.
3.1.4 contact strength, n—bond strength measured by slant shear after a specified contact and cure time.
This specification is under the jurisdiction of ASTM Committee C09 on Concrete and Concrete Aggregates and is the direct responsibility of Subcommittee C09.25 on
Organic Materials for Bonding.
Current edition approved Dec. 1, 2013Nov. 15, 2014. Published December 2013January 2015. Originally approved in 1978. Last previous edition approved in 20102013
as C881C881/C881M–10.–13. DOI: 10.1520/C0881_C0881M-13.10.1520/C0881_C0881M-14.
For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
The last approved version of this historical standard is referenced on www.astm.org.
*A Summary of Changes section appears at the end of this standard
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
C881/C881M − 14
3.1.5 contact time, n—specified time between when the epoxy system is applied and when the two segments are bonded together
and still achieve a specified bond strength after a specified curing time and temperature.
3.1.6 curing agent, n—a substance that causes the conversion of a fluid resin system to a solid cured resin by means of a
chemical reaction.
3.1.7 epoxy equivalent, n—the weight of resin containing one molecular weight of epoxy groups.
3.1.8 epoxy resin, n—a resin that contains or did contain epoxy groups principally responsible for its polymerization.
3.1.9 filler, n—a finely divided solid, predominantly passing the No. 200 [75-μm] sieve, that is used to improve certain properties
of the bonding system or to reduce cost.
3.1.10 formulator, n—the agency responsible for preparing the separate components and for recommending the proportions to
be used in preparing the final bonding system.
3.1.11 lot or batch, n—that quantity of manufactured material which has been subjected to the same unit chemical or physical
processes intended to make the final product substantially uniform.
3.1.12 manufacturer, n—a producer of a basic constituent part of a component.
3.1.13 reactive diluent, n—a relatively free flowing liquid used to reduce the viscosity of the liquid resin or resin mixture, and
which contains reactive groups that cause it to become an integral part of the cured resin.
3.1.14 working (pot) life, n—the time after mixing during which a bonding system or mixture containing it retains sufficient
workability for proper use.
4. Classification
4.1 This specification provides for the classification of epoxy-resin bonding systems by type, grade, class, and color.
4.2 Types—Seven types of systems that are distinguished by the requirements of Table 1 are recognized:
4.2.1 Type I—For use in non-load bearing application for bonding hardened concrete to hardened concrete and other materials,
and as a binder in epoxy mortars or epoxy concretes.
4.2.2 Type II—For use in non-load bearing applications for bonding freshly mixed concrete to hardened concrete.
4.2.3 Type III—For use in bonding skid-resistant materials to hardened concrete and as a binder in epoxy mortars or epoxy
concretes used on traffic bearing surfaces (or surfaces subject to thermal or mechanical movements).
4.2.4 Type IV—For use in load bearing applications for bonding hardened concrete to hardened concrete and other materials and
as a binder for epoxy mortars and concretes.
4.2.5 Type V—For use in load bearing applications for bonding freshly mixed concrete to hardened concrete.
4.2.6 Type VI—For bonding and sealing segmental precast elements, as in segment-by-segment erection, and for span-by-span
erection when temporary post tensioning is applied.
4.2.7 Type VII—For use as a nonstress carrying sealer for segmental precast elements when temporary post tensioning is not
applied as in span-by-span erection.
NOTE 1— Epoxy resin systems will adhere to a wide variety of materials, including wood, metals, masonry, and most plastics. Polyethylene,
TFE-fluorocarbon, cellophane, and greased or waxed surfaces are among the few materials to which these systems will not adhere.
4.3 Grades—Three grades of systems are defined according to their flow characteristics and are distinguished by the viscosity
and consistency requirements of Table 1.
4.3.1 Grade 1—Low viscosity.
4.3.2 Grade 2—Medium viscosity.
4.3.3 Grade 3—Non-sagging consistency.
4.4 Classes—Classes A, B, and C are defined for Types I through V, and Classes D, E, and F are defined for Types VI and VII,
in accordance with the range of temperatures for which they are suitable (Note 2).
4.4.1 Class A—For use below 40 °F [4 °C] the lowest allowable temperature to be defined by the manufacturer of the product.
4.4.2 Class B—For use between 40 and 60 °F [4 and 15 °C].
4.4.3 Class C—For use above 60 °F [15 °C] the highest allowable temperature to be defined by the manufacturer of the product.
4.4.4 Class D—For use between 40 and 65 °F [4 and 18 °C] for Type VI and VII applications.
4.4.5 Class E—For use between 60 and 80 °F [15 and 30 °C] for Type VI and VII applications.
4.4.6 Class F—For use above 75 °F [25 °C] for Type VI and VII applications, the highest allowable temperature to be defined
by the manufacturer of the product.
NOTE 2—The temperature in question is usually that of the surface of the hardened concrete to which the bonding system is to be applied. This
temperature may be considerably different from that of the air. Where unusual curing rates are desired it is possible to use a class of bonding agent at
a temperature other than that for which it is normally intended. For example, a Class A system will cure rapidly at room temperature.
4.5 Color—Epoxy resin systems are normally unpigmented, but they can be colored or darkened. If a specific color is desired,
it should be so stated by the purchaser.
C881/C881M − 14
TABLE 1 Physical Requirements of Bonding Systems
Type
Property
I II III IV V VI VII
Viscosity, P [Pa·s]:
Grade 1, max 20[2.0] 20[2.0] 20[2.0] 20[2.0] 20[2.0] . .
Grade 2, min 20[2.0] 20[2.0] 20[2.0] 20[2.0] 20[2.0] . .
max 100[10] 100[10] 100[10] 100[10] 100[10] . .
Consistency, in
[mm]:
1 1 1 1 1 1 1
Grade 3, Types I, ⁄4 [6.0] ⁄4 [6.0] ⁄4 [6.0] ⁄4 [6.0] ⁄4 [6.0] ⁄4 [6.0] ⁄4 [6.0]
II, III, IV, V, VI,
VII,
max
Gel time, minutes, 30 30 30 30 30 30 30
min
Bond strength, min,
psi [MPa]:
2 days 1000[7.0] . . 1000[7.0] . 1000[7.0] .
(moist
cure)
14 days (moist 1500[10.0] 1500[10.0] 1500[10.0] 1500[10.0] 1500[10.0] . 1000[7.0]
cure)
Absorption, 24 h 1 1 1 1 1 . .
max, %
Heat Deflection
Temperature, min,
°F [°C]:
7 days . . . 120[50] 120[50] . .
14 days . . . . . 120[50] 120[50]
Thermal . . passes test . . . .
compatibility
Linear coefficient of 0.005 0.005 . 0.005 0.005 . .
shrinkage on
cure,
max
Compressive Yield
Strength, min,
psi
[MPa]:
24 h . . . . . 2000[14.0] .
36 h . . . . . . 1000[7.0]
48 h . . . . . 6000[40.0] .
72 h . . . . . . 2000[14.0]
7 days 8000[55.0] 5000[35.0] . 10 000[70.0] 8000[55.0] . .
Compressive
Modulus, psi
[MPa]
Min 150 000[1000] 90 000[600] . 200 000[1400] 150 000[1000] . .
Max . . 130 000[896] . . . .
Tensile Strength, 7 5000[35.0] 2000[14.0] . 7000[50.0] 6000[40.0] . .
days min, psi
A
[MPa]
Elongation at 1 1 30 1 1 . .
A
Break, %, min
Contact strength,
psi
[MPa] min
2 days . . . . . 1000[7.0] .
14 days . . . . . . 1000[7.0]
A
Not required for Viscosity Grade 3 Systems.
5. Ordering Information
5.1 The purchaser shall specify the type, grade, class, and color of bonding system desired and the size of units in which the
components shall be furnished. Special requirements regarding filling of either the components or the final bonding system should
be stated. The product furnished under this specification is intended to be resistant to moisture and therefore should be suitable
for either indoor or outdoor exposure.
5.2 The purchaser may specify a minimum gel time of 5 min for Types I and IV when automatic proportioning, mixing, and
dispensing equipment are used.
6. Materials and Manufacture
6.1 The systems covered by this specification shall be furnished in two components for combining immediately prior to use in
accordance with written instructions of the formulator. Component A shall contain an epoxy resin with or without a reactive
C881/C881M − 14
diluent. Component B shall contain one or more curing agents, which on mixing with Component A shall cause the mixture to
harden. A suitable inert filler may be uniformly incorporated in one or both components. The filler shall be either nonsettling or
readily dispersible in any component in which it is incorporated. All systems shall cure under humid conditions, and bond to damp
surfaces.
7. Chemical Composition
7.1 The epoxy resin constituent of Component A shall have an epoxy equivalent of 155 to 275.
8. Physical Properties
8.1 A mixture of Components A and B in the proportions recommended by the formulator shall conform to the properties
prescribed in Table 1.
9. Safety Hazards
9.1 Caution: Epoxy resins contain irritants, especially to the skin, eyes, and respiratory system. Persons handling these
materials shall use appropriate protective clothing, including rubber or plastic gloves. If an epoxy resin should contact the skin,
it shall be removed immediately with a dry cloth or paper towel, and the area of contact washed thoroughly with soap and water.
Solvents shall not be used, because they carry the irritant into the skin. Cured epoxy resins are innocuous.
10. Sampling
10.1 Take a representative sample of each of the two components from a well-blended lot prior to packaging or by withdrawing
samples from no fewer than 5 % of the containers comprising the lot or shipment. Unless the samples of the same component taken
from containers show visual evidence of variability, they may be combined into a single composite sample. In place of the
foregoing, packaged materials may be sampled by a random selection of containers of each component from each lot, provided
such a procedure is acceptable to the purchaser.
11. Test Methods
11.1 Consistency—Test Method to Determine The Consistency of an Epoxy Resin System.
11.1.1 Scope—This test provides a method for determining the consistency of Grade 3 epoxy resin systems.
11.1.2 Significance and Use—This test method is used to determine compliance with the requirements of the specification.
11.1.3 Apparatus:
11.1.3.1 Paper cup—Approximately 3 oz. [approximately 0.100L] unwaxed paper cup.
11.1.3.2 Mixing blade—Ordinary wooden tongue depressor or stick of similar size.
11.1.3.3 Glass panel.
11.1.4 Conditioning—Condition the individual components and any equipment with which they will come in contact to the
following temperatures: Class A, 32 6 2 °F [0 6 1 °C]; Class B, 50 6 2 °F [10 6 1 °C]; Class C, 73 6 2 °F [23 6 1 °C], Class
D, 65 6 2 °F [18 6 1 °C]; Class E, 80 6 2 °F [27 6 1 °C]; Class F, 90 6 2 °F [32 6 1 °C] or to the temperature at which the
material will b
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