ASTM E1237-93(2003)
(Guide)Standard Guide for Installing Bonded Resistance Strain Gages
Standard Guide for Installing Bonded Resistance Strain Gages
SIGNIFICANCE AND USE
Methods and procedures used in installing bonded resistance strain gages can have significant effects upon the performance of those sensors. Optimum and reproducible detection of surface deformation requires appropriate and consistent surface preparation, mounting procedures, and verification techniques.
SCOPE
1.1 This document provides guidelines for installing bonded resistance strain gages. It is not intended to be used for bulk or diffused semiconductor gages. This document pertains only to adhesively bonded strain gages.
1.2 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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Designation: E 1237 – 93 (Reapproved 2003)
Standard Guide for
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Installing Bonded Resistance Strain Gages
This standard is issued under the fixed designation E1237; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the Department of Defense.
1. Scope
1.1 Thisdocumentprovidesguidelinesforinstallingbonded
resistance strain gages. It is not intended to be used for bulk or
diffused semiconductor gages. This document pertains only to
adhesively bonded strain gages.
1.2 This standard does not purport to address all of the
safety concerns, if any, associated with its use. It is the
responsibility of the user of this standard to establish appro-
priate safety and health practices and determine the applica-
FIG. 1 Designation of Strain Gage Bridge and Color Code of Lead
bility of regulatory limitations prior to use.
Wires (Full Bridge)
2. Referenced Documents
3.2.1 bonded resistance strain gage—a resistive element
2.1 ASTM Standards:
with a carrier that is attached by bonding to the base material
E251 Test Methods for Performance Characteristics of
so that the resistance of the element will vary as the surface of
2
Metallic Bonded Resistance Strain Gages
the base material to which it is attached is deformed. (For a
2.2 Other Standards:
complete definition of this term see Test Methods E251.)
ANSI/SEM 1-1984; Standard for Portable Strain-Indicating
4. Significance and Use
Instruments—Designation of Strain Gage Bridge and
3
Color Code of Terminal Connections; August 16, 1984.
4.1 Methods and procedures used in installing bonded
resistance strain gages can have significant effects upon the
3. Terminology
performance of those sensors. Optimum and reproducible
3.1 Definitions:
detection of surface deformation requires appropriate and
3.1.1 lead wire—an electrical conductor used to connect a
consistent surface preparation, mounting procedures, and veri-
sensor to its instrumentation.
fication techniques.
3.1.2 resistance strain gage bridge—a common
5. Gage Selection
Wheatsone bridge made up of strain gages used for the
measurement of small changes of resistance produced by a
5.1 Careful consideration must be given to the intended use
strain gage, where the gages may be wired in the following
when selecting an appropriate gage. Installation and operating
configuration (see also Fig. 1 and Fig. 2):
characteristics of a gage are affected by many factors such as
Arm 1 between+excitation and−signal
resistive element alloy, carrier material, gage length, gage and
Arm 2 between−excitation and−signal
Arm 3 between+signal and−excitation
Arm 4 between+signal and+excitation
3.2 Definitions of Terms Specific to This Standard:
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This guide is under the jurisdiction of ASTM Committee E28 on Mechanical
Testing and is the direct responsibility of Subcommittee E28.01 on Calibration of
Mechanical Testing Machines and Apparatus.
Current edition approved Nov. 15, 2005. Published January 2004. Originally
approved in 1993. Last previous edition approved in 1998 as E1237–93(1998).
2
Annual Book of ASTM Standards, Vol 03.01.
3
Available from American National Standards Institute, 11 W. 42nd St., 13th FIG. 2 Designations of Strain Gage Bridge and Color Code of
1
floor, New York, NY 10036. Lead Wires ( ⁄4 Bridge)
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
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E 1237 – 93 (2003)
resistive element pattern, solder tab type and configuration, 7.2 Erroneous gage readings may be caused by poor bond-
temperature compensation characteristics, resistance of active ing of strain gages, which could be due to unremoved coatings
elements, gage factor, and options desired. suchaspaint,scale,rust,andoils.Poorbondingmayalsoresult
5.2 Factors that should also be considered include type of from applying gages to improperly prepared surfaces, such as
testorapplication,operatingtemperaturerange,environmental mirror smooth finishes or surfaces containing deep pits and
conditions,accuracyrequirements,stability,maximumelonga- gouges.
tion, test conditions (static or dynamic) and duration, and 7.3 Strain gage manufacturers supply surface preparation
simplicity and ease of installation. Dissipation of self- suggestions and recommendations.This information should be
generated heat to the carrier should be considered in selecting reviewed and considered when preparing base material sur-
gage resistance and size of grid. faces for the particular gages selected.
5.3 To minimize errors due to strain gr
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