Space product assurance - Techniques for radiation effects mitigation in ASICs and FPGAs handbook

This handbook provides a compilation of different techniques that can be used to mitigate the adverse effects of radiation in integrated circuits (ICs), with almost exclusive attention to Application Specific Integrated Circuits (ASICs) and Field Programmable Gate Arrays (FPGAs) to be used in space, and excluding other ICs like power devices, MMIC or sensors.
The target users of this handbook are developers and users of ICs which are meant to be used in a radiation environment. Following a bottom-up order, the techniques are presented according to the different stages of an IC development flow where they can be applied. Therefore, users of this handbook can be IC engineers involved in the selection, use or development of IC manufacturing processes, IC layouts and ASIC standard cell libraries, analogue and digital circuit designs, FPGAs, embedded memories, embedded software and the immediate electronic system (printed circuit board) containing the IC that can experience the radiation effects.
In addition, this handbook contains an overview of the space radiation environment and its effects in semiconductor devices, a section on how to validate the good implementation and effectiveness of the mitigation techniques, and a special section providing some general guidelines to help with the selection of the most adequate mitigation techniques including some examples of typical space project scenarios.
The information given in this ECSS Handbook is provided only as guidelines and for reference, and not to be used as requirements. ECSS Standards provide requirements that can be made applicable, while, ECSS Handbooks provide guidelines.

Raumfahrtproduktsicherung - Handbuch zu Minderungsmethoden von Strahlungseffekten auf ASICs und FPGAs

Ingénierie spatiale - Guide sur les techniques de durcissement des ASICs et FPGAs vis-à-vis des effets des radiations

Zagotavljanje kakovosti proizvodov v vesoljski tehniki - Priročnik za tehnike blaženja učinkov sevanja na vezja ASIC in FPGA

Ta priročnik podaja različne tehnike, ki jih je mogoče uporabiti za ublažitev škodljivih učinkov sevanja v integriranih vezjih (IC), s skoraj izključnim poudarkom na integriranih vezjih za določen namen (ASIC) in terensko programirljivih logičnih vezjih (FPGA), ki se uporabljajo v vesolju, pri čemer so izključena druga integrirana vezja, kot so omrežne naprave, mikrovalovna integrirana vezja (MMIC) ali senzorji.
Ciljni uporabniki tega priročnika so razvijalci in uporabniki integriranih vezij, namenjenih za uporabo v okolju s sevanjem. Tehnike so predstavljene v vrstnem redu od spodaj navzgor glede na različne stopnje poteka razvoja integriranih vezij, za katere jih je mogoče uporabiti. Uporabniki tega priročnika so torej lahko inženirji integriranih vezij, ki so vključeni v izbiro, uporabo ali razvoj postopkov izdelave integriranih vezij, postavitev integriranih vezij in knjižnic standardnih celic ASIC, načrtov analognih in digitalnih vezij, terensko programirljivih logičnih vezij, vgrajenih pomnilnikov, vgrajene programske opreme ter neposrednega elektronskega sistema (tiskanega vezja), ki vsebuje integrirano vezje, na katere lahko vpliva sevanje.
Ta priročnik vsebuje tudi pregled sevanja v vesoljskem okolju in njegovih učinkov v polprevodniških napravah, razdelek o tem, kako preveriti ustrezno izvajanje in učinkovitost tehnik blaženja, ter poseben razdelek, ki vsebuje nekaj splošnih smernic za pomoč pri izbiri najustreznejše tehnike blaženja, vključno z nekaterimi primeri običajnih scenarijev vesoljskih projektov.
Informacije v tem priročniku ECSS so zgolj smernice in reference ter se ne uporabljajo kot zahteve. Standardi ECSS podajajo zahteve, ki jih je mogoče uporabiti, medtem ko priročniki ECSS podajajo smernice.

General Information

Status
Published
Publication Date
30-Nov-2021
Technical Committee
Current Stage
6060 - Definitive text made available (DAV) - Publishing
Start Date
01-Dec-2021
Due Date
29-Dec-2022
Completion Date
01-Dec-2021

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST-TP CEN/TR 17602-60-02:2022
01-februar-2022
Zagotavljanje kakovosti proizvodov v vesoljski tehniki - Priročnik za tehnike
blaženja učinkov sevanja na vezja ASIC in FPGA
Space product assurance - Techniques for radiation effects mitigation in ASICs and
FPGAs handbook
Raumfahrtproduktsicherung - Handbuch zu Minderungsmethoden von
Strahlungseffekten auf ASICs und FPGAs
Ingénierie spatiale - Guide sur les techniques de durcissement des ASICs et FPGAs vis-
à-vis des effets des radiations
Ta slovenski standard je istoveten z: CEN/TR 17602-60-02:2021
ICS:
03.120.99 Drugi standardi v zvezi s Other standards related to
kakovostjo quality
49.140 Vesoljski sistemi in operacije Space systems and
operations
SIST-TP CEN/TR 17602-60-02:2022 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST-TP CEN/TR 17602-60-02:2022

---------------------- Page: 2 ----------------------
SIST-TP CEN/TR 17602-60-02:2022


TECHNICAL REPORT CEN/TR 17602-60-02

RAPPORT TECHNIQUE

TECHNISCHER BERICHT
December 2021
ICS 49.140

English version

Space product assurance - Techniques for radiation effects
mitigation in ASICs and FPGAs handbook
Ingénierie spatiale - Guide sur les techniques de Raumfahrtproduktsicherung - Handbuch zu
durcissement des ASICs et FPGAs vis-à-vis des effets Minderungsmethoden von Strahlungseffekten auf
des radiations ASICs und FPGAs


This Technical Report was approved by CEN on 22 November 2021. It has been drawn up by the Technical Committee
CEN/CLC/JTC 5.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
























CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2021 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. CEN/TR 17602-60-02:2021 E
reserved worldwide for CEN national Members and for
CENELEC Members.

---------------------- Page: 3 ----------------------
SIST-TP CEN/TR 17602-60-02:2022
CEN/TR 17602-60-02:2021 (E)
Table of contents
European Foreword . 14
1 Scope . 15
2 References . 16
3 Terms, definitions and abbreviated terms . 17
3.1 Terms from other documents . 17
3.2 Terms specific to the present document . 17
3.3 Abbreviated terms. 19
4 Radiation environment and integrated circuits . 25
4.1 Overview . 25
4.2 Radiation environment in space . 25
4.3 Radiation Effects in ICs . 26
4.3.1 Overview . 26
4.3.2 Cumulative effects. 26
4.3.3 Single Event Effects (SEEs) . 27
4.3.3.1 Overview. 27
4.3.3.2 Non-destructive SEE . 28
4.3.3.3 Destructive SEE . 29
4.3.3.4 Summary . 30
5 Choosing a device hardening strategy . 31
5.1 The optimal strategy . 31
5.2 How to use this handbook . 32
6 Technology selection and process level mitigation . 35
6.1 Overview .
...

SLOVENSKI STANDARD
kSIST-TP FprCEN/TR 17602-60-02:2021
01-oktober-2021
Zagotavljanje kakovosti proizvodov v vesoljski tehniki - Priročnik za tehnike
blaženja učinkov sevanja na vezja ASIC in FPGA
Space product assurance - Techniques for radiation effects mitigation in ASICs and
FPGAs handbook
Raumfahrtproduktsicherung - Handbuch zu Minderungsmethoden von
Strahlungseffekten auf ASICs und FPGAs
Ingénierie spatiale - Guide sur les techniques de durcissement des ASICs et FPGAs vis-
à-vis des effets des radiations
Ta slovenski standard je istoveten z: FprCEN/TR 17602-60-02
ICS:
03.120.99 Drugi standardi v zvezi s Other standards related to
kakovostjo quality
49.140 Vesoljski sistemi in operacije Space systems and
operations
kSIST-TP FprCEN/TR 17602-60-02:2021 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
kSIST-TP FprCEN/TR 17602-60-02:2021

---------------------- Page: 2 ----------------------
kSIST-TP FprCEN/TR 17602-60-02:2021


TECHNICAL REPORT
FINAL DRAFT
FprCEN/TR 17602-60-02
RAPPORT TECHNIQUE

TECHNISCHER BERICHT

July 2021
ICS 49.140

English version

Space product assurance - Techniques for radiation effects
mitigation in ASICs and FPGAs handbook
Ingénierie spatiale - Guide sur les techniques de Raumfahrtproduktsicherung - Handbuch zu
durcissement des ASICs et FPGAs vis-à-vis des effets Minderungsmethoden von Strahlungseffekten auf
des radiations ASICs und FPGAs


This draft Technical Report is submitted to CEN members for Vote. It has been drawn up by the Technical Committee
CEN/CLC/JTC 5.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.

Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are
aware and to provide supporting documentation.

Warning : This document is not a Technical Report. It is distributed for review and comments. It is subject to change without
notice and shall not be referred to as a Technical Report.





















CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2021 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. FprCEN/TR 17602-60-02:2021 E
reserved worldwide for CEN national Members and for
CENELEC Members.

---------------------- Page: 3 ----------------------
kSIST-TP FprCEN/TR 17602-60-02:2021
FprCEN/TR 17602-60-02:2021 (E)
Table of contents
European Foreword . 14
1 Scope . 15
2 References . 16
3 Terms, definitions and abbreviated terms . 17
3.1 Terms from other documents . 17
3.2 Terms specific to the present document . 17
3.3 Abbreviated terms. 19
4 Radiation environment and integrated circuits . 25
4.1 Overview . 25
4.2 Radiation environment in space . 25
4.3 Radiation Effects in ICs . 26
4.3.1 Overview . 26
4.3.2 Cumulative effects. 26
4.3.3 Single Event Effects (SEEs) . 27
4.3.3.1 Overview. 27
4.3.3.2 Non-destructive SEE . 28
4.3.3.3 Destructive SEE . 29
4.3.3.4 Summary . 30
5 Choosing a device hardening strategy .
...

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