EN IEC 62969-4:2018
(Main)Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors
IEC 62969-4:2018 specifies a method of directly fault injection test for automotive semiconductor sensor interface that can be used to support the conformance assurance in the vehicle communications interface.
Halbleiterbauelemente - Halbleiterschnittstelle für Automobile - Teil 4: Bewertungsverfahren für Datenschnittstellen bei Automobil-Sensoren
Dispositifs à semiconducteurs - Interface à semiconducteurs pour les véhicules automobiles - Partie 4: Méthode d’évaluation de l’interface de données destinée aux capteurs de véhicules automobiles
L’IEC 62969-4:2018 spécifie une méthode d’essai par injection directe de défaut pour l’interface à semiconducteurs des capteurs de véhicules automobiles, pouvant être utilisée pour assurer la conformité de l’interface de communication du véhicule.
Polprevodniški elementi - Polprevodniški vmesniki za motorna vozila - 4. del: Metoda vrednotenja podatkovnega vmesnika za senzorje motornih vozil (IEC 62969-4:2018)
Ta del standarda IEC 62969 določa neposredno preskusno metodo za odkrivanje napak pri vbrizgavanju za polprevodniški vmesnik za motorna vozila, ki se lahko uporablja za zagotavljanje skladnosti delovanja komunikacijskega vmesnika vozila.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-november-2018
Polprevodniški elementi - Polprevodniški vmesniki za motorna vozila - 4. del:
Metoda vrednotenja podatkovnega vmesnika za senzorje motornih vozil (IEC
62969-4:2018)
Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 4:
Evaluation method of data interface for automotive vehicle sensors (IEC 62969-4:2018)
Ta slovenski standard je istoveten z: EN IEC 62969-4:2018
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
43.040.10 (OHNWULþQDLQHOHNWURQVND Electrical and electronic
RSUHPD equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 62969-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
August 2018
ICS 31.080.99
English Version
Semiconductor devices - Semiconductor interface for automotive
vehicles - Part 4: Evaluation method of data interface for
automotive vehicle sensors
(IEC 62969-4:2018)
Dispositifs à semiconducteurs - Interface à Halbleiterbauelemente - Halbleiterschnittstelle für
semiconducteurs pour les véhicules automobiles - Partie 4: Automobile - Teil 4: Bewertungsverfahren für
Méthode d'évaluation de l'interface de données destinée Datenschnittstellen bei Automobil-Sensoren
aux capteurs de véhicules automobiles (IEC 62969-4:2018)
(IEC 62969-4:2018)
This European Standard was approved by CENELEC on 2018-08-22. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62969-4:2018 E
European foreword
The text of document 47/2470/FDIS, future edition 1 of IEC 62969-4, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 62969-4:2018.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2019-05-22
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2021-08-22
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62969-4:2018 was approved by CENELEC as a European
Standard without any modification.
IEC 62969-4 ®
Edition 1.0 2018-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 4: Evaluation method of data interface for automotive vehicle sensors
Dispositifs à semiconducteurs – Interface à semiconducteurs pour les véhicules
automobiles –
Partie 4: Méthode d’évaluation de l’interface de données destinée aux capteurs
de véhicules automobiles
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-5791-3
– 2 – IEC 62969-4:2018 © IEC 2018
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms, definitions and abbreviated terms . 6
3.1 Terms and definitions . 6
3.2 Abbreviated terms . 7
4 Evaluation and tests . 7
4.1 Evaluation test setup . 7
4.2 Block diagram . 7
4.3 Input and output connector setup . 8
4.4 Test conditions and configurations . 8
4.5 Disturbances test conditions . 9
5 Disturbance test item . 10
5.1 Data interface load . 10
5.1.1 Variable impedance . 10
5.1.2 Direct crosstalk . 11
5.1.3 Diagonal crosstalk . 11
5.2 Data interface line status . 11
5.2.1 Short circuit . 11
5.2.2 Data interface break . 12
5.3 Fault injection . 12
5.3.1 Disturbing signals . 12
5.3.2 Overwrite signals . 14
5.3.3 Signal generator . 15
5.3.4 Trigger . 15
Annex A (informative) Description of disturbance detail items . 17
Bibliography . 19
Figure 1 – The semiconductor-based sensor data interface test with fault injection . 7
Figure 2 – Block diagram of the data interface example of duplex channel . 8
Figure 3 – Fault injection test configuration example of the sensor data interface . 10
Figure 4 – Disturbing signal put onto the data interface . 13
Figure 5 – The node receives invalid signals . 14
IEC 62969-4:2018 © IEC 2018 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES –
Part 4: Evaluation method of data interface
for automotive vehicle sensors
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62969-4 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2470/FDIS 47/2487/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
– 4 – IEC 62969-4:2018 © IEC 2018
A list of all parts in the IEC 62969 series, published under the general title Semiconductor
devices – Semiconductor interface for automotive vehicles, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IEC 62969-4:2018 © IEC 2018 – 5 –
INTRODUCTION
The IEC 62969 series is composed of four parts as follow:
• IEC 62969-1 Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 1: General requirements of power interface for automotive vehicle sensors
• IEC 62969-2 Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 2: Efficiency evaluation methods of wireless power transmission using resonance for
automotive vehicle sensors
• IEC 62969-3 Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
• IEC 62969-4 Semiconductor devices – Semiconductor interface for automotive vehicles –
Part
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.