EN 61191-1:2013

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - reference standard IEC 61192-1 has been replaced by IPC-A-610; - some of the terminology has been updated; - references to IEC standards have been corrected; - the use of lead-free alloys in the assembly have been added.

Elektronikaufbauten auf Leiterplatten - Teil 1: Fachgrundspezifikation - Anforderungen an gelötete elektrische und elektronische Baugruppen unter Verwendung der Oberflächenmontage und verwandter Montagetechniken

Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives aux ensembles électriques et électroniques brasés utilisant les techniques de montage en surface et associées

La CEI 61191-1:2013 établit les exigences relatives aux matériaux, méthodes et critères de vérification utilisés dans le cadre de la production d'interconnexions et d'ensembles brasés de qualité faisant appel à la technique de montage en surface ainsi qu'à des techniques de montage associées. Il comprend également des recommandations concernant la qualité des processus de fabrication. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - remplacement de la norme de référence CEI 61192-1 par le document IPC-A-610; - mise à jour d'une partie de la terminologie; - correction des références aux normes CEI; - ajout de l'utilisation d'alliages sans plomb dans l'assemblage.

Sestavi plošč tiskanih vezij - 1. del: Rodovna specifikacija - Zahteve za spajkane električne in elektronske sestave, ki uporabljajo tehnologije površinske montaže in sorodne tehnologije (IEC 61191-1:2013)

Ta del standarda IEC 61191 določa zahteve za materiale, metode in kriterije za preverjanje za izdelavo kakovostnih spajkanih medsebojnih povezav in sestavov, ki uporabljajo tehnologije površinske montaže in sorodne tehnologije. Ta del standarda IEC 61191 vsebuje tudi priporočila za dobre postopke izdelave.

General Information

• Status: Withdrawn
• Publication Date: 29-Aug-2013
• Withdrawal Date: 24-Jun-2016
• ICS: 31.190 - Electronic component assemblies
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 19-Oct-2021
• Completion Date: 19-Oct-2021
• Ref Project: SIST EN 61191-1:2014 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Relations

• Replaces: EN 61191-1:1998 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
• Effective Date: 29-Jan-2023
• Replaced By: EN IEC 61191-1:2018 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
• Effective Date: 07-Jun-2022

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61191-1:2014
01-maj-2014
1DGRPHãþD
SIST EN 61191-1:2001
6HVWDYLSORãþWLVNDQLKYH]LMGHO5RGRYQDVSHFLILNDFLMD=DKWHYH]DVSDMNDQH
HOHNWULþQHLQHOHNWURQVNHVHVWDYHNLXSRUDEOMDMRWHKQRORJLMHSRYUãLQVNHPRQWDåHLQ
VRURGQHWHKQRORJLMH,(&
Printed board assemblies - Part 1: Generic specification - Requirements for soldered
electrical and electronic assemblies using surface mount and related assembly
technologies
Elektronikaufbauten auf Leiterplatten - Teil 1: Fachgrundspezifikation - Anforderungen an
gelötete elektrische und elektronische Baugruppen unter Verwendung der
Oberflächenmontage und verwandter Montagetechniken
Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives
aux ensembles électriques ou électroniques brasés utilisant les techniques de montage
en surface et associées
Ta slovenski standard je istoveten z: EN 61191-1:2013
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
SIST EN 61191-1:2014 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61191-1:2014

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SIST EN 61191-1:2014

EUROPEAN STANDARD
EN 61191-1

NORME EUROPÉENNE
August 2013
EUROPÄISCHE NORM

ICS 31.190; 31.240 Supersedes EN 61191-1:1998


English version


Printed board assemblies -
Part 1: Generic specification -
Requirements for soldered electrical and electronic assemblies using
surface mount and related assembly technologies
(IEC 61191-1:2013)


Ensembles de cartes imprimées -  Elektronikaufbauten auf Leiterplatten -
Partie 1: Spécification générique - Teil 1: Fachgrundspezifikation -
Exigences relatives aux ensembles Anforderungen an gelötete elektrische
électriques ou électroniques brasés und elektronische Baugruppen unter
utilisant les techniques de montage en Verwendung der Oberflächenmontage
surface et associées und verwandter Montagetechniken
(CEI 61191-1:2013) (IEC 61191-1:2013)




This European Standard was approved by CENELEC on 2013-06-25. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61191-1:2013 E

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SIST EN 61191-1:2014
EN 61191-1:2013 - 2 -
Foreword
The text of document 91/1089A/FDIS, future edition 2 of IEC 61191-1, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61191-1:2013.

The following dates are fixed:
• latest date by which the document has to be (dop) 2014-03-25
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national standards conflicting (dow) 2016-06-25
with the document have to be withdrawn

This document supersedes EN 61191-1:1998.

EN 61191-1:2013 includes the following significant technical changes with respect to
EN 61191-1:1998:
- reference standard EN 61192-1 has been replaced by IPC-A-610;
- some of the terminology has been updated;
- references to EN standards have been corrected;
- the use of lead-free alloys in the assembly have been added.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the Int
...