SIST EN 61191-1:2014

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.

Elektronikaufbauten auf Leiterplatten - Teil 1: Fachgrundspezifikation - Anforderungen an gelötete elektrische und elektronische Baugruppen unter Verwendung der Oberflächenmontage und verwandter Montagetechniken

Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives aux ensembles électriques ou électroniques brasés utilisant les techniques de montage en surface et associées

La CEI 61191-1:2013 établit les exigences relatives aux matériaux, méthodes et critères de vérification utilisés dans le cadre de la production d'interconnexions et d'ensembles brasés de qualité faisant appel à la technique de montage en surface ainsi qu'à des techniques de montage associées. Il comprend également des recommandations concernant la qualité des processus de fabrication. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:  - remplacement de la norme de référence CEI 61192-1 par le document IPC-A-610;  - mise à jour d'une partie de la terminologie;  - correction des références aux normes CEI;  - ajout de l'utilisation d'alliages sans plomb dans l'assemblage.

Sestavi plošč tiskanih vezij - 1. del: Rodovna specifikacija - Zahteve za spajkane električne in elektronske sestave, ki uporabljajo tehnologije površinske montaže in sorodne tehnologije (IEC 61191-1:2013)

Ta del standarda IEC 61191 določa zahteve za materiale, metode in kriterije za preverjanje za izdelavo kakovostnih spajkanih medsebojnih povezav in sestavov, ki uporabljajo tehnologije površinske montaže in sorodne tehnologije. Ta del standarda IEC 61191 vsebuje tudi priporočila za dobre postopke izdelave.

General Information

• Status: Published
• Publication Date: 09-Apr-2014
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 25-Mar-2014
• Due Date: 30-May-2014
• Completion Date: 10-Apr-2014
• Ref Project: EN 61191-1:2013 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Relations

• Replaces: SIST EN 61191-1:2001 - Printed board assemblies -- Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
• Effective Date: 01-Nov-2011
• Replaced By: SIST EN IEC 61191-1:2020 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
• Effective Date: 06-Nov-2018
• Replaced By: SIST EN IEC 61191-1:2020 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
• Effective Date: 07-Jun-2022
• Revised: SIST EN 61191-1:2001 - Printed board assemblies -- Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
• Effective Date: 06-May-2014
• Revised: SIST EN IEC 61191-1:2020 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
• Effective Date: 07-Jun-2016
• Replaces: SIST EN 61191-1:2001 - Printed board assemblies -- Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61191-1:2014
01-maj-2014
1DGRPHãþD
SIST EN 61191-1:2001
6HVWDYLSORãþWLVNDQLKYH]LMGHO5RGRYQDVSHFLILNDFLMD=DKWHYH]DVSDMNDQH
HOHNWULþQHLQHOHNWURQVNHVHVWDYHNLXSRUDEOMDMRWHKQRORJLMHSRYUãLQVNHPRQWDåHLQ
VRURGQHWHKQRORJLMH,(&
Printed board assemblies - Part 1: Generic specification - Requirements for soldered
electrical and electronic assemblies using surface mount and related assembly
technologies
Elektronikaufbauten auf Leiterplatten - Teil 1: Fachgrundspezifikation - Anforderungen an
gelötete elektrische und elektronische Baugruppen unter Verwendung der
Oberflächenmontage und verwandter Montagetechniken
Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives
aux ensembles électriques ou électroniques brasés utilisant les techniques de montage
en surface et associées
Ta slovenski standard je istoveten z: EN 61191-1:2013
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
SIST EN 61191-1:2014 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

SIST EN 61191-1:2014

---------------------- Page: 2 ----------------------

SIST EN 61191-1:2014

EUROPEAN STANDARD
EN 61191-1

NORME EUROPÉENNE
August 2013
EUROPÄISCHE NORM

ICS 31.190; 31.240 Supersedes EN 61191-1:1998


English version


Printed board assemblies -
Part 1: Generic specification -
Requirements for soldered electrical and electronic assemblies using
surface mount and related assembly technologies
(IEC 61191-1:2013)


Ensembles de cartes imprimées -  Elektronikaufbauten auf Leiterplatten -
Partie 1: Spécification générique - Teil 1: Fachgrundspezifikation -
Exigences relatives aux ensembles Anforderungen an gelötete elektrische
électriques ou électroniques brasés und elektronische Baugruppen unter
utilisant les techniques de montage en Verwendung der Oberflächenmontage
surface et associées und verwandter Montagetechniken
(CEI 61191-1:2013) (IEC 61191-1:2013)




This European Standard was approved by CENELEC on 2013-06-25. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61191-1:2013 E

---------------------- Page: 3 ----------------------

SIST EN 61191-1:2014
EN 61191-1:2013 - 2 -
Foreword
The text of document 91/1089A/FDIS, future edition 2 of IEC 61191-1, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61191-1:2013.

The following dates are fixed:
• latest date by which the document has to be (dop) 2014-03-25
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national standards conflicting (dow) 2016-06-25
with the document have to be withdrawn

This document supersedes EN 61191-1:1998.

EN 61191-1:2013 includes the following significant technical changes with respect to
EN 61191-1:1998:
- reference standard EN 61192-1 has been replaced by IPC-A-610;
- some of the terminology has been updated;
- references to EN standards have been corrected;
- the use of lead-free alloys in the assembly have been added.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 61191-1:2013 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-2-20:2008 NOTE Harmonised as EN 60068-2-20:2008 (not modified).
IEC 60068-2-58:2004 NOTE Harmonised as EN 60068-2-58:2004 (not modified).
IEC 61188-5-1:2002 NOTE Harmonised as EN 61188-5-1:2002 (not modified).
IEC 61188-5-2:2003 NOTE Harmonised as EN 61188-5-2:2003 (not modified).
IEC 61188-5-3:2007 NOTE Harmonised as EN 61188-5-3:2007 (not modified).
IEC 61188-5-4:2007 NOTE Harmonised as EN 61188-5-4:2007 (not modified).
IEC 61188-5-5:2007 NOTE Harmonised as EN 61188-5-5:2007 (not modified).
IEC 61188-5-6:2003 NOTE Harmonised as EN 61188-5-6:2003 (not modified).
IEC 61188-7:2009 NOTE Harmonised as EN 61188-7:2009 (not modified).
IEC 61189-2:2006 NOTE Harmonised as EN 61189-2:2006 (not modified).
IEC 61190-1-2:2007 NOTE Harmonised as EN 61190-1-2:2007 (not modified).
IEC 61193-1:2001 NOTE Harmonised as EN 61193-1:2002 (not modified).
IEC 61193-3 NOTE Harmonised as EN 61193-3.
IEC 62326-1:2002 NOTE Harmonised as EN 62326-1:2002 (not modified).
IEC 62326-4:1996 NOTE Harmonised as EN 62326-4:1997 (not modified).
IEC 62326-4-1:1996 NOTE Harmonised as EN 62326-4-1:1997 (not modified).
ISO 9001:2008 NOTE Harmonised as EN ISO 9001:2008 (not modified).

---------------------- Page: 4 ----------------------

SIST EN 61191-1:2014
- 3 - EN 61191-1:2013
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60194 - Printed board design, manufacture EN 60194 -
and assembly - Terms and definitions


IEC 60721-3-1 - Classification of environmental conditions - EN 60721-3-1 -
Part 3: Classification of groups of
environmental parameters and their
severities - Section 1: Storage


IEC 61188-1-1 - Printed boards and printed board EN 61188-1-1 -
assemblies - Design and use -
Part 1-1: Generic requirements - Flatness
considerations for electronic assemblies


IEC 61189-1 - Test methods for electrical materials, EN 61189-1 -
interconnection structures and assemblies -
Part 1: General test methods and
methodology


IEC 61189-3 - Test methods for electrical materials, EN 61189-3 -
printed boards and other interconnection
structures and assemblies -
Part 3: Test methods for interconnection
structures (printed boards)


IEC 61190-1-1 - Attachment materials for electronic EN 61190-1-1 -
assembly -
Part 1-1: Requirements for soldering fluxes
for high-quality interconnections in
electronics assembly


IEC 61190-1-2 - Attachment materials for electronic EN 61190-1-2 -
assembly -
Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics
assembly


IEC 61190-1-3 - Attachment materials for electronic EN 61190-1-3 -
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications


IEC 61191-2 - Printed board assemblies - EN 61191-2 -
Part 2: Sectional specification -
Requirements for surface mount soldered
assemblies

---------------------- Page: 5 ----------------------

SIST EN 61191-1:2014
EN 61191-1:2013 - 4 -
Publication Year Title EN/HD Year
IEC 61191-3 - Printed board assemblies - EN 61191-3 -
Part 3: Sectional specification -
Requirements for through-hole mount
soldered assemblies


IEC 61191-4 - Printed board assemblies - EN 61191-4 -
Part 4: Sectional specification -
Requirements for terminal soldered
assemblies


IEC 61249-8-8 - Materials for interconnection structures - EN 61249-8-8 -
Part 8: Sectional specification set for non-
conductive films and coatings - Section 8:
Temporary polymer coatings


IEC 61340-5-1 - Electrostatics - EN 61340-5-1 -
Part 5-1: Protection of electronic devices
from electrostatic phenomena - General
requirements


IEC/TR 61340-5-2 - Electrostatics - CLC/TR 61340-5-2 -
Part 5-2: Protection of electronic devices
from electrostatic phenomena - User guide


IEC 61760-2 - Surface mounting technology - EN 61760-2 -
Part 2: Transportation and storage
conditions of surface mounting devices
(SMD) - Application guide


IPC-A-610E 2010 Acceptability of Electronic Assemblies - -

---------------------- Page: 6 ----------------------

SIST EN 61191-1:2014



IEC 61191-1

®


Edition 2.0 2013-05




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Printed board assemblies –

Part 1: Generic specification – Requirements for soldered electrical and

electronic assemblies using surface mount and related assembly technologies




Ensembles de cartes imprimées –

Partie 1: Spécification générique – Exigences relatives aux ensembles


électriques et électroniques brasés utilisant les techniques de montage en

surface et associées












INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX X


ICS 31.190; 31.240 ISBN 978-2-83220-810-6



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 7 ----------------------

SIST EN 61191-1:2014
– 2 – 61191-1 © IEC:2013
CONTENTS

FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 9
4 General requirements . 10
4.1 Order of precedence. 10
4.1.1 General remark . 10
4.1.2 Conflict . 10
4.1.3 Conformance documentation . 10
4.2 Interpretation of requirements . 10
4.3 Classification . 11
4.4 Defects and process indicators . 11
4.5 Process control requirements . 11
4.6 Requirements flowdown . 11
4.7 Physical designs . 12
4.7.1 Design requirements . 12
4.7.2 New designs . 12
4.7.3 Existing designs . 12
4.8 Visual aids . 12
4.9 Proficiency of personnel . 12
4.9.1 Design proficiency . 12
4.9.2 Manufacturing proficiency . 12
4.10 Electrostatic discharge (ESD) . 12
4.11 Facilities . 13
4.11.1 General . 13
4.11.2 Environmental controls . 13
4.11.3 Temperature and humidity . 13
4.11.4 Lighting . 13
4.11.5 Field conditions . 13
4.11.6 Clean rooms . 13
4.12 Assembly tools and equipment . 13
4.12.1 General . 13
4.12.2 Process control . 14
5 Materials requirements . 14
5.1 Overview . 14
5.2 Solder . 14
5.3 Flux . 14
5.4 Solder paste . 15
5.5 Preform solder . 15
5.6 Adhesives . 15
5.7 Cleaning agents . 15
5.7.1 General . 15
5.7.2 Cleaning agents selection . 15
5.8 Polymeric coatings . 15
5.8.1 General . 15

---------------------- Page: 8 ----------------------

SIST EN 61191-1:2014
61191-1 © IEC:2013 – 3 –
5.8.2 Solder resists and localized maskants . 15
5.8.3 Conformal coating and encapsulants . 15
5.8.4 Spacers (permanent and temporary) . 16
5.9 Chemical strippers. 16
5.10 Heat shrinkable soldering devices . 16
6 Components and printed board requirements . 16
6.1 General . 16
6.2 Solderability . 16
6.2.1 Parts solderability . 16
6.2.2 Reconditioning . 16
6.2.3 Solderability testing of ceramic boards . 16
6.3 Solderability maintenance . 17
6.3.1 General . 17
6.3.2 Preconditioning . 17
6.3.3 Gold embrittlement of solder joints . 17
6.3.4 Tinning of non-solderable parts . 17
6.4 Solder purity maintenance . 18
6.5 Lead preparation . 18
6.5.1 General . 18
6.5.2 Lead forming . 19
6.5.3 Lead forming limits . 19
7 Assembly process requirements . 19
7.1 Overview . 19
7.2 Cleanliness . 19
7.3 Part markings and reference designations . 19
7.4 Solder connection contours . 19
7.5 Moisture traps . 19
7.6 Thermal dissipation . 20
8 Assembly soldering requirements . 20
8.1 General . 20
8.2 General . 20
8.2.1 Soldering process . 20
8.2.2 Machine maintenance . 20
8.2.3 Handling of parts . 20
8.2.4 Preheating . 20
8.2.5 Carriers . 20
8.2.6 Hold down of surface mount leads . 20
8.2.7 Heat application. 21
8.2.8 Cooling . 21
8.3 Reflow soldering . 21
8.3.1 Requirements . 21
8.3.2 Process development for reflow soldering . 21
8.3.3 Flux application . 21
8.3.4 Solder application . 21
8.4 Mechanized immersion soldering (non-reflow) . 22
8.4.1 General . 22
8.4.2 Process development for mechanized immersion soldering . 22
8.4.3 Drying/degassing . 23
8.4.4 Holding fixtures and materials . 23

---------------------- Page: 9 ----------------------

SIST EN 61191-1:2014
– 4 – 61191-1 © IEC:2013
8.4.5 Flux application . 23
8.4.6 Solder bath . 23
8.5 Manual/hand soldering . 23
8.5.1 Requirements . 23
8.5.2 Non-reflow manual soldering . 24
8.5.3 Reflow manual soldering. 24
9 Cleanliness requirements . 25
9.1 General . 25
9.2 Equipment and material compatibility . 25
9.3 Pre-soldering cleaning . 25
9.4 Post-soldering cleaning . 25
9.4.1 General . 25
9.4.2 Ultrasonic cleaning . 25
9.5 Cleanliness verification. 26
9.5.1 General . 26
9.5.2 Visual inspection . 26
9.5.3 Testing . 26
9.6 Cleanliness criteria . 26
9.6.1 General . 26
9.6.2 Particulate matter . 26
9.6.3 Flux residues and other ionic or organic contaminants . 26
9.6.4 Cleaning option . 27
9.6.5 Test for cleanliness . 27
9.6.6 Rosin residues on cleaned board assemblies . 27
9.6.7 Ionic residues (instrument method) . 28
9.6.8 Ionic residues (manual method) . 28
9.6.9 Surface insulation resistance (SIR) . 28
9.6.10 Other contamination . 28
10 Assembly requirements . 28
10.1 General . 28
10.2 Acceptance requirements . 28
10.2.1 Process control . 28
10.2.2 Corrective action limits . 29
10.2.3 Control limit determination . 29
10.3 General assembly requirements . 29
10.3.1 Assembly integrity . 29
10.3.2 Assembly damage . 29
10.3.3 Markings. 30
10.3.4 Flatness (bow and twist) . 30
10.3.5 Solder connection . 30
10.3.6 Interfacial connections . 31
11 Coating and encapsulation . 31
11.1 Detail requirements . 31
11.2 Conformal coating . 32
11.2.1 Coating instructions . 32
11.2.2 Application . 32
11.2.3 Performance requirements. 33
11.2.4 Rework of conformal coating . 34
11.2.5 Conformal coating inspection . 34

---------------------- Page: 10 ----------------------

SIST EN 61191-1:2014
61191-1 © IEC:2013 – 5 –
11.3 Encapsulation . 34
11.3.1 Encapsulation instructions . 34
11.3.2 Application . 34
11.3.3 Performance requirements. 34
11.3.4 Rework of encapsulant material . 34
11.3.5 Encapsulant inspection . 34
12 Rework and repair . 35
12.1 General . 35
12.2 Rework of unsatisfactory soldered electrical and electronic assemblies . 35
12.3 Repair . 36
12.4 Post rework/repair cleaning . 36
13 Product quality assurance . 37
13.1 System requirements . 37
13.2 Ins
...