EN IEC 61189-2-805:2024
(Main)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-805: X/Y CTE Prüfung für dünne Basismaterialien mit TMA
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-805: Essai à faible CDT X/Y par TMA pour matériaux de base minces
L’IEC 61189-2-805:2024 définit la méthode à suivre pour la détermination du coefficient de dilatation thermique X/Y de matériaux isolants électriques minces par l’utilisation d’un analyseur thermomécanique (TMA, thermomechanical analyser). Cette méthode est applicable aux matériaux qui sont solides sur toute la plage de températures utilisée et qui conservent une rigidité suffisante sur toute la plage de températures, de telle sorte qu'une indentation irréversible du spécimen par la sonde de détection ne se produise pas.
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-805. del: Preskus X/Y CTE s termomehansko analizo (TMA) za tanke podložne materiale
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-maj-2025
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-805. del: Preskus X/Y CTE s termomehansko analizo (TMA)
za tanke podložne materiale
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen – Teil 2-805: X/Y CTE Prüfung für dünne Basismaterialien mit TMA
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles - Partie 2-805: Essai à faible CDT X/Y par TMA
pour matériaux de base minces
Ta slovenski standard je istoveten z: EN IEC 61189-2-805:2024
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61189-2-805
NORME EUROPÉENNE
EUROPÄISCHE NORM May 2024
ICS 31.180
English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 2-805: X/Y CTE
test for thin base materials by TMA
(IEC 61189-2-805:2024)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-805: Essai à faible CDT X/Y par TMA 805: X/Y CTE Prüfung für dünne Basismaterialien mit TMA
pour matériaux de base minces (IEC 61189-2-805:2024)
(IEC 61189-2-805:2024)
This European Standard was approved by CENELEC on 2024-05-23. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
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same status as the official versions.
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European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
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© 2024 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-805:2024 E
European foreword
The text of document 91/1755/CDV, future edition 1 of IEC 61189-2-805, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-805:2024.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2025-02-23
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2027-05-23
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-805:2024 was approved by CENELEC as a
European Standard without any modification.
IEC 61189-2-805 ®
Edition 1.0 2024-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-805: X/Y CTE test for thin base materials by TMA
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles –
Partie 2-805: Essai à faible CDT X/Y par TMA pour matériaux de base minces
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-8700-2
– 2 – IEC 61189-2-805:2024 © IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test specimens . 5
4.1 Preparation . 5
4.2 Number . 5
4.3 Form . 5
4.4 Conditioning . 6
5 Apparatus and materials . 6
6 Procedure . 6
7 Evaluation . 7
7.1 General . 7
7.2 Calculation of coefficient of thermal expansion curve . 8
7.3 Calculation of instantaneous coefficient of thermal expansion curve
(optional) . 9
8 Report . 9
Bibliography . 10
Figure 1 – TMA expansion curves: first heat cycles and second heat cycles . 6
Figure 2 – TMA expansion curve . 7
Figure 3 – TMA expansion curve and instantaneous CTE curve . 8
IEC 61189-2-805:2024 © IEC 2024 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-805: X/Y CTE test for thin base materials by TMA
FOREWORD
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all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
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shall not be held responsible for identifying any or all such patent rights.
IEC 61189-2-805 has been prepared IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1755/CDV 91/1782/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
– 4 – IEC 61189-2-805:2024 © IEC 2024
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.
IEC 61189-2-805:2024 © IEC 2024 – 5 –
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-805: X/Y CTE test for thin base materials by TMA
1 Scope
This part of IEC 61189 defines the method to be followed for the determination of the X/Y
coefficient of thermal expansion of thin electrical insulating materials via the use of a
thermomechanical analyser (TMA). This method is applicable to materials that are solid for the
entire range of temperature used, and that retain suffi
...
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