EN IEC 61189-2-804:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-804: Prüfverfahren für die Zeit bis zur Delaminierung - T260, T288, T300

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-804: Méthodes d'essai pour le temps de décollement interlaminaire - T260, T288, T300

L'IEC 61189-2-804:2023 définit une méthode d'essai pour déterminer le temps de décollement interlaminaire des matériaux de base et des cartes imprimées en utilisant un analyseur thermomécanique (TMA – thermomechanical analyser). Les températures utilisées pour cette évaluation sont généralement 260 °C, 288 °C et 300 °C, mais ne se limitent pas à ces valeurs.

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-804. del: Preskus ugotavljanja razmerja čas-delaminacija - T260, T288, T300

Ta mednarodni standard določa preskusno metodo za ugotavljanje razmerja čas-delaminacija osnovnih materialov in tiskanih vezij s termomehanskim analizatorjem (TMA). Ocenjevanje se običajno izvaja pri temperaturah 260 °C, 288 °C in 300 °C, vendar ni omejeno na te vrednosti.

General Information

• Status: Published
• Publication Date: 05-Oct-2023
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 06-Oct-2023
• Completion Date: 06-Oct-2023
• Ref Project: SIST EN IEC 61189-2-804:2023 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

Overview

EN IEC 61189-2-804:2023 is a European standard developed by CLC that specifies test methods for evaluating the time to delamination of electrical materials, printed boards, and other interconnection structures using a thermomechanical analyzer (TMA). This standard focuses on critical temperature points-typically 260 °C, 288 °C, and 300 °C-to assess the reliability and thermal integrity of printed circuit boards (PCBs) and laminate materials under thermomechanical stresses.

Delamination is a key failure mode in electronic assemblies, where layers within a composite material separate, negatively affecting circuit performance and durability. By standardizing the test procedure for time to delamination, EN IEC 61189-2-804:2023 helps manufacturers and quality control teams ensure materials meet stringent reliability criteria for high-temperature electronic applications.

Key Topics

• Scope and Purpose
  Defines test methods using TMA to measure time to delamination of base materials and multilayer PCBs operating at high temperatures.
• Specimen Preparation
  Requires specimens approximately 6.35 mm × 6.35 mm with smooth, burr-free edges, taken at least 25 mm from board edges to avoid edge effects, ensuring consistent and repeatable test results.
• Test Equipment
  Specifies use of a Thermal Mechanical Analyzer (TMA) capable of precision dimensional measurements (±0.001 mm), plus controlled drying chambers for preconditioning specimens.
• Test Procedure
  Outlines a stepwise method including specimen preconditioning at 105 °C, insertion into the TMA stage, applying a 49 mN force, heating at 10 °C/min to an isothermal temperature (commonly 260 °C, 288 °C, or 300 °C), and monitoring dimensional changes until delamination occurs or after 10 minutes.
• Data Interpretation
  Describes determining time to delamination from the onset of isothermal conditions to an irreversible specimen thickness change, with a graphical example provided for epoxy materials.
• Reporting
  Requires detailed test documentation including reference numbers, tester's name, test date, material identity, initial specimen thickness, and ambient lab conditions.

Applications

EN IEC 61189-2-804:2023 applies to a broad range of industries and scenarios where printed boards and electrical materials operate under thermal stress:

• Printed Circuit Board Manufacturing
  Ensures PCB laminates meet thermal reliability requirements before large-scale production, minimizing risks of board failure in field conditions.
• Quality Assurance in Electronics Assembly
  Enables manufacturers to verify the integrity of multi-layer interconnection structures subject to soldering and reflow conditions.
• Material Development and Selection
  Assists material scientists and engineers in benchmarking candidate laminates and base materials for enhanced thermal and mechanical stability.
• Compliance Testing
  Fulfills regulatory and customer requirements for certifying new materials or assemblies for use in high-reliability applications such as aerospace, automotive, and consumer electronics.
• Research and Reliability Engineering
  Provides a standardized procedure for academic and industrial research focused on improving the bonding and delamination resistance of PCB materials.

Related Standards

To fully utilize EN IEC 61189-2-804:2023, users should be familiar with and consider complementary standards:

• IEC 60194-1 – Printed Boards Design, Manufacture, and Assembly Vocabulary Part 1, offering definitions essential to understanding test terminology.
• IEC 61189 Series – A comprehensive collection covering test methods for printed boards and electronic assemblies, providing broader context and additional evaluation techniques.
• IPC Standards – Industry standards like IPC-CC-830 and IPC-4101 related to PCB materials and reliability testing.
• ISO/IEC Directives – Governing procedures and best practices for international standardization and documentation.

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By adhering to EN IEC 61189-2-804:2023 test methods, electronic manufacturers and materials suppliers can improve product reliability, optimize thermal performance of PCBs, and meet global quality and safety standards. This standardized approach to time to delamination testing supports innovation and durability in advanced electronic systems operating at elevated temperatures.

Standards Content (Sample)

SLOVENSKI STANDARD
01-december-2023
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-804. del: Preskus ugotavljanja razmerja čas-delaminacija -
T260, T288, T300
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen – Teil 2-804: Prüfverfahren für die Zeit bis zur Delaminierung – T260,
T288, T300
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 2-804: Méthodes d'essai pour le temps
de décollement interlaminaire - T260, T288, T300
Ta slovenski standard je istoveten z: EN IEC 61189-2-804:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61189-2-804

NORME EUROPÉENNE
EUROPÄISCHE NORM October 2023
ICS 31.180
English Version
Test methods for electrical materials, printed board and other
interconnection structures and assemblies - Part 2-804: Test
methods for time to delamination - T260, T288, T300
(IEC 61189-2-804:2023)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-804: Méthodes d'essai pour le temps 804: Prüfverfahren für die Zeit bis zur Delaminierung -
de décollement interlaminaire - T260, T288, T300 T260, T288, T300
(IEC 61189-2-804:2023) (IEC 61189-2-804:2023)
This European Standard was approved by CENELEC on 2023-09-29. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-804:2023 E

European foreword
The text of document 91/1874/FDIS, future edition 1 of IEC 61189-2-804, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-804:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-06-29
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-09-29
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-804:2023 was approved by CENELEC as a
European Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-1 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 1: Common
usage in printed board and electronic
assembly technologies
IEC 61189-2-804 ®
Edition 1.0 2023-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed board and other interconnection

structures and assemblies –
Part 2-804: Test methods for time to delamination – T260, T288, T300

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 2-804: Méthodes d'essai pour le temps de décollement interlaminaire –

T260, T288, T300
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180  ISBN 978-2-8322-7422-4

– 2 – IEC 61189-2-804:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Specimen preparation . 5
5 Test specimens . 5
6 Test equipment . 6
7 Test procedure . 6
8 Calculation . 6
9 Report . 7
Bibliography . 8

Figure 1 – A typical plot for an epoxy material at an isothermal temperature of 260 °C . 7

IEC 61189-2-804:2023 © IEC 2023 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-804: Test methods for time to delamination – T260, T288, T300

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
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Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters ex
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