EN IEC 61189-2-720:2024
(Main)Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-720: Erkennung von Fehlern in Verbindungsstrukturen durch Messung der Kapazität
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-720 : Détection de défauts présents dans les structures d'interconnexion par mesurage de la capacité
L’IEC 61189-2-720:2024 fournit une méthode pour évaluer les caractéristiques spécifiques des circuits imprimés en mesurant la capacité entre les traces conductrices et un plan de masse. Elle peut être utilisée pour établir une comparaison qualitative d'un spécimen d'essai par rapport à un circuit de référence. Cette méthode n'est pas destinée aux mesures quantitatives ni à l'évaluation de la conformité à une spécification.
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-720. del: Odkrivanje napak v povezovalnih strukturah z merjenjem kapacitivnosti
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-maj-2025
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-720. del: Odkrivanje napak v povezovalnih strukturah z
merjenjem kapacitivnosti
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-720: Detection of defects in interconnection structures by
measurement of capacitance
Prüfverfahren für elektrische Materialien, Leiterplatten und andere
Verbindungsstrukturen und -Baugruppen - Teil 2-720: Erkennung von Fehlern in
Verbindungsstrukturen durch Messung der Kapazität
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles - Partie 2-720: Détection de défauts présents
dans les structures d’interconnexion par mesurage de la capacité
Ta slovenski standard je istoveten z: EN IEC 61189-2-720:2024
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61189-2-720
NORME EUROPÉENNE
EUROPÄISCHE NORM April 2024
ICS 31.180
English Version
Test methods for electrical materials, circuit boards and other
interconnection structures and assemblies - Part 2-720:
Detection of defects in interconnection structures by
measurement of capacitance
(IEC 61189-2-720:2024)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für elektrische Materialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und -Baugruppen - Teil 2-
ensembles - Partie 2-720 : Détection de défauts présents 720: Erkennung von Fehlern in Verbindungsstrukturen
dans les structures d'interconnexion par mesurage de la durch Messung der Kapazität
capacité (IEC 61189-2-720:2024)
(IEC 61189-2-720:2024)
This European Standard was approved by CENELEC on 2024-04-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2024 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-720:2024 E
European foreword
The text of document 91/1923/FDIS, future edition 1 of IEC 61189-2-720, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-720:2024.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2025-01-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2027-04-10
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-720:2024 was approved by CENELEC as a
European Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61189-2-720 ®
Edition 1.0 2024-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, circuit boards and other interconnection
structures and assemblies –
Part 2-720: Detection of defects in interconnection structures by measurement
of capacitance
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-720 : Détection de défauts présents dans les structures
d'interconnexion par mesurage de la capacité
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-8327-1
– 2 – IEC 61189-2-720:2024 © IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Objective . 5
5 Test specimen . 6
6 Test method . 6
7 Test procedures . 7
8 Report . 8
Annex A (informative) The capacitive test method . 9
A.1 Test schematic . 9
A.2 Test result. 9
Figure 1 – Capacitance difference depending on the defect of mouse bite . 6
Figure 2 – Test specimen . 6
Figure 3 – Schematic of the capacitance test method . 7
Figure A.1 – Test schematic . 9
Table 1 – Definition of uppercase . 8
Table A.1 – Test result for the test specimen . 10
IEC 61189-2-720:2024 © IEC 2024 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, CIRCUIT BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-720: Detection of defects in interconnection
structures by measurement of capacitance
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
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members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity, or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
may be required to implement this document. However, implementers are cautioned that this may not represent
the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
shall not be held responsible for identifying any or all such patent rights.
IEC 61189-2-720 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1923/FDIS 91/1934/RVD
Full information on the voting for the approval of this International Standard can be found in the
report on voting indicated in the above table.
The language used for the development of this International Standard is English.
– 4 – IEC 61189-2-720:2024 © IEC 2024
This document has been drafted in accordance with the ISO/IEC Directives, Part 2 2, and
developed in accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC
Supplement, available at www.iec.ch/members_experts/refdocs. The main document types
developed by IEC are described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, circuit boards and other interconnection structures and assemblies, can be
found on the IEC website.
Future standa
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