EN IEC 61189-2-805:2024

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-805: X/Y CTE Prüfung für dünne Basismaterialien mit TMA

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-805: Essai à faible CDT X/Y par TMA pour matériaux de base minces

L’IEC 61189-2-805:2024 définit la méthode à suivre pour la détermination du coefficient de dilatation thermique X/Y de matériaux isolants électriques minces par l’utilisation d’un analyseur thermomécanique (TMA, thermomechanical analyser). Cette méthode est applicable aux matériaux qui sont solides sur toute la plage de températures utilisée et qui conservent une rigidité suffisante sur toute la plage de températures, de telle sorte qu'une indentation irréversible du spécimen par la sonde de détection ne se produise pas.

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-805. del: Preskus X/Y CTE s termomehansko analizo (TMA) za tanke podložne materiale

General Information

• Status: Published
• Publication Date: 23-May-2024
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 24-May-2024
• Due Date: 26-Aug-2022
• Completion Date: 24-May-2024
• Ref Project: oSIST prEN IEC 61189-2-805:2022 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

Standards Content (Sample)

SLOVENSKI STANDARD
oSIST prEN IEC 61189-2-805:2022
01-januar-2022
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-805. del: Preskus X/Y CTE s termomehansko analizo (TMA)
za tanke podložne materiale
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles - Partie 2-805: Essai à faible CDT X/Y par TMA
pour matériaux de base minces
Ta slovenski standard je istoveten z: prEN IEC 61189-2-805:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
oSIST prEN IEC 61189-2-805:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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oSIST prEN IEC 61189-2-805:2022

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oSIST prEN IEC 61189-2-805:2022

91/1755/CDV

COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61189-2-805 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2021-10-22 2022-01-14
SUPERSEDES DOCUMENTS:
91/1696/CD, 91/1752/CC

IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Masahide Okamoto
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:

Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:

EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.

This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which
they are aware and to provide supporting documentation.

TITLE:
Test methods for electrical materials, printed board and other interconnection structures and
assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

PROPOSED STABILITY DATE: 2027

NOTE FROM TC/SC OFFICERS:


Copyright © 2021 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.

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oSIST prEN IEC 61189-2-805:2022
IEC CDV 61189-2-805-Ed1  IEC:2021 – 2 – 91/1755/CDV
1
2 CONTENTS
3
4 FOREWORD . 3
5 1  Scope . 5
6 2  Normative references . 5
7 3 Terms and definitions. 5
8 4 Test Specimens . 5
9 4.1 Preparation . 5
10 4.2 Number …………………………………………………………………………………….5
11 4.3  Form . 5
12 4.4  Conditioning . 6
13 5 Apparatus and Materials . 6
14 6 Procedure . 6
15 7 Evaluation . 7
16 7.1 Calculation of coefficient of thermal expansion curve . 8
17 a) CTE below glass transition . 8
18 b) CTE above glass transition . 8
19 7.2 Calculation of instantaneous coefficient of thermal expansion curve
20 (optional) .
...