EN 61193-1:2002
(Main)Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
Defines methods of registration and analysis of defects on soldered printed board assemblies. These methods are described to allow effective comparison of performance between products, processes and production locations, and can serve as a basis for general quality improvement.
Qualitätsbewertungssysteme - Teil 1: Protokollierung und Analyse von Fehlern auf bestückten Leiterplatten
Système d'assurance de la qualité - Partie 1: Enregistrement et analyse des défauts sur les cartes imprimées équipées
Définit les méthodes d'enregistrement et d'analyse de défauts sur les cartes imprimées équipées. Ces méthodes permettent de comparer les performances des produits, des processus et des sites de production, et peuvent servir de base pour améliorer la qualité générale.
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2002
Quality assessment systems - Part 1: Registration and analysis of defects on
printed board assemblies
Quality assessment systems -- Part 1: Registration and analysis of defects on printed
board assemblies
Qualitätsbewertungssysteme -- Teil 1: Protokollierung und Analyse von Fehlern auf
bestückten Leiterplatten
Système d'assurance de la qualité -- Partie 1: Enregistrement et analyse des défauts sur
les cartes imprimées équipées
Ta slovenski standard je istoveten z: EN 61193-1:2002
ICS:
03.120.99 Drugi standardi v zvezi s Other standards related to
kakovostjo quality
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 61193-1
NORME EUROPÉENNE
EUROPÄISCHE NORM February 2002
ICS 31.190
English version
Quality assessment systems
Part 1: Registration and analysis of defects
on printed board assemblies
(IEC 61193-1:2001)
Système d'assurance de la qualité Qualitätsbewertungssysteme
Partie 1: Enregistrement et analyse Teil 1: Protokollierung und Analyse
des défauts sur les cartes von Fehlern auf bestückten Leiterplatten
imprimées équipées (IEC 61193-1:2001)
(CEI 61193-1:2001)
This European Standard was approved by CENELEC on 2002-02-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands,
Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61193-1:2002 E
Foreword
The text of document 91/265/FDIS, future edition 1 of IEC 61193-1, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 61193-1 on 2002-02-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2002-11-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-02-01
Annexes designated "normative" are part of the body of the standard.
Annexes designated "informative" are given for information only.
In this standard, annexes A and ZA are normative and annexes B, C and D are informative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61193-1:2001 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 61193-1:2001
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60194 - Printed board design, manufacture and--
assembly - Terms and definitions
1) 2)
IEC 61191-1 - Printed board assemblies EN 61191-1 1998
Part 1: Generic specification –
Requirements for soldered electrical
and electronic assemblies using surface
mount and related assembly
technologies
1) 2)
IEC 61191-2 - Part 2: Sectional specification – EN 61191-2 1998
Requirements for surface mount
soldered assemblies
1) 2)
IEC 61191-3 - Part 3: Sectional specification – EN 61191-3 1998
Requirements for through-hole mount
soldered assemblies
1) 2)
IEC 61191-4 - Part 4: Sectional specification – EN 61191-4 1998
Requirements for terminal soldered
assemblies
3)
IEC 61192-1 - Product performance requirements--
Part 1: Generic standard - Workmanship
requirements for soldered electronic
assemblies
3)
IEC 61192-2 - Part 2: Sectional standard - --
Workmanship requirements for surface
mount soldered electronic assemblies
3)
IEC 61192-3 - Part 3: Sectional standard - --
Workmanship requirements for through-
hole mount soldered assemblies
1)
Undated reference.
2)
Valid edition at time of issue.
3)
To be published.
Publication Year Title EN/HD Year
3)
IEC 61192-4 - Part 4: Sectional standard - --
Workmanship requirements for terminal
soldered assemblies
NORME
CEI
INTERNATIONALE IEC
61193-1
INTERNATIONAL
Première édition
STANDARD
First edition
2001-12
Système d'assurance de la qualité –
Partie 1:
Enregistrement et analyse des défauts
sur les cartes imprimées équipées
Quality assessment systems –
Part 1:
Registration and analysis of defects
on printed board assemblies
© IEC 2001 Droits de reproduction réservés ⎯ Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in
utilisée sous quelque forme que ce soit et par aucun procédé, any form or by any means, electronic or mechanical,
électronique ou mécanique, y compris la photocopie et les including photocopying and microfilm, without permission in
microfilms, sans l'accord écrit de l'éditeur. writing from the publisher.
International Electrotechnical Commission 3, rue de Varembé Geneva, Switzerland
Telefax: +41 22 919 0300 e-mail: inmail@iec.ch IEC web site http://www.iec.ch
CODE PRIX
Commission Electrotechnique Internationale
S
PRICE CODE
International Electrotechnical Commission
Pour prix, voir catalogue en vigueur
For price, see current catalogue
61193-1 © IEC:2001 – 3 –
CONTENTS
FOREWORD.5
INTRODUCTION.9
1 Scope.11
2 Normative references .11
3 Terms and definitions .13
4 Defect registration .19
4.1 Accept criteria .19
4.2 Counting of defects .19
4.3 Post-soldering defect registration .21
4.3.1 Defects found after testing.21
4.4 Defect subdivision .21
4.4.1 Defect sources .21
4.4.2 Defect registration form .21
4.5 Rework immediately prior to soldering .23
4.6 Defect data categories .23
5 Processing the data.23
6 Analysis.25
Annex A (normative) Subprocesses .27
Annex B (informative) Examples of product defect qualification .29
Annex C (informative) Examples of calculations.33
Annex D (informative) Example of registration of defects and processing of the data .37
Figure B.1 – Registration of defects .31
Figure D.1 – Data for defect registration .37
Figure D.2 – Subdivision into type of defect .39
Figure D.3 – Subdivision into type of component.39
Figure D.4 – Subdivision into defect source .39
Figure D.5 – ppm level printed board A, of the past 10 production days .41
Figure D.6 – ppm levels of the production per type of board.41
Table A.1 – Descriptions for subprocesses .27
Table C.1 – Example 1 (100 % check) .33
Table C.2 – Example 2 (random check) .35
Table D.1 – Three subdivisions.39
61193-1 © IEC:2001 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
QUALITY ASSESSMENT SYSTEMS –
Part 1: Registration and analysis of defects
on printed board assemblies
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61193-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/265/FDIS 91/273/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
Annex A forms an integral part of this standard.
Annexes B, C and D are for information only.
61193-1 © IEC:2001 – 7 –
The committee has decided that the contents of this publication will remain unchanged
until 2006. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
61193-1 © IEC:2001 – 9 –
INTRODUCTION
This part of IEC 61193 enables the counting of defects on soldered printed board assemblies
in the manufacture of electroni
...
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