Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 μ to 10 μ, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm. The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 17: Wölbungs-Prüfverfahren zur Bestimmung mechanischer Eigenschaften dünner Schichten

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 17: Méthode d'essai de renflement pour la mesure des propriétés mécaniques des couches minces

L'IEC 62047-17:2015 spécifie la méthode permettant d'effectuer des essais de renflement sur une couche autonome bombée dans une fenêtre. Le spécimen est fabriqué avec des matériaux de couche de structure micrométrique ou nanométrique, y compris les couches en métal, céramique et polymère, pour des MEMS, des micromachines et autres. L'épaisseur du film est comprise entre 0,1 μ et 10 μ et la largeur de la fenêtre à membrane rectangulaire et carrée ainsi que le diamètre de la membrane circulaire sont compris entre 0,5 mm et 4 mm. Les essais sont effectués à température ambiante par l'application d'une pression uniformément répartie sur le spécimen de couche d'essai avec fenêtre bombée. Le module d'élasticité et la contrainte résiduelle des matériaux de la couche peuvent être déterminés avec cette méthode.

Polprevodniški elementi - Mikroelektromehanski elementi - 17. del: Izboklinska preskusna metoda za merjenje mehanskih lastnosti tankih plasti

Ta del standarda IEC 62047 določa metodo za izvajanje izboklinskih preskusov na samostojnem filmu, ki je izbočen v oknu. Primerek je izdelan z makro/nano strukturnimi filmskimi materiali, vključno s kovinskimi, keramičnimi in polimernimi filmi, za MEMS, mikrostroje in drugo. Debelina filma je med 0,1 μm in 10 μm, širina pravokotnega in kvadratnega membranskega okna in premer krožne membrane pa je med 0,5 mm in 4 mm. Preskusi se izvajajo pri okoljski temperaturi tako, da se na preskusni primerek filma z izbočenim oknom nanaša enakomerno razporejen pritisk. S to metodo se lahko določa elastični modul in preostalo mehansko napetost filmskih materialov.

General Information

Status
Published
Publication Date
09-Jul-2015
Withdrawal Date
08-Apr-2018
Technical Committee
Drafting Committee
Current Stage
6060 - Document made available - Publishing
Start Date
10-Jul-2015
Completion Date
10-Jul-2015

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SLOVENSKI STANDARD
SIST EN 62047-17:2015
01-september-2015
Polprevodniški elementi - Mikroelektromehanski elementi - 17. del: Izboklinska
preskusna metoda za merjenje mehanskih lastnosti tankih plasti
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method
for measuring mechanical properties of thin films
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 17: Wölbungs-
Prüfverfahren zur Bestimmung mechanischer Eigenschaften dünner Schichten
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 17: Méthode
d'essai de renflement pour la mesure des propriétés mécaniques des couches minces
Ta slovenski standard je istoveten z: EN 62047-17:2015
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-17:2015 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62047-17:2015

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SIST EN 62047-17:2015


EUROPEAN STANDARD EN 62047-17

NORME EUROPÉENNE

EUROPÄISCHE NORM
July 2015
ICS 31.080.99

English Version
Semiconductor devices - Micro-electromechanical devices - Part
17: Bulge test method for measuring mechanical properties of
thin films
(IEC 62047-17:2015)
Dispositifs à semiconducteurs - Dispositifs Halbleiterbauelemente - Bauelemente der
microélectromécaniques - Partie 17: Méthode d'essai de Mikrosystemtechnik - Teil 17: Wölbungs-Prüfverfahren zur
renflement pour la mesure des propriétés mécaniques des Bestimmung mechanischer Eigenschaften dünner
couches minces Schichten
(IEC 62047-17:2015) (IEC 62047-17:2015)
This European Standard was approved by CENELEC on 2015-04-09. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 62047-17:2015 E

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SIST EN 62047-17:2015
EN 62047-17:2015
European foreword
The text of document 47F/210/FDIS, future edition 1 of IEC 62047-17, prepared by SC 47F
“Microelectromechanical systems” of IEC/TC 47 “Semiconductor devices" was submitted to the
IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-17:2015.

The following dates are fixed:
(dop) 2016-01-10
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2018-04-09
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 62047-17:2015 was approved by CENELEC as a European
Standard without any modification.
2

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SIST EN 62047-17:2015
 EN 62047-17:2015

Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by
...

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