SIST EN 62047-17:2015
(Main)Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
This part of IEC 62047 specifies the method for performing bulge tests on the free-standing
film that is bulged within a window. The specimen is fabricated with micro/nano structural film
materials, including metal, ceramic and polymer films, for MEMS, micromachines and others.
The thickness of the film is in the range of 0,1 μm to 10 μm, and the width of the rectangular
and square membrane window and the diameter of the circular membrane range from 0,5 mm
to 4 mm.
The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure
to the testing film specimen with bulging window.
Elastic modulus and residual stress for the film materials can be determined with this method.
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 17: Wölbungs-Prüfverfahren zur Bestimmung mechanischer Eigenschaften dünner Schichten
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 17: Méthode d'essai de renflement pour la mesure des propriétés mécaniques des couches minces
L'IEC 62047-17:2015 spécifie la méthode permettant d'effectuer des essais de renflement sur une couche autonome bombée dans une fenêtre. Le spécimen est fabriqué avec des matériaux de couche de structure micrométrique ou nanométrique, y compris les couches en métal, céramique et polymère, pour des MEMS, des micromachines et autres. L'épaisseur du film est comprise entre 0,1 μ et 10 μ et la largeur de la fenêtre à membrane rectangulaire et carrée ainsi que le diamètre de la membrane circulaire sont compris entre 0,5 mm et 4 mm. Les essais sont effectués à température ambiante par l'application d'une pression uniformément répartie sur le spécimen de couche d'essai avec fenêtre bombée. Le module d'élasticité et la contrainte résiduelle des matériaux de la couche peuvent être déterminés avec cette méthode.
Polprevodniški elementi - Mikroelektromehanski elementi - 17. del: Izboklinska preskusna metoda za merjenje mehanskih lastnosti tankih plasti
Ta del standarda IEC 62047 določa metodo za izvajanje izboklinskih preskusov na samostojnem filmu, ki je izbočen v oknu. Primerek je izdelan z makro/nano strukturnimi filmskimi materiali, vključno s kovinskimi, keramičnimi in polimernimi filmi, za MEMS, mikrostroje in drugo. Debelina filma je med 0,1 μm in 10 μm, širina pravokotnega in kvadratnega membranskega okna in premer krožne membrane pa je med 0,5 mm in 4 mm. Preskusi se izvajajo pri okoljski temperaturi tako, da se na preskusni primerek filma z izbočenim oknom nanaša enakomerno razporejen pritisk. S to metodo se lahko določa elastični modul in preostalo mehansko napetost filmskih materialov.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 62047-17:2015
01-september-2015
Polprevodniški elementi - Mikroelektromehanski elementi - 17. del: Izboklinska
preskusna metoda za merjenje mehanskih lastnosti tankih plasti
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method
for measuring mechanical properties of thin films
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 17: Wölbungs-
Prüfverfahren zur Bestimmung mechanischer Eigenschaften dünner Schichten
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 17: Méthode
d'essai de renflement pour la mesure des propriétés mécaniques des couches minces
Ta slovenski standard je istoveten z: EN 62047-17:2015
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-17:2015 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN 62047-17:2015
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SIST EN 62047-17:2015
EUROPEAN STANDARD EN 62047-17
NORME EUROPÉENNE
EUROPÄISCHE NORM
July 2015
ICS 31.080.99
English Version
Semiconductor devices - Micro-electromechanical devices - Part
17: Bulge test method for measuring mechanical properties of
thin films
(IEC 62047-17:2015)
Dispositifs à semiconducteurs - Dispositifs Halbleiterbauelemente - Bauelemente der
microélectromécaniques - Partie 17: Méthode d'essai de Mikrosystemtechnik - Teil 17: Wölbungs-Prüfverfahren zur
renflement pour la mesure des propriétés mécaniques des Bestimmung mechanischer Eigenschaften dünner
couches minces Schichten
(IEC 62047-17:2015) (IEC 62047-17:2015)
This European Standard was approved by CENELEC on 2015-04-09. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62047-17:2015 E
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SIST EN 62047-17:2015
EN 62047-17:2015
European foreword
The text of document 47F/210/FDIS, future edition 1 of IEC 62047-17, prepared by SC 47F
“Microelectromechanical systems” of IEC/TC 47 “Semiconductor devices" was submitted to the
IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-17:2015.
The following dates are fixed:
(dop) 2016-01-10
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2018-04-09
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62047-17:2015 was approved by CENELEC as a European
Standard without any modification.
2
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SIST EN 62047-17:2015
EN 62047-17:2015
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 62047-2 2006 Semiconductor devices - Micro- EN 62047-2 2006
electromechanical devices -- Part 2: Tensile
testing method of thin film materials
3
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SIST EN 62047-17:2015
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SIST EN 62047-17:2015
IEC 62047-17
®
Edition 1.0 2015-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 17: Bulge test method for measuring mechanical properties of thin films
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 17: Méthode d'essai de renflement pour la mesure des propriétés
mécaniques des couches minces
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-2295-9
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
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Marque déposée de la Commission Electrotechnique Internationale
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SIST EN 62047-17:2015
– 2 – IEC 62047-17:2015 © IEC 2015
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions and symbols. 6
3.1 Terms and definitions . 6
3.2 Symbols . 7
4 Principle of bulge test . 7
5 Test apparatus and environment . 8
5.1 General . 8
5.2 Apparatus . 9
5.2.1 Pressuring device . 9
5.2.2 Bulge (pressure) chamber. 9
5.2.3 Height measurement units . 9
5.3 Test environment . 10
6 Specimen . 10
6.1 General . 10
6.2 Shape and dimension of specimen . 10
6.3 Measurement of test piece dimension . 10
7 Test procedure and analysis . 11
7.1 Test procedure . 11
7.2 Data analysis . 12
8 Test report . 13
Annex A (informative) Determination of mechanical properties . 14
A.1 General . 14
A.2 Determination of mechanical properties using stress-strain curve . 14
A.3 Determination of mechanical properties using analysis of load-deflection . 16
Annex B (informative) Deformation measurement techniques . 19
B.1 General . 19
B.2 Laser interferometry technique . 19
B.3 Capacitance type measurement . 19
Annex C (informative) Example of test piece fabrication: MEMS process . 25
C.1 Test piece fabrication . 25
C.2 Measurement of shape of specimen . 26
Bibliography . 27
Figure 1 – Typical example of bulge specimen . 7
Figure 2 – Membrane window bulged by pressure . 8
Figure 3 – Typical example of bulge test apparatus . 8
Figure 4 – Bulge membrane window shapes . 10
Figure 5 – Example of typical pressure-height curve obtained from bulge test . 12
Figure A.1 – Determination of biaxial modulus in the stress-strain curve obtained from
bulge test . 18
Figure B.1 – Typical example of laser interferometer configuration . 21
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IEC 62047-17:2015 © IEC 2015 – 3 –
Figure B.2 – Typical fringe patterns obtained from laser Michelson interferometry and
ESPI system . 22
Figure B.3 – Typical example of the measurement system using a photo detector . 23
Figure B.4 – Schematic of capacitance bulge tester . 23
Figure B.5 – Typical example of relationship between bulge height and capacitance
change . 24
Figure C.1 – Example of fabrication procedure for bulge test piece . 25
Table 1 – Symbols and designations of a specimen . 7
Table A.1 – Examples of various expressions of parameters, C and C (ν), for thin
1 2
square films . 17
Table A.2 – Examples of various expressions of parameters, C and C (ν), for thin
1 2
spherical films . 17
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SIST EN 62047-17:2015
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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 17: Bulge test method for measuring
mechanical properties of thin films
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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6) All users should ensure that they have the latest edition of this publication.
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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-17 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/210/FDIS 47F/215/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
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SIST EN 62047-17:2015
IEC 62047-17:2015 © IEC 2015 – 5 –
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found in the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
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SIST EN 62047-17:2015
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SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 17: Bulge test method for measuring
mechanical properties of thin films
1 Scope
This part of IEC 62047 specifies the method for performing bulge tests on the free-standing
film that is bulged within a window. The specimen is fabricated with micro/nano structural film
materials, including metal, ceramic and polymer films, for MEMS, micromachines and others.
The thickness of the film is in the range of 0,1 µm to 10 µm, and the width of the rectangular
and square membrane window and the diameter of the circular membrane range from 0,5 mm
to 4 mm.
The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure
to the testing film specimen with bulging window.
Elastic modulus and residual stress for the film materials can be determined with this method.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 62047-2:2006, Semiconductor devices – Micro-electromechanical devices – Part 2:
Tensile testing method of thin film materials
3 Terms, definitions and symbols
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1.1
residual stress
σ
0
stress which exists in a specimen in the absence of an external load
3.1.2
biaxial modulus
M
elastic modulus in plane strain condition
3.1.3
membrane window
testing area, contacted directly with the pressure media and surrounded by a frame, in the
free standing film specimen
Note 1 to entry: See Figure 1.
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SIST EN 62047-17:2015
IEC 62047-17:2015 © IEC 2015 – 7 –
1 2
4
3
IEC
Key
1 top view 2 side view
3 membrane window 4 thin film deposited
Figure 1 – Typical example of bulge specimen
3.2 Symbols
The symbols used in this document are presented in Table 1 below.
Table 1 – Symbols and designations of a specimen
Symbol Unit Designation
t µm thickness of a membrane or thin film
R radius of a bulged membrane window
µm
maximum vertical displacement at the centre of the bulged
h
µm
window
d mm diameter in a circular window
half-width and half-length of the rectangular window,
respectively.
a,b mm
In case of square window, a equals to b.
p MPa differential pressure applied to the membrane window
C , C coefficients in generalized linear-elastic bulge equation
1 2
4 Principle of bulge test
Nominally free-standing film specimen with a frame surrounding a bulging membrane window
as shown in Figure 1 is required and it should be mounted on a bulge testing system which
can apply differential pressure to the specimen. Here, the pressure should be uniformly
distributed over the film in the window and loaded to the film in a constant and relatively static
rate. The geometry of the membrane window can be circular, square and rectangular shape.
NOTE 1 With selection of window geometry, analysis for determining stress and strain of the bulged film is
performed with different models, i.e. a spherical or a cyclindrical pressure vessel model.
The film, subjected to the differential pressure, over the window deforms in the out-of-plane
bulged form. By measuring the height, h, and pressure, p, from the bulged window, as
presented in Figure 2, pressure-deflection response and/or stress-strain relationship is
obtained through analysis model which can be chosen. The mechanical properties of the film,
t
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such as elastic modulus and residual stress, can be determined with the pressure-deflection
curve or stress-strain curve.
NOTE 2 The details of the analytic models are described in Annex A.
R
p
IEC
Figure 2 – Membrane window bulged by pressure
5 Test apparatus and environment
5.1 General
With applying pressure to the specimen, deformation response, i.e. change in bulge height,
in the membrane window shall be measured. In general, bulge test apparatus can be
composed of pressuring device, specimen holder and bulging height measurement units as
shown in Figure 3.
1
2
6
5
3
4
7
9 8
IEC
Key
1 deflection measurement system 4 pressure chamber 7 pressure gauge
2 specimen 5 membrane window 8 inlet
3 O-ring 6 substrate 9 outlet
Figure 3 – Typical example of bulge test apparatus
h
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5.2 Apparatus
5.2.1 Pressuring device
Pressuring device should be equipped to apply a specified continuous pressure with a
controlled rate or a certain level of pressure to the membrane window to be bulged. Pressure
media can be oil, gas and distilled water. In general, the device can be composed of a
pressure sensor and pressure controller. The controller should be with accuracy of 1 % in full
test scale.
NOTE At the pressures encountered in the tests, gas is over a million times more compressible than typical
liquids such as oil and distilled water.
5.2.2 Bulge (pressure) chamber
The pressure chamber should be as compact as possible, to reduce the compliance of the
test system. The volume, which has to be pressurized and which potentially contributes to the
compliance, would be minimized.
In the case liquid is used to pressurize the test system, the system contains as little air as
possible because even a small air bubble trapped inside the test system can dominate the
system’s compliance. It is recommended that the system including the chamber be designed
so that there are no places where air bubbles can hide and that the liquid can be refilled
easily. Special care shall be taken not to introduce air bubbles when samples is mounted and
removed.
The material of the chamber should be chosen considering the pressure media for the test
and testing pressure range.
In the case liquid is used to pressurize the test system, it is recommended that the testing
apparatus be made out of transparent acrylic sheet in order to see air bubbles and then to
minimize them trapped within the chamber.
The bulge chamber is connected to the pressurizing device and thus allows a specimen to be
deformed with fine control. The specimen is mounted on the bulge chamber by mechanical
clamping or epoxy gluing method, etc.
NOTE In the case of capacitance measurement type, the bulge chamber has an electrode and a mechanical
spacer. The electrode, which measures height change of a bulge specimen due to the deformation, is made of
copper-coated PCB. A mechanical spacer that is located between the specimen and the electrode controls a
sensitivity of capacitance change by adjusting thickness of the spacer.
The pressure inside the chamber shall be monitored and measured through suitable pressure
sensor which can be installed directly to the chamber or connected though tube transporting
the pressure without loss of the pressure to be measured.
It is recommended that exposition of the area of the pressure sensor to the pressure media
should be minimized and it has no indentation or internal cavities trapping air.
Nonlinearity and hysteresis of the pressure sensor is recommended to be less than 0,5 % and
be calibrated according to the pressure standard established in each country as a National
Standard.
5.2.3 Height measurement units
The height measurement unit should be installed in a position suitable to measure the
deformation of the membrane window and have a function of a continuous measurement
which is needed in order to determine the maximum deformation of the membrane window
bulged with applying pressure. The maximum deformation of the membrane window can be
determined from the measurement in full-field or top of the bulged area using the laser
interferometric system or capacitance type measurement system, which is described in detail
in Annex B.
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The resolution of the measurement device for the deflection measuring a bulged membrane
window by pressure should be in units of micrometer. The fine resolution of less than 0,1 % in
full scale is very important for an accurate measurement.
5.3 Test environment
It is recommended to perform a test under constant temperature and humidity. Temperature
change can induce thermal drift during deflection measurement. Temperature change during
the test should be less than 2 °C.
6 Specimen
6.1 General
The film materials used in the specimen shall be prepared by using the same fabrication
process as the actual device or materials fabrication.
There are many fabrication methods of the test piece depending on the applications. As an
example, the fabrication of the specimen with a frame is described in Annex B.
The film specimen without a frame can be prepared from the electroplating process.
6.2 Shape and dimension of specimen
The shapes of membrane windows can be rectangle, square and circle as shown in Figure 4.
Membrane window is surrounded with a thick substrate frame or frame jig which is not
deformed by pressure.
It is recommended that the half-width, a, of the rectangular and square membrane window and
the diameter, d, of the circular membrane be in the range from 0,5 mm to 4 mm.
In the case of rectangular window, the aspect ratio of length to width in a rectangular
membrane window is recommended to be equal to or greater than 4 due to plane strain
condition.
2a
2a
d
IEC
IEC
IEC
a) rectangular b) square c) circle
Figure 4 – Bulge membrane window shapes
6.3 Measurement of test piece dimension
To analyze the test results, the accurate measurement of the test piece dimension and
pressure is required since the dimensions are used to extract mechanical properties of test
materials. The thickness (t) and dimension of the window (width and length or diameter)
should be measured with very high accuracy with less than ±1 %. Special cares should be
taken to measure the window size by clearly dividing the window boundary.
The methods for measuring film thickness and accuracy given in Clause C.3 of
IEC 62047-2:2006 apply.
2b
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Special care should be taken to avoid damage on the specimen during the measurement.
7 Test procedure and analysis
7.1 Test procedure
The test procedure is as follows:
a) The bulge specimen should be attached to the bulge chamber in an appropriate method,
such as mechanical clamping or epoxy gluing method etc., not to cause unwanted stress,
such as bending, shear or combined stress, or in-plane distortion on the membrane.
It is desired to test considering clamping effect on the change in the bulge height. Hard
clamping on the specimen often causes residual stress on a membrane window. However,
to avoid pressure leakage in the bulge chamber, proper sealing method is required for the
test.
The specimen can be mechanically clamped to the chamber with screws. In general,
specimen holder to which the specimen would be attached is screwed tightly on to the
chamber. To prevent any leakages, an O-ring between the specimen holder (or specimen)
and the chamber can be used. Special care is required to be taken in positioning the O-
rin
...
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