EN 60191-6-3:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Stipulates a method for quad flat packs measuring dimensions which are classified into Form E.

Mechanische Normung von Halbleiterbauelemente - Teil 6-3: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Meßverfahren für QFP-Gehäusemaße

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-3: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Méthodes de mesure pour les boîtiers plats quadrangulaires (QFP)

La CEI 60191-6-3:2000 stipule une méthode de mesure des dimensions des boîtiers plats quadrangulaires (QFP) qui sont classés dans la forme E.

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Measuring methods for package dimensions of quad flat packs (QFP) (IEC 60191-6-3:2000)

General Information

• Status: Published
• Publication Date: 03-Dec-2000
• Withdrawal Date: 31-Oct-2003
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47D - Mechanical standardization of semiconductor devices
• Drafting Committee: IEC/SC 47D - IEC_SC_47D
• Parallel Committee: IEC/SC 47D - IEC_SC_47D
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 04-Dec-2000
• Completion Date: 04-Dec-2000
• Ref Project: SIST EN 60191-6-3:2002 - Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Measuring methods for package dimensions of quad flat packs (QFP) (IEC 60191-6-3:2000)Mechanische Normung von Halbleiterbauelemente -- Teil 6-3: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Meßverfahren für QFP-GehäusemaßeNormalisation mécanique des dispositifs à semiconducteurs -- Partie 6-3 : Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Méthodes de mesure pour les boîtiers plats quadrangulaires (QFP)Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)31.240Mehanske konstrukcije za elektronsko opremoMechanical structures for electronic equipment31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in general01.100.25Electrical and electronics engineering drawingsICS:Ta slovenski standard je istoveten z:EN 60191-6-3:2000SIST EN 60191-6-3:2002en01-september-2002SIST EN 60191-6-3:2002SLOVENSKI
STANDARD



SIST EN 60191-6-3:2002



EUROPEAN STANDARD
EN 60191-6-3 NORME EUROPÉENNE EUROPÄISCHE NORM
December 2000 CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2000 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-6-3:2000 E
ICS 31.080.01
English version
Mechanical standardization of semiconductor devices Part 6-3: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages -
Measuring methods for package dimensions of quad flat packs (QFP) (IEC 60191-6-3:2000)
Normalisation mécanique des dispositifs à semiconducteurs Partie 6-3 : Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Méthodes de mesure pour les boîtiers plats quadrangulaires (QFP) (CEI 60191-6-3:2000)
Mechanische Normung von Halbleiterbauelemente Teil 6-3: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitegehäusen -
Meßverfahren für QFP-Gehäusemaße (IEC 60191-6-3:2000)
This European Standard was approved by CENELEC on 2000-11-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.
SIST EN 60191-6-3:2002



Page 2 EN 60191-6-3:2000 Foreword The text of document 47D/370/FDIS, future edition 1 of IEC 60191-6-3, prepared by SC 47D, Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-3 on 2000-11-01. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop) 2001-08-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow) 2003-11-01 Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60191-6-3:2000 was approved by CENELEC as a European Standard without any modification. __________ SIST EN 60191-6-3:2002



Page 3 EN 60191-6-3:2000
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications This European Standard incorporates by dated or undated reference, provisions from other publications. These normative references are cited at the appropriate places in the text and the publications are listed hereafter. For dated references, subsequen
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