Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-1: Anforderungen an Weichlöt-Flussmittel für hochwertige Verbindungen in der Elektronikmontage

Matériaux de fixation pour les assemblages électroniques - Partie 1-1: Exigences relatives aux flux de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques

Spécifie les exigences d'ordre général relatives à la classification et au contrôle des flux de brasage pour les interconnexions de haute qualité dans l'assemblage des composants électroniques. La présente norme représente une caractérisation du flux, un contrôle de la qualité et un document de commande pour les flux à braser et les flux constitués de matériaux au sein de la technologie d'assemblage des composants électroniques.

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

General Information

Status
Published
Publication Date
13-Jun-2002
Withdrawal Date
31-May-2005
Drafting Committee
Parallel Committee
Current Stage
6060 - Document made available - Publishing
Start Date
14-Jun-2002
Completion Date
14-Jun-2002

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SLOVENSKI SIST EN 61190-1-1:2003

STANDARD
april 2003
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering
fluxes for high-quality interconnections in electronics assembly
ICS 25.160.50; 31.190 Referenčna številka
SIST EN 61190-1-1:2003(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 61190-1-1
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2002
ICS 31.190
English version
Attachment materials for electronic assembly
Part 1-1: Requirements for soldering fluxes for high-quality
interconnections in electronics assembly
(IEC 61190-1-1:2002)
Matériaux de fixation pour Verbindungsmaterialien für
les assemblages électroniques Baugruppen der Elektronik
Partie 1-1: Exigences relatives aux Teil 1-1: Anforderungen an Weichlöt-
flux de brasage pour les interconnexions Flussmittel für hochwertige Verbindungen
de haute qualité dans les assemblages in der Elektronikmontage
de composants électroniques (IEC 61190-1-1:2002)
(CEI 61190-1-1:2002)
This European Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-1:2002 E

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EN 61190-1-1:2002 - 2 -
Foreword
The text of document 91/277/FDIS, future edition 1 of IEC 61190-1-1, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 61190-1-1 on 2002-06-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-06-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annexes A and ZA are normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61190-1-1:2002 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2:2002 (not modified).
IEC 61190-1-3 NOTE Harmonized as EN 61190-1-3:2002 (not modified).
IEC 61191-1 NOTE Harmonized as EN 61191-1:1998 (not modified).
IEC 61191-2 NOTE Harmonized as EN 61191-2:1998 (not modified).
IEC 61191-3 NOTE Harmonized as EN 61191-3:1998 (not modified).
IEC 61191-4 NOTE Harmonized as EN 61191-4:1998 (not modified).
ISO 9000 NOTE Harmonized as EN ISO 9000:2000 (not modified).
ISO 9001 NOTE Harmonized as EN ISO 9001:2000 (not modified).

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- 3 - EN 61190-1-1:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60194 - Printed board design, manufacture and--
assembly
...

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