EN 61190-1-1:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-1: Anforderungen an Weichlöt-Flussmittel für hochwertige Verbindungen in der Elektronikmontage

Matériaux de fixation pour les assemblages électroniques - Partie 1-1: Exigences relatives aux flux de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques

Spécifie les exigences d'ordre général relatives à la classification et au contrôle des flux de brasage pour les interconnexions de haute qualité dans l'assemblage des composants électroniques. La présente norme représente une caractérisation du flux, un contrôle de la qualité et un document de commande pour les flux à braser et les flux constitués de matériaux au sein de la technologie d'assemblage des composants électroniques.

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

General Information

• Status: Published
• Publication Date: 13-Jun-2002
• Withdrawal Date: 31-May-2005
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 14-Jun-2002
• Completion Date: 14-Jun-2002
• Ref Project: SIST EN 61190-1-1:2003 - Attachment materials for electronic assembly -- Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Standards Content (Sample)

SLOVENSKI SIST EN 61190-1-1:2003

STANDARD
april 2003
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering
fluxes for high-quality interconnections in electronics assembly
ICS 25.160.50; 31.190 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 61190-1-1
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2002
ICS 31.190
English version
Attachment materials for electronic assembly
Part 1-1: Requirements for soldering fluxes for high-quality
interconnections in electronics assembly
(IEC 61190-1-1:2002)
Matériaux de fixation pour Verbindungsmaterialien für
les assemblages électroniques Baugruppen der Elektronik
Partie 1-1: Exigences relatives aux Teil 1-1: Anforderungen an Weichlöt-
flux de brasage pour les interconnexions Flussmittel für hochwertige Verbindungen
de haute qualité dans les assemblages in der Elektronikmontage
de composants électroniques (IEC 61190-1-1:2002)
(CEI 61190-1-1:2002)
This European Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-1:2002 E
Foreword
The text of document 91/277/FDIS, future edition 1 of IEC 61190-1-1, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 61190-1-1 on 2002-06-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-06-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annexes A and ZA are normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61190-1-1:2002 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2:2002 (not modified).
IEC 61190-1-3 NOTE Harmonized as EN 61190-1-3:2002 (not modified).
IEC 61191-1 NOTE Harmonized as EN 61191-1:1998 (not modified).
IEC 61191-2 NOTE Harmonized as EN 61191-2:1998 (not modified).
IEC 61191-3 NOTE Harmonized as EN 61191-3:1998 (not modified).
IEC 61191-4 NOTE Harmonized as EN 61191-4:1998 (not modified).
ISO 9000 NOTE Harmonized as EN ISO 9000:2000 (not modified).
ISO 9001 NOTE Harmonized as EN ISO 9001:2000 (not modified).

- 3 - EN 61190-1-1:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60194 - Printed board design, manufacture and--
assembly - Terms and definitions
1)
2)
IEC 61189-2 - Test methods for electrical materials, EN 61189-2 1997
printed boards and other + corr. August 1997
interconnection structures and
assemblies
Part 2: Test methods for materials for
interconnection structures
1) 2)
IEC 61189-3 - Part 3: Test methods for interconnection EN 61189-3 1997
structures (printed boards)
ISO 9002 1994 Quality systems - Model for quality EN ISO 9002 1994
assurance in production, installation and
servicing
1) 2)
ISO 9455-16 - Soft soldering fluxes - Test methods EN ISO 9455-16 2001
Part 16: Flux efficacy tests, wetting
balance method
1)
Undated reference.
2)
Valid edition at date of issue.

NORME
CEI
INTERNATIONALE IEC
61190-1-1
INTERNATIONAL
Première édition
STANDARD
First edition
2002-03
Matériaux de fixation pour les
assemblages électroniques –
Partie 1-1:
Exigences relatives aux flux de brasage
pour les interconnexions de haute qualité
dans les assemblages de composants
électroniques
Attachment materials for electronic assembly –
Part 1-1:
Requirements for soldering fluxes for high-quality
interconnections in electronics assembly
© IEC 2002 Droits de reproduction réservés ⎯ Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
CODE PRIX
S
Commission Electrotechnique Internationale PRICE CODE
International Electrotechnical Commission
ɆɟɠɞɭɧɚɪɨɞɧɚɹɗɥɟɤɬɪɨɬɟɯɧɢɱɟɫɤɚɹɄɨɦɢɫɫɢɹ
Pour prix, voir catalogue en vigueur
For price, see current catalogue

61190-1-1 © IEC:2002 – 3 –
CONTENTS
FOREWORD.7
INTRODUCTION.9
1 Scope and object.11
2 Normative references .11
3 Terms and definitions .11
4 Requirements .13
4.1 Conflict.13
4.2 Flux classification and testing.13
4.2.1 Standard classification for products .13
4.2.2 Composition .13
4.2.3 Activity .15
4.2.4 Flux characterization test methods .17
4.2.5 Qualification .21
4.2.6 Quality conformance.21
4.2.7 Performance.21
4.2.8 Labelling.25
5 Quality assurance provisions.25
5.1 Responsibility for inspection .25
5.1.1 Responsibility for compliance .25
5.1.2 Test equipment and inspection facilities .25
5.1.3 Inspection conditions .25
5.2 Classification of inspections .27
5.3 Materials inspection .27
5.4 Qualification inspection .27
5.4.1 Sample size.27
5.4.2 Inspection routine .27
5.5 Performance inspection.29
5.6 Quality conformance.29
5.6.1 Sampling plan.29
5.6.2 Rejected lots .31
5.7 Preparation of fluxes for testing.31
5.7.1 Flux form for test .31
5.7.2 Liquid fluxes .31
5.7.3 Solid fluxes.31
5.7.4 Paste flux .31
5.7.5 Solder paste .33
5.7.6 Other materials.33
6 Preparation for delivery .35
6.1 Preservation-packing and packaging .35
7 Additional information.35
7.1 Flux activity.35
7.2 Flux and cleaning relationship .37
7.3 Ordering data .37

61190-1-1 © IEC:2002 – 5 –
Annex A (normative) .39
Bibliography.41
Figure 1 – Wetting balance curve.23
Table 1 – Flux identification, materials of composition, activity levels.15
Table 2 – Test requirements for flux activity classification.17
Table 3 – Typical spread areas .23
Table 4 – Solder flux test method classification.29
Table 5 – Flux form for test .31
Table A.1 – Qualification test report.39

61190-1-1 © IEC:2002 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –
Part 1-1: Requirements for soldering fluxes for high-quality
interconnections in electronics assembly
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Comm
...