SIST EN 61190-1-1:2003
(Main)Attachment materials for electronic assembly -- Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Attachment materials for electronic assembly -- Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
Verbindungsmaterialien für Baugruppen der Elektronik -- Teil 1-1: Anforderungen an Weichlöt-Flussmittel für hochwertige Verbindungen in der Elektronikmontage
Matériaux de fixation pour les assemblages électroniques -- Partie 1-1: Exigences relatives aux flux de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques
Spécifie les exigences d'ordre général relatives à la classification et au contrôle des flux de brasage pour les interconnexions de haute qualité dans l'assemblage des composants électroniques. La présente norme représente une caractérisation du flux, un contrôle de la qualité et un document de commande pour les flux à braser et les flux constitués de matériaux au sein de la technologie d'assemblage des composants électroniques.
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
General Information
Standards Content (Sample)
SLOVENSKI SIST EN 61190-1-1:2003
STANDARD
april 2003
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering
fluxes for high-quality interconnections in electronics assembly
ICS 25.160.50; 31.190 Referenčna številka
SIST EN 61190-1-1:2003(en)
© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno
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EUROPEAN STANDARD EN 61190-1-1
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2002
ICS 31.190
English version
Attachment materials for electronic assembly
Part 1-1: Requirements for soldering fluxes for high-quality
interconnections in electronics assembly
(IEC 61190-1-1:2002)
Matériaux de fixation pour Verbindungsmaterialien für
les assemblages électroniques Baugruppen der Elektronik
Partie 1-1: Exigences relatives aux Teil 1-1: Anforderungen an Weichlöt-
flux de brasage pour les interconnexions Flussmittel für hochwertige Verbindungen
de haute qualité dans les assemblages in der Elektronikmontage
de composants électroniques (IEC 61190-1-1:2002)
(CEI 61190-1-1:2002)
This European Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-1:2002 E
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EN 61190-1-1:2002 - 2 -
Foreword
The text of document 91/277/FDIS, future edition 1 of IEC 61190-1-1, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 61190-1-1 on 2002-06-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-06-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annexes A and ZA are normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61190-1-1:2002 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2:2002 (not modified).
IEC 61190-1-3 NOTE Harmonized as EN 61190-1-3:2002 (not modified).
IEC 61191-1 NOTE Harmonized as EN 61191-1:1998 (not modified).
IEC 61191-2 NOTE Harmonized as EN 61191-2:1998 (not modified).
IEC 61191-3 NOTE Harmonized as EN 61191-3:1998 (not modified).
IEC 61191-4 NOTE Harmonized as EN 61191-4:1998 (not modified).
ISO 9000 NOTE Harmonized as EN ISO 9000:2000 (not modified).
ISO 9001 NOTE Harmonized as EN ISO 9001:2000 (not modified).
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- 3 - EN 61190-1-1:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60194 - Printed board design, manufacture and--
assembly - Terms and definitions
1)
2)
IEC 61189-2 - Test methods for electrical materials, EN 61189-2 1997
printed boards and other + corr. August 1997
interconnection structures and
assemblies
Part 2: Test methods for materials for
interconnection structures
1) 2)
IEC 61189-3 - Part 3: Test methods for interconnection EN 61189-3 1997
structures (printed boards)
ISO 9002 1994 Quality systems - Model for quality EN ISO 9002 1994
assurance in production, installation and
servicing
1) 2)
ISO 9455-16 - Soft soldering fluxes - Test methods EN ISO 9455-16 2001
Part 16: Flux efficacy tests, wetting
balance method
1)
Undated reference.
2)
Valid edition at date of issue.
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NORME
CEI
INTERNATIONALE IEC
61190-1-1
INTERNATIONAL
Première édition
STANDARD
First edition
2002-03
Matériaux de fixation pour les
assemblages électroniques –
Partie 1-1:
Exigences relatives aux flux de brasage
pour les interconnexions de haute qualité
dans les assemblages de composants
électroniques
Attachment materials for electronic assembly –
Part 1-1:
Requirements for soldering fluxes for high-quality
interconnections in electronics assembly
© IEC 2002 Droits de reproduction réservés ⎯ Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
CODE PRIX
S
Commission Electrotechnique Internationale PRICE CODE
International Electrotechnical Commission
ɆɟɠɞɭɧɚɪɨɞɧɚɹɗɥɟɤɬɪɨɬɟɯɧɢɱɟɫɤɚɹɄɨɦɢɫɫɢɹ
Pour prix, voir catalogue en vigueur
For price, see current catalogue
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61190-1-1 © IEC:2002 – 3 –
CONTENTS
FOREWORD.7
INTRODUCTION.9
1 Scope and object.11
2 Normative references .11
3 Terms and definitions .11
4 Requirements .13
4.1 Conflict.13
4.2 Flux classification and testing.13
4.2.1 Standard classification for products .13
4.2.2 Composition .13
4.2.3 Activity .15
4.2.4 Flux characterization test methods .17
4.2.5 Qualification .21
4.2.6 Quality conformance.21
4.2.7 Performance.21
4.2.8 Labelling.25
5 Quality assurance provisions.25
5.1 Responsibility for inspection .25
5.1.1 Responsibility for compliance .25
5.1.2 Test equipment and inspection facilities .25
5.1.3 Inspection conditions .25
5.2 Classification of inspections .27
5.3 Materials inspection .27
5.4 Qualification inspection .27
5.4.1 Sample size.27
5.4.2 Inspection routine .27
5.5 Performance inspection.29
5.6 Quality conformance.29
5.6.1 Sampling plan.29
5.6.2 Rejected lots .31
5.7 Preparation of fluxes for testing.31
5.7.1 Flux form for test .31
5.7.2 Liquid fluxes .31
5.7.3 Solid fluxes.31
5.7.4 Paste flux .31
5.7.5 Solder paste .33
5.7.6 Other materials.33
6 Preparation for delivery .35
6.1 Preservation-packing and packaging .35
7 Additional information.35
7.1 Flux activity.35
7.2 Flux and cleaning relationship .37
7.3 Ordering data .37
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61190-1-1 © IEC:2002 – 5 –
Annex A (normative) .39
Bibliography.41
Figure 1 – Wetting balance curve.23
Table 1 – Flux identification, materials of composition, activity levels.15
Table 2 – Test requirements for flux activity classification.17
Table 3 – Typical spread areas .23
Table 4 – Solder flux test method classification.29
Table 5 – Flux form for test .31
Table A.1 – Qualification test report.39
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61190-1-1 © IEC:2002 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –
Part 1-1: Requirements for soldering fluxes for high-quality
interconnections in electronics assembly
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61190-1-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/277/FDIS 91/287/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
Annex A forms an integral part of this standard.
The committee has decided that the contents of this publication will remain unchanged until
2007. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
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61190-1-1 © IEC:2002 – 9 –
INTRODUCTION
This part of IEC 61190 defines the classification of soldering materials through specifications
of test methods and inspection criteria. These materials include liquid flux, paste flux, solder-
paste flux, solder-preform flux, and flux cored solder. It is not the intent of this standard to
exclude any acceptable flux or soldering aid material; however, these materials must produce
the desired electrical and metallurgical interconnection.
Requirements for soldering fluxes are defined in general terms for standardized classification.
In practice, where more stringent requirements are necessary or other manufacturing
processes are used, these should be defined as additional requirements by the user. Formic
acid is not considered a flux for the purpose of this document. The generic specifications for
soldering fluxes are given by ISO.
This standard is intended to be applicable to all types of flux as used for soldering in general
and to soldering in electronics in particular. The fluxes involved relate to all aspects of
application, such as in wave soldering, printed wiring board (PWB) fabrication, lead tinning,
and solder reflow. Materials include solder pastes, flux-cored wire, and flux-coated preforms.
Soldering fluxes covered by this standard are intended for use in various consumer, industrial
and commercial electronics soldering applications of industry applications.
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61190-1-1 © IEC:2002 – 11 –
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –
Part 1-1: Requirements for soldering fluxes for high-quality
interconnections in electronics assembly
1 Scope and object
This part of IEC 61190 specifies general requirements for the classification and testing of
soldering fluxes for high-quality interconnections in electronics assembly. This standard is a
flux characterization, quality control, and procurement document for solder flux and flux
containing material in electronics assembly technology.
2 Normative references
The following referenced documents are indispensable for the application of the document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 61189-2, Test methods for electrical materials, interconnection structures and assemblies –
Part 2: Test methods for materials for interconnection structures
IEC 61189-3, Test methods for electrical materials, interconnection structures and assemblies –
Part 3: Test methods for interconnection structures (printed boards)
ISO 9002:1994, Quality systems – Model for quality assurance in production, installation and
servicing
ISO 9455-16, Soft soldering fluxes – Test methods – Part 16: Flux efficacy tests, wetting
balance method
3 Terms and definitions
For the purposes of this part of IEC 61190, the terms and definitions given in English only in
1)
IEC 60194 and the following apply.
3.1
form
flux additionally classified according to the form that it takes – liquid (L), solid (S), or paste (P)
3.2
inorganic flux
aqueous flux solution of inorganic acids and halides
[IEC 60194]
___________
1)
Certain definitions of IEC 60194 have been translated into French.
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61190-1-1 © IEC:2002 – 13 –
3.3
organic flux
primarily composed of organic materials other than rosin or resin
3.4
resin flux
resin and small amounts of organic activators in an organic solvent
[IEC 60194]
3.5
rosin flux
rosin in an organic solvent or rosin as a paste with activators
[IEC 60194]
(primarily composed of natural resin, extracted from the oleoresin of pine trees and refined.
Consists of one or more of the following types of rosin: gum rosin, wood rosin, tall oil rosin,
modified or natural rosin. The rosins used must have a minimum acid value of 130, as deter-
mined by 6C07 of the future IEC 61189-6.)
4 Requirements
Except when otherwise specified on the design or assembly drawings or instructions by the
user, the soldering fluxes covered by this part of IEC 61190 shall conform with the following
subclauses.
4.1 Conflict
In the event of conflict between the requirements of this specification and other requirements
of the applicable acquisition documents, the precedence in which documents shall govern,
in descending order, is as follows:
a) the applicable acquisition document;
b) the applicable specification sheet/drawing;
c) this specification;
d) normative references.
4.2 Flux classification and testing
4.2.1 Standard classification for products
Fluxes used in the process of soldering shall be classified according to the corrosive or
conductive properties of the flux or flux residue (see table 1).
4.2.2 Composition
Soldering fluxes shall also be classified according to the general chemical composition of the
non-volatile portion. Based on a minimum 51 % composition of the non-volatile portion,
the flux shall be classified as either rosin, resin, organic or inorganic (see table 1).
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61190-1-1 © IEC:2002 – 15 –
a
Table 1 – Flux identification, materials of composition, activity levels
Flux materials Flux activity levels
c d
IEC flux designator ISO flux designator
a b
of composition (weight % halide)
Low (<0,01) L0 ROL0 1.1.1
Low (<0,15) L1 ROL1 1.1.2.W, 1.1.2.X
Rosin Moderate (<0,01) M0 ROM0 1.1.3.W
(RO)
Moderate (0,15-2,0) M1 ROM1 1.1.2.Y, 1.1.2.Z
High (<0,01) H0 ROH0 1.1.3.X
High (>2,0) H1 ROH1 1.1.2.Z
Low (<0,01) L0 REL0 1.2.1
Low (<0,15) L1 REL1 1.2.2.W, 1.2.2.X
Resin Moderate (<0,01) M0 REM0 1.2.3.W
(RE) Moderate (0,15-2,0) M1 REM1 1.2.2.Y, 1.2.2.Z
High (<0,01) H0 REH0 1.2.3.X
High (>2,0) H1 REH1 1.2.2.Z
Low (<0,01) L0 ORL0 2.1, 2.2.3.E
Low (<0,15) L1 ORL1 –
Organic Moderate (<0,01) M0 ORM0 –
(OR) Moderate (0,15-2,0) M1 ORM1 2.1.2, 2.2.2
High (<0,01) H0 ORH0 2.2.3.0
High (>2,0) H1 ORH1 2.2.2
Low (<0,01) L0 INL0
Low (<0,15) L1 INL1
Not applicable
Inorganic Moderate (<0,01) M0 INM0
(inorganic ISO flux
(IN) Moderate (0,15-2,0) M1 INM1
is different)
High (<0,01) H0 INH0
High (>2,0) H1 INH1
a
Fluxes are available in S (solid), P (paste/cream) or L (liquid) forms.
b
The 0 and 1 indicate absence and presence of halides, respectively. See 4.2.3 for an explanation of
L, M and H nomenclature.
c
See 7.2 and 7.3 for comparisons of RO, RE, OR and IN composition classes and L, M and H activity
levels with the traditional classes such as R, RMA, RA, water soluble and low solids "no-clean".
d
ISO designations are similar to IEC designators with minor differences in characteristics.
4.2.3 Activity
The soldering fluxes of table 1 shall be further classified by test requirements relating to the
activity of the flux and its residue. Soldering fluxes shall be characterized according to one of
the following three types:
a) L is low or no flux/flux residue activity;
b) M is moderate flux/flux residue activity;
c) H is high flux/flux residue activity.
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61190-1-1 © IEC:2002 – 17 –
These classes shall be further characterized using 0 or 1 to indicate the absence or the
presence of halide in the flux. Both the L, M, H and 0, 1 classifications shall be determined by
the test methods in table 2.
It is the responsibility of the material suppliers to characterize their fluxes in accordance with
the classification requirements in this standard.
4.2.3.1 Flux type and activity classification
In order to be classified as a specific type, a flux must meet all the characterization require-
ments as shown in table 2.
Flux used for the soldering of electronic assemblies shall be further assessed by the impact of
flux residue on the performance of the assembly. Conductive properties of the flux residue
shall meet the surface insulation resistance (SIR) requirements contained in table 2.
Certain corrosive fluxes can meet one or more tests for the L-type flux. Failure to meet all test
requirements shall cause the given flux to be classified as either type M or H.
Table 2 – Test requirements for flux activity classification
Qualitative halide Quantitative Conditions
Flux halide Corrosion for passing
Copper mirror
a
Silver chromate
type (Cl, Br, F) test 100 MΩΩΩΩ
Spot test (F)
b
d, f
(CI, Br)
weight % SIR requirements
c c
L0 No evidence Pass Pass <0,01 No evidence Both cleaned and
e, f
of mirror of corrosion uncleaned
c c
L1 Pass Pass <0,15
Breakthrough
c c d
M0 Breakthrough Pass Pass <0,01 Minor Cleaned or
e, f
in less than corrosion uncleaned
g g
M1 Fail Fail 0,15 to 2,0
50 % of test area acceptable
c c
H0 Breakthrough Pass Pass <0,01 Major Cleaned
in more than corrosion
g g
H1 Fail Fail >2,0
50 % of test area acceptable
a
0 and 1 in the flux type column indicate the absence and the presence of halide, respectively.
b 1)
If total absence of covalently bonded halogens is required by the user, the Beilstein test should be performed [1] .
c
False failure could result from non-halide constituents (see 4.2.4.2).
d
If the M0 or M1 flux passes SIR when cleaned, but fails when not cleaned, this flux shall always be cleaned.
e
Fluxes which are not meant to be removed require testing only in the uncleaned state.
f
If an assembly using no-clean flux is to be cleaned prior to conformal coating, then the user should verify
the SIR values after cleaning.
g
Depending on the type of halide, one or both tests will be failed.
4.2.4 Flux characterization test methods
4.2.4.1 Copper mirror test
The corrosive properties of flux shall be determined in accordance with the future IEC 61189-6
test method 6C10 [4].
___________
1)
Figures in square brackets refer to the bibliography.
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61190-1-1 © IEC:2002 – 19 –
4.2.4.2 Qualitative halide tests
The following tests are used to determine the presence of halides, specifically, chlorides (Cl),
bromides (Br), and fluorides (F), in liquid fluxes or extracted flux solutions.
4.2.4.2.1 Chlorides and bromides by silver chromate method
The presence of chlorides and bromides shall be determined in accordance with the future
IEC 61189-6 test method 6C02.
4.2.4.2.2 Fluorides by spot test
The presence of fluorides shall be determined in accordance with the future IEC 61189-6 test
method 6C05.
4.2.4.3 Quantitative halide content tests
If the flux fails the test in 4.2.4.2.1 and/or 4.2.4.2.2, the following tests shall be used to
determine the concentration of chlorides, bromides, and fluorides in liquid fluxes or extracted
flux solutions. The halide content is reported as the equivalent weight percentage of chloride
to the solid (non-volatile) portion of the flux. The solids content is determined in accordance
with 4.2.4.3.3. The total halide content of the flux is obtained by adding together the halide
contents from sections 4.2.4.3.1 (Cl and Br) and 4.2.4.3.2 (F). Ion chromatography is also an
acceptable test method for quantitative halide content.
4.2.4.3.1 Chloride and bromide concentrations
The combined concentration of chlorides and bromides shall be determined in accordance
with the future IEC 61189-6 test methods 6C04 or IEC 61189-3 test method 3C13.
4.2.4.3.2 Fluoride concentration
For fluxes giving a positive result when tested per 4.2.4.2.2, the concentration of fluorides
shall be determined using the future IEC 61189-6 test method 6C06.
4.2.4.3.3 Flux solids (non-volatile) determination
The determination of the amount of residual solids content of liquid fluxes shall be made in
accordance with the future IEC 61189-6 test method 6C03, or as agreed between the supplier
and the user.
4.2.4.4 Corrosion test
The corrosive properties of flux residue shall be determined in accordance with the future
IEC 61189-5 test method 5C01.
4.2.4.5 SIR test
The surface insulation requirements for fluxes shall be determined in accordance with the
future IEC 61189-5 test method 5E01.
4.2.4.5.1 Reporting flux SIR values
When specifying the SIR test results, the supplier shall clearly indicate the type of cleaning
procedure used prior to SIR testing in annex A. SIR values shall be measured at 24 h, 96 h,
and 168 h, while the specimen is still under elevated temperature and humidity. Specimens
shall comply with the requirements specified in table 2 (100 MΩ) measured at 96 h and 168 h.
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61190-1-1 © IEC:2002 – 21 –
4.2.4.6 Fungus test
When specified in the procurement document, fungus resistance shall be evaluated in
accordance with IEC 61189-2 test method 2E18.
4.2.5 Qualification
For qualification testing the flux supplier shall perform the testing in accordance with the tests
listed in table 4 and complete a qualification test report in annex A.
4.2.6 Quality conformance
The following tests shall be performed to evaluate product consistency according to the flux
supplier's technical data sheets (see 5.6).
4.2.6.1 Acid value determination
The acid value of liquid flux shall be evaluated in accordance with the future IEC 61189-6 test
method 6C01.
4.2.6.2 Flux specific gravity determination
Fluxes with solids content of 10 % (by weight) or less s
...
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