Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

IEC 60749-39:2021 is available as IEC 60749-39:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-39:2021 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. This edition includes the following significant technical changes with respect to the previous edition: - updated procedure for "dry weight" determination.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 39: Messung des Feuchtediffusionskoeffizienten und der Wasserlöslichkeit in organischen Werkstoffen, welche bei Halbleiter-Komponenten verwendet werden

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 39: Mesure de la diffusivité d'humidité et de l'hydrosolubilité dans les matériaux organiques utilisés dans les composants à semiconducteurs

IEC 60749-39:2021 est disponible sous forme de IEC 60749-39:2021 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L’IEC 60749-39:2021 détaille les modes opératoires pour la mesure des propriétés caractéristiques de la diffusivité d’humidité et de l’hydrosolubilité dans les matériaux organiques utilisés dans l’encapsulation des composants à semiconducteurs. Ces deux propriétés des matériaux sont des paramètres importants pour la performance de fiabilité réelle des semiconducteurs sous boîtier en plastique après exposition à l’humidité et qui sont soumis à une refusion à température élevée au moment du brasage. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente: - mise à jour du mode opératoire relatif à la détermination du "poids sec".

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 39. del: Meritve prepuščanja vlage organskih materialov in njihove vodotopnosti za polprevodniške komponente (IEC 60749-39:2021)

Ta del standarda IEC 60749 podrobno opisuje postopke za meritve prepuščanja vlage organskih materialov in njihove vodotopnosti za polprevodniške komponente, ki se uporabljajo pri embalaži polprevodniških komponent. Ti dve lastnosti materialov sta pomembna parametra za učinkovito zanesljivost polprevodnikov, pakiranih v plastiko, po izpostavljenosti vlagi in visokotemperaturnemu pretaljevanju.

General Information

Status
Published
Publication Date
20-Jan-2022
Drafting Committee
Current Stage
6060 - Document made available - Publishing
Start Date
21-Jan-2022
Completion Date
21-Jan-2022

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SLOVENSKI STANDARD
SIST EN IEC 60749-39:2022
01-marec-2022
Nadomešča:
SIST EN 60749-39:2007
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 39. del:
Meritve prepuščanja vlage organskih materialov in njihove vodotopnosti za
polprevodniške komponente (IEC 60749-39:2021)
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement
of moisture diffusivity and water solubility in organic materials used for semiconductor
components (IEC 60749-39:2021)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 39: Messung
des Feuchtediffusionskoeffizienten und der Wasserlöslichkeit in organischen
Werkstoffen, welche bei Halbleiter-Komponenten verwendet werden (IEC 60749-
39:2021)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
39: Mesure de la diffusion d'humidité et de l'hydrosolubilité dans les matériaux
organiques utilisés dans les composants à semiconducteurs (IEC 60749-39:2021)
Ta slovenski standard je istoveten z: EN IEC 60749-39:2022
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 60749-39:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 60749-39:2022

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SIST EN IEC 60749-39:2022


EUROPEAN STANDARD EN IEC 60749-39

NORME EUROPÉENNE

EUROPÄISCHE NORM January 2022
ICS 31.080.01 Supersedes EN 60749-39:2006 and all of its
amendments and corrigenda (if any)
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 39: Measurement of moisture diffusivity and water solubility
in organic materials used for semiconductor components
(IEC 60749-39:2021)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 39: Mesure de la Prüfverfahren - Teil 39: Messung des
diffusivité d'humidité et de l'hydrosolubilité dans les Feuchtediffusionskoeffizienten und der Wasserlöslichkeit in
matériaux organiques utilisés dans les composants à organischen Werkstoffen, welche bei Halbleiter-
semiconducteurs Komponenten verwendet werden
(IEC 60749-39:2021) (IEC 60749-39:2021)
This European Standard was approved by CENELEC on 2022-01-03. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 60749-39:2022 E

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SIST EN IEC 60749-39:2022
EN IEC 60749-39:2022 (E)
European foreword
The text of document 47/2652/CDV, future edition 2 of IEC 60749-39, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-39:2022.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-10-03
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-01-03
document have to be withdrawn
This document supersedes EN 60749-39:2006 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of t
...

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