EN IEC 60749-20:2020
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20 : Résistance des CMS à boîtier plastique à l’effet combiné de l’humidité et de la chaleur de brasage
IEC 60749-20:2020 est disponible sous forme de IEC 60749-20:2020 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L’IEC 60749-20:2020 fournit des moyens d’évaluer la résistance à la chaleur de brasage des semiconducteurs sous emballage comme les composants à boîtier plastique pour montage en surface (CMS). Cet essai est destructif. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente: - incorporation d’un corrigendum de l’IEC 60749-20:2008 (deuxième édition), - inclusion d’un nouvel Article 3, - inclusion de notes explicatives.
Polprevodniške naprave - Metode za mehansko in klimatsko preskušanje - 20. del: Odpornost elementov SMD v plastičnih ohišjih proti kombiniranemu učinkovanju vlage in spajkalne vročine
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Standards Content (Sample)
SLOVENSKI STANDARD
01-december-2020
Nadomešča:
SIST EN 60749-20:2010
Polprevodniške naprave - Metode za mehansko in klimatsko preskušanje - 20. del:
Odpornost elementov SMD v plastičnih ohišjih proti kombiniranemu učinkovanju
vlage in spajkalne vročine
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of
plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20:
Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD)
gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
20: Résistance des CMS à boîtiers plastique à l'effet combiné de l'humidité et de la
chaleur de brasage
Ta slovenski standard je istoveten z: EN IEC 60749-20:2020
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 60749-20
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2020
ICS 31.080.01 Supersedes EN 60749-20:2009 and all of its
amendments and corrigenda (if any)
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 20: Resistance of plastic encapsulated SMDs to the
combined effect of moisture and soldering heat
(IEC 60749-20:2020)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 20 : Résistance des Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter
CMS à boîtier plastique à l'effet combiné de l'humidité et de oberflächenmontierbarer Bauelemente (SMD) gegenüber
la chaleur de brasage der kombinierten Beanspruchung von Feuchte und
(IEC 60749-20:2020) Lötwärme
(IEC 60749-20:2020)
This European Standard was approved by CENELEC on 2020-10-05. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60749-20:2020 E
European foreword
The text of document 47/2634(F)/FDIS, future edition 3 of IEC 60749-20, prepared by IEC/TC 47
“Semiconductor devices” was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-20:2020.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-07-05
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2023-10-05
document have to be withdrawn
This document supersedes EN 60749-20:2009 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60749-20:2020 was approved by CENELEC as a European
Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-20 2008 Environmental testing - Part 2–20: Tests EN 60068-2-20 2008
- Test T: Test methods for solderability
and resistance to soldering heat of
devices with leads
IEC 60749-3 - Semiconductor devices - Mechanical EN 60749-3 -
and climatic test methods - Part 3:
External visual examination
IEC 60749-30 - Semiconductor devices - Mechanical EN IEC 60749-30 -
and climatic test methods - Part 30:
Preconditioning of non-hermetic surface
mount devices prior to reliability testing
IEC 60749-35 - Semiconductor devices - Mechanical EN 60749-35 -
and climatic test methods - Part 35:
Acoustic microscopy for plastic
encapsulated electronic components
IEC 60749-20 ®
Edition 3.0 2020-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 20: Resistance of plastic encapsulated SMDs to the combined effect of
moisture and soldering heat
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques
et climatiques –
Partie 20: Résistance des CMS à boîtier plastique à l’effet combiné
de l’humidité et de la chaleur de brasage
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-8727-9
– 2 – IEC 60749-20:2020 © IEC 2020
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General description . 7
5 Test apparatus and materials . 7
5.1 Humidity chamber . 7
5.2 Reflow soldering apparatus . 8
5.3 Holder . 8
5.4 Wave-soldering apparatus . 8
5.5 Solvent for vapour-phase reflow soldering. 8
5.6 Flux . 8
5.7 Solder . 8
6 Procedure . 9
6.1 Initial measurements . 9
6.1.1 Visual inspection . 9
6.1.2 Electrical measurement . 9
6.1.3 Internal inspection by acoustic tomography . 9
6.2 Drying . 9
6.3 Moisture soak . 9
6.3.1 General . 9
6.3.2 Conditions for non-dry-packed SMDs . 9
6.3.3 Moisture soak for dry-packed SMDs . 10
6.4 Soldering heat . 11
6.4.1 General . 11
6.4.2 Method of heating by infrared convection or convection reflow soldering . 12
6.4.3 Method of heating by vapour-phase reflow soldering . 13
6.4.4 Method of heating by wave-soldering . 13
6.5 Recovery . 14
6.6 Final measurements . 15
6.6.1 Visual inspection . 15
6.6.2 Electrical measurement . 15
6.6.3 Internal inspection by acoustic tomography . 15
7 Information to be given in the relevant specification . 15
Annex A (informative) Details and description of test method on resistance of plastic
encapsulated SMDs to the combined effect of moisture and soldering heat . 17
A.1 Description of moisture soak . 17
A.1.1 Guidance for moisture soak . 17
A.1.2 Considerations on which the condition of moisture soak is based . 17
A.2 Procedure for moisture content measurement . 22
A.3 Soldering heat methods . 23
A.3.1 Temperature profile of infrared convection and convection reflow
soldering . 23
A.3.2 Temperature profile of vapour-phase soldering . 25
A.3.3 Heating method by wave-soldering . 26
IEC 60749-20:2020 © IEC 2020 – 3 –
Figure 1 – Method of measuring the temperature profile of a specimen . 8
Figure 2 – Heating by wave-soldering . 14
Figure A.1 – Process of moisture diffusion at 85 °C, 85 % RH. 18
Figure A.2 – Definition of resin thickness and the first interface . 18
Figure A.3 – Moisture soak time to saturation at 85 °C as a function of resin thickness . 18
Figure A.4 – Temperature dependence of saturated moisture content of resin . 19
Figure A.5 – Dependence of moisture content of resin at the first interface on resin
thickness under various soak conditions . 20
Figure A.6 – Dependence of moisture content of resin at the first interface on resin
thickness related to method A of moisture soak . 20
Figure A.7 – Dependence of the moisture content of resin at the first interface on resin
thickness related to method B of moisture soak . 21
Figure A.8 – Dependence of moisture content of resin at the first interface on resin
thickness related to condition B2 of method B of moisture soak . 22
Figure A.9 – Temperature profile of infrared convection and convection reflow
soldering for Sn-Pb eutectic assembly . 23
Figure A.10 – Temperature profile of infrared convection and convection reflow
soldering for lead-free assembly .
...
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