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EN 60749-3:2017

(Main)

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

IEC 60749-3:2017(E) is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance. This edition includes the following significant technical changes with respect to the previous edition: a) reference to the need for ESD protection; b) inclusion of information on the phenomenon of tin whiskers; c) inclusion of an optional report form/checklist.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 3: Äußere Sichtprüfung

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 3: Examen visuel externe

L’IEC 60749-3:2017 a pour but de vérifier que les matériaux, la conception, la construction, les marquages et l’exécution du dispositif à semiconducteurs sont conformes au document d’approvisionnement applicable. L’examen visuel externe est un essai non destructif et il s’applique à tous les types de boîtiers. Cet essai est utile pour la qualification, la surveillance des procédés ou pour la réception des lots. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente: a) référence à la nécessité d’une protection contre les décharges électrostatiques; b) inclusion d’informations sur le phénomène de trichite d’étain; c) inclusion d’un formulaire/d’une liste de contrôle facultatif, à des fins de rapport.

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 3. del: Zunanji vizualni pregled (IEC 60749-3:2017)

Namen tega dela standarda IEC 60749 je preveriti, ali so materiali, zasnova, izdelava, označbe in izvedba polprevodniških elementov v skladu z ustreznim nabavnim dokumentom. Zunanji vizualni pregled je neporušitveni preskus, uporaben za vse vrste embalaže. Preskus je uporaben za kvalifikacijo, nadzor procesov in sprejemljivost serij.

General Information

Status
Published
Publication Date
15-Jun-2017
Withdrawal Date
06-Apr-2020
ICS
31.080.01 - Semiconductor devices in general
Technical Committee
CLC/SR 47 - Semiconductor devices
Drafting Committee
IEC/TC 47 - IEC_TC_47
Current Stage
6060 - Document made available - Publishing
Start Date
16-Jun-2017
Completion Date
16-Jun-2017
Ref Project
SIST EN 60749-3:2017 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017)

Relations

Replaces
EN 60749-3:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
Effective Date
23-Jan-2023

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SLOVENSKI STANDARD
SIST EN 60749-3:2017
01-september-2017
1DGRPHãþD
SIST EN 60749-3:2004
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 3. del:
Zunanji vizualni pregled (IEC 60749-3:2017)
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual
examination (IEC 60749-3:2017)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 3: Äußere
Sichtprüfung (IEC 60749-3:2017)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 3:
Examen visuel externe (IEC 60749-3:2017)
Ta slovenski standard je istoveten z: EN 60749-3:2017
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-3:2017 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-3:2017

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SIST EN 60749-3:2017


EUROPEAN STANDARD EN 60749-3

NORME EUROPÉENNE

EUROPÄISCHE NORM
June 2017
ICS 31.080.01 Supersedes EN 60749-3:2002
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 3: External visual examination
(IEC 60749-3:2017)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 3: Examen visuel Prüfverfahren - Teil 3: Äußere Sichtprüfung
externe (IEC 60749-3:2017)
(IEC 60749-3:2017)
This European Standard was approved by CENELEC on 2017-04-07. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 60749-3:2017 E

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SIST EN 60749-3:2017
EN 60749-3:2017
European foreword
The text of document 47/2345/FDIS, future edition 2 of IEC 60749-3, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 60749-3:2017.
The following dates are fixed:
• latest date by which the document has to be implemented at (dop) 2018-01-07
national level by publication of an identical national
standard or by endorsement
• latest date by which the national standards conflicting with (dow) 2020-04-07
the document have to be withdrawn

This document supersedes EN 60749-3:2002.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60749-3:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated :
IEC 60749-9 NOTE Harmonized as EN 60749-9.
2

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SIST EN 60749-3:2017
EN 60749-3:2017
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions o
...

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