Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

IEC 60749-3:2017(E) is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance. This edition includes the following significant technical changes with respect to the previous edition: a) reference to the need for ESD protection; b) inclusion of information on the phenomenon of tin whiskers; c) inclusion of an optional report form/checklist.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 3: Äußere Sichtprüfung

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 3: Examen visuel externe

L’IEC 60749-3:2017 a pour but de vérifier que les matériaux, la conception, la construction, les marquages et l’exécution du dispositif à semiconducteurs sont conformes au document d’approvisionnement applicable. L’examen visuel externe est un essai non destructif et il s’applique à tous les types de boîtiers. Cet essai est utile pour la qualification, la surveillance des procédés ou pour la réception des lots. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente: a) référence à la nécessité d’une protection contre les décharges électrostatiques; b) inclusion d’informations sur le phénomène de trichite d’étain; c) inclusion d’un formulaire/d’une liste de contrôle facultatif, à des fins de rapport.

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 3. del: Zunanji vizualni pregled (IEC 60749-3:2017)

Namen tega dela standarda IEC 60749 je preveriti, ali so materiali, zasnova, izdelava, označbe in izvedba polprevodniških elementov v skladu z ustreznim nabavnim dokumentom. Zunanji vizualni pregled je neporušitveni preskus, uporaben za vse vrste embalaže. Preskus je uporaben za kvalifikacijo, nadzor procesov in sprejemljivost serij.

General Information

Status
Published
Publication Date
15-Jun-2017
Drafting Committee
Current Stage
6060 - Document made available
Due Date
16-Jun-2017
Completion Date
16-Jun-2017

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SLOVENSKI STANDARD
SIST EN 60749-3:2017
01-september-2017
1DGRPHãþD
SIST EN 60749-3:2004
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 3. del:
Zunanji vizualni pregled (IEC 60749-3:2017)

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual

examination (IEC 60749-3:2017)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 3: Äußere

Sichtprüfung (IEC 60749-3:2017)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 3:

Examen visuel externe (IEC 60749-3:2017)
Ta slovenski standard je istoveten z: EN 60749-3:2017
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-3:2017 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-3:2017
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SIST EN 60749-3:2017
EUROPEAN STANDARD EN 60749-3
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2017
ICS 31.080.01 Supersedes EN 60749-3:2002
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 3: External visual examination
(IEC 60749-3:2017)

Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische

mécaniques et climatiques - Partie 3: Examen visuel Prüfverfahren - Teil 3: Äußere Sichtprüfung

externe (IEC 60749-3:2017)
(IEC 60749-3:2017)

This European Standard was approved by CENELEC on 2017-04-07. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,

Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels

© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN 60749-3:2017 E
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SIST EN 60749-3:2017
EN 60749-3:2017
European foreword

The text of document 47/2345/FDIS, future edition 2 of IEC 60749-3, prepared by IEC/TC 47

"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN 60749-3:2017.
The following dates are fixed:
• latest date by which the document has to be implemented at (dop) 2018-01-07
national level by publication of an identical national
standard or by endorsement
• latest date by which the national standards conflicting with (dow) 2020-04-07
the document have to be withdrawn
This document supersedes EN 60749-3:2002.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 60749-3:2017 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following note has to be added for the standard indicated :

IEC 60749-9 NOTE Harmonized as EN 60749-9.
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SIST EN 60749-3:2017
EN 60749-3:2017
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are

indispensable for its application. For dated references, only the edition cited applies. For undated

references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod),

the relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is

available here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61340-5-1 - Electrostatics - Part 5-1: Protection of EN 61340-5-1 -
electronic devices from electrostatic
phenomena - General requirements
IEC 62483 - Environmental acceptance requirements - -
for tin whisker susceptibility of tin and tin
alloy surface finishes on semiconductor
devices
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SIST EN 60749-3:2017
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SIST EN 60749-3:2017
IEC 60749-3
Edition 2.0 2017-03
INTERNATIONAL
STANDARD
Semiconductor devices – Mechanical and climatic test methods –
Part 3: External visual examination
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-4001-4

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
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SIST EN 60749-3:2017
– 2 – IEC 60749-3:2017 © IEC 2017
CONTENTS

FOREWORD ........................................................................................................................... 3

1 Scope .............................................................................................................................. 5

2 Normative references ...................................................................................................... 5

3 Terms and definitions ...................................................................................................... 5

4 Test apparatus ................................................................................................................ 5

5 Procedure ........................................................................................................................ 5

6 Failure criteria ................................................................................................................. 6

7 Summary ......................................................................................................................... 6

Annex A (informative) External visual report form/checklist (example only – not a

mandatory template) ............................................................................................................... 7

A.1 Leads...................................................................................................................... 7

A.2 Lead finish .............................................................................................................. 8

A.3 Moulding and mould compound ............................................................................... 8

A.4 Critical sealant ........................................................................................................ 9

A.5 Attachments ............................................................................................................ 9

A.6 Marking ................................................................................................................... 9

A.7 Solder Balls .......................................................................................................... 10

A.8 Substrate .............................................................................................................. 10

A.9 Exposed (Backside) Silicon ................................................................................... 10

Bibliography .......................................................................................................................... 11

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SIST EN 60749-3:2017
IEC 60749-3:2017 © IEC 2017 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 3: External visual examination
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

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Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

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governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

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agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

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transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

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services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this pub
...

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