EN 60749-3:2002

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 3: Äußere Sichtprüfung

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 3: Examen visuel externe

Vise à vérifier que les matériaux, la conception, la construction, les marquages et l'exécution du dispositif à semiconducteurs sont conformes au document d'approvisionnement applicable. L'examen visuel externe est un essai non destructif et il est applicable à tous les types de boîtiers.

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2002)

General Information

• Status: Withdrawn
• Publication Date: 12-Aug-2002
• Withdrawal Date: 30-Jun-2005
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 07-Apr-2020
• Completion Date: 07-Apr-2020
• Ref Project: SIST EN 60749-3:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 3: External visual examination

Relations

• Replaces: EN 60749:1999/A1:2000 - Semiconductor devices - Mechanical and climatic test methods
• Effective Date: 29-Jan-2023
• Replaced By: EN 60749-3:2017 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
• Effective Date: 23-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 60749-3:2004

STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 3: External
visual examination (IEC 60749-3:2002)
ICS 31.080.01 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 60749-3
NORME EUROPÉENNE
EUROPÄISCHE NORM August 2002
ICS 31.080.01 Partly supersedes EN 60749:1999 + A1:2000 + A2:2001
English version
Semiconductor devices -
Mechanical and climatic test methods
Part 3: External visual examination
(IEC 60749-3:2002)
Dispositifs à semiconducteurs - Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques Prüfverfahren
Partie 3: Examen visuel externe Teil 3: Äußere Sichtprüfung
(CEI 60749-3:2002) (IEC 60749-3:2002)
This European Standard was approved by CENELEC on 2002-07-02. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-3:2002 E
Foreword
The text of document 47/1596/FDIS, future edition 1 of IEC 60749-3, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-3 on 2002-07-02.
This mechanical and climatic test method, as it relates to external visual examination, is a complete
rewrite of the test contained in clause 5, chapter 1 of EN 60749:1999.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-04-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-07-01
__________
Endorsement notice
The text of the International Standard IEC 60749-3:2002 was approved by CENELEC as a European
Standard without any modification.
__________
NORME CEI
INTERNATIONALE IEC
60749-3
INTERNATIONAL
Première édition
STANDARD
First edition
2002-04
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques et climatiques –
Partie 3:
Examen visuel externe
Semiconductor devices –
Mechanical and climatic test methods –
Part 3:
External visual examination
 IEC 2002 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
CODE PRIX
D
PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
Международная Электротехническая Комиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue

60749-3  IEC:2002 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 3: External visual examination
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations
...