EN 60749-3:2017

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

IEC 60749-3:2017(E) is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance. This edition includes the following significant technical changes with respect to the previous edition: a) reference to the need for ESD protection; b) inclusion of information on the phenomenon of tin whiskers; c) inclusion of an optional report form/checklist.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 3: Äußere Sichtprüfung

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 3: Examen visuel externe

L’IEC 60749-3:2017 a pour but de vérifier que les matériaux, la conception, la construction, les marquages et l’exécution du dispositif à semiconducteurs sont conformes au document d’approvisionnement applicable. L’examen visuel externe est un essai non destructif et il s’applique à tous les types de boîtiers. Cet essai est utile pour la qualification, la surveillance des procédés ou pour la réception des lots. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente: a) référence à la nécessité d’une protection contre les décharges électrostatiques; b) inclusion d’informations sur le phénomène de trichite d’étain; c) inclusion d’un formulaire/d’une liste de contrôle facultatif, à des fins de rapport.

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 3. del: Zunanji vizualni pregled (IEC 60749-3:2017)

Namen tega dela standarda IEC 60749 je preveriti, ali so materiali, zasnova, izdelava, označbe in izvedba polprevodniških elementov v skladu z ustreznim nabavnim dokumentom. Zunanji vizualni pregled je neporušitveni preskus, uporaben za vse vrste embalaže. Preskus je uporaben za kvalifikacijo, nadzor procesov in sprejemljivost serij.

General Information

• Status: Published
• Publication Date: 15-Jun-2017
• Withdrawal Date: 06-Apr-2020
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 16-Jun-2017
• Completion Date: 16-Jun-2017
• Ref Project: SIST EN 60749-3:2017 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017)

Relations

• Replaces: EN 60749-3:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
• Effective Date: 23-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2017
1DGRPHãþD
SIST EN 60749-3:2004
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 3. del:
Zunanji vizualni pregled (IEC 60749-3:2017)
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual
examination (IEC 60749-3:2017)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 3: Äußere
Sichtprüfung (IEC 60749-3:2017)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 3:
Examen visuel externe (IEC 60749-3:2017)
Ta slovenski standard je istoveten z: EN 60749-3:2017
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 60749-3
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2017
ICS 31.080.01 Supersedes EN 60749-3:2002
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 3: External visual examination
(IEC 60749-3:2017)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 3: Examen visuel Prüfverfahren - Teil 3: Äußere Sichtprüfung
externe (IEC 60749-3:2017)
(IEC 60749-3:2017)
This European Standard was approved by CENELEC on 2017-04-07. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 60749-3:2017 E
European foreword
The text of document 47/2345/FDIS, future edition 2 of IEC 60749-3, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 60749-3:2017.
The following dates are fixed:
• latest date by which the document has to be implemented at (dop) 2018-01-07
national level by publication of an identical national
standard or by endorsement
• latest date by which the national standards conflicting with (dow) 2020-04-07
the document have to be withdrawn

This document supersedes EN 60749-3:2002.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60749-3:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated :
IEC 60749-9 NOTE Harmonized as EN 60749-9.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is
available here: www.cenelec.eu.

Publication Year Title EN/HD Year
IEC 61340-5-1 -  Electrostatics - Part 5-1: Protection of EN 61340-5-1 -
electronic devices from electrostatic
phenomena - General requirements
IEC 62483 -  Environmental acceptance requirements - -
for tin whisker susceptibility of tin and tin
alloy surface finishes on semiconductor
devices
IEC 60749-3 ®
Edition 2.0 2017-03
INTERNATIONAL
STANDARD
Semiconductor devices – Mechanical and climatic test methods –

Part 3: External visual examination

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-4001-4

– 2 – IEC 60749-3:2017 © IEC 2017
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 5
5 Procedure . 5
6 Failure criteria . 6
7 Summary . 6
Annex A (informative) External visual report form/checklist (example only – not a
mandatory template) . 7
A.1 Leads. 7
A.2 Lead finish . 8
A.3 Moulding and mould compound . 8
A.4 Critical sealant . 9
A.5 Attachments . 9
A.6 Marking . 9
A.7 Solder Balls . 10
A.8 Substrate . 10
A.9 Exposed (Backside) Silicon . 10
Bibliography . 11

IEC 60749-3:2017 © IEC 2017 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 3: External visual examination

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-3 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2002. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.

– 4 – IEC 60749-3:2017 © IEC 2017
The text of this standard is based on the following documents:
FDIS Report on voting
47/2345/FDIS 47/2370/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IEC 60749-3:2017 © IEC 2017 – 5 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 3: External visual examination

1 Scope
The purpose of this part of IEC 60749 is to verify that the materials, design, construction,
markings, and workmanship of a semiconductor device are in accordance with the applicable
procurement document. External visual inspection is a non-destructive test and applicable for
all package types. The test is useful for qualification, process monitor, or lot acceptance.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC 62483, Environmental acceptance re
...