SIST EN 60749-3:2017

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017)

The purpose of this part of IEC 60749 is to verify that the materials, design, construction,
markings, and workmanship of a semiconductor device are in accordance with the applicable
procurement document. External visual inspection is a non-destructive test and applicable for
all package types. The test is useful for qualification, process monitor, or lot acceptance.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 3: Äußere Sichtprüfung (IEC 60749-3:2017)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 3: Examen visuel externe (IEC 60749-3:2017)

L’IEC 60749-3:2017 a pour but de vérifier que les matériaux, la conception, la construction, les marquages et l’exécution du dispositif à semiconducteurs sont conformes au document d’approvisionnement applicable. L’examen visuel externe est un essai non destructif et il s’applique à tous les types de boîtiers. Cet essai est utile pour la qualification, la surveillance des procédés ou pour la réception des lots.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) référence à la nécessité d’une protection contre les décharges électrostatiques;
b) inclusion d’informations sur le phénomène de trichite d’étain;
c) inclusion d’un formulaire/d’une liste de contrôle facultatif, à des fins de rapport.

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 3. del: Zunanji vizualni pregled (IEC 60749-3:2017)

Namen tega dela standarda IEC 60749 je preveriti, ali so materiali, zasnova, izdelava, označbe in izvedba polprevodniških elementov v skladu z ustreznim nabavnim dokumentom. Zunanji vizualni pregled je neporušitveni preskus, uporaben za vse vrste embalaže. Preskus je uporaben za kvalifikacijo, nadzor procesov in sprejemljivost serij.

General Information

• Status: Published
• Publication Date: 08-Aug-2017
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 21-Jun-2017
• Due Date: 26-Aug-2017
• Completion Date: 09-Aug-2017
• Ref Project: EN 60749-3:2017 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

Relations

• Replaces: SIST EN 60749-3:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 3: External visual examination
• Effective Date: 20-Jun-2017

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60749-3:2017
01-september-2017
1DGRPHãþD
SIST EN 60749-3:2004
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 3. del:
Zunanji vizualni pregled (IEC 60749-3:2017)
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual
examination (IEC 60749-3:2017)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 3: Äußere
Sichtprüfung (IEC 60749-3:2017)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 3:
Examen visuel externe (IEC 60749-3:2017)
Ta slovenski standard je istoveten z: EN 60749-3:2017
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-3:2017 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-3:2017

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SIST EN 60749-3:2017


EUROPEAN STANDARD EN 60749-3

NORME EUROPÉENNE

EUROPÄISCHE NORM
June 2017
ICS 31.080.01 Supersedes EN 60749-3:2002
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 3: External visual examination
(IEC 60749-3:2017)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 3: Examen visuel Prüfverfahren - Teil 3: Äußere Sichtprüfung
externe (IEC 60749-3:2017)
(IEC 60749-3:2017)
This European Standard was approved by CENELEC on 2017-04-07. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 60749-3:2017 E

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SIST EN 60749-3:2017
EN 60749-3:2017
European foreword
The text of document 47/2345/FDIS, future edition 2 of IEC 60749-3, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 60749-3:2017.
The following dates are fixed:
• latest date by which the document has to be implemented at (dop) 2018-01-07
national level by publication of an identical national
standard or by endorsement
• latest date by which the national standards conflicting with (dow) 2020-04-07
the document have to be withdrawn

This document supersedes EN 60749-3:2002.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60749-3:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated :
IEC 60749-9 NOTE Harmonized as EN 60749-9.
2

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SIST EN 60749-3:2017
EN 60749-3:2017
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is
available here: www.cenelec.eu.

Publication Year Title EN/HD Year
IEC 61340-5-1 -  Electrostatics - Part 5-1: Protection of EN 61340-5-1 -
electronic devices from electrostatic
phenomena - General requirements
IEC 62483 -  Environmental acceptance requirements - -
for tin whisker susceptibility of tin and tin
alloy surface finishes on semiconductor
devices

3

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SIST EN 60749-3:2017

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SIST EN 60749-3:2017



IEC 60749-3

®


Edition 2.0 2017-03




INTERNATIONAL



STANDARD



















Semiconductor devices – Mechanical and climatic test methods –

Part 3: External visual examination



























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 31.080.01 ISBN 978-2-8322-4001-4



  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

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SIST EN 60749-3:2017
– 2 – IEC 60749-3:2017 © IEC 2017
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 5
5 Procedure . 5
6 Failure criteria . 6
7 Summary . 6
Annex A (informative) External visual report form/checklist (example only – not a
mandatory template) . 7
A.1 Leads. 7
A.2 Lead finish . 8
A.3 Moulding and mould compound . 8
A.4 Critical sealant . 9
A.5 Attachments . 9
A.6 Marking . 9
A.7 Solder Balls . 10
A.8 Substrate . 10
A.9 Exposed (Backside) Silicon . 10
Bibliography . 11

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SIST EN 60749-3:2017
IEC 60749-3:2017 © IEC 2017 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 3: External visual examination

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this pub
...