Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

IEC 60749-4:2017(E) provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments. This edition includes the following significant technical changes with respect to the previous edition: a) clarification of requirements for temperature, relative humidity and duration detailed in Table 1; b) recommendations that current limiting resistor(s) be placed in the test set-up to prevent test board or DUT damage; c) allowance of additional time-to-test delay or return-to-stress delay.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 4: Feuchte Wärme, konstant, Prüfung mit hochbeschleunigter Wirkung (HAST)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 4: Essai continu fortement acceléré de contrainte de chaleur humide (HAST)

L’IEC 60749-4:2017 décrit un essai de contrainte de température et d’humidité fortement accéléré (HAST, highly accelerated temperature and humidity stress test) qui est réalisé dans le but d’évaluer la fiabilité des dispositifs à semiconducteurs sous boîtier non hermétique dans les environnements humides. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente: a) clarification des exigences relatives à la température, à l’humidité relative et à la durée d’exposition, détaillées dans le Tableau 1; b) ajout de recommandations suggérant de placer une ou des résistances dans le montage d’essai, afin d’éviter d’endommager la carte d’essai ou le dispositif soumis à essai (DUT, Device Under Test); c) spécification d’une autorisation d’extension du temps d’établissement des conditions d’essai ou du temps de retour à la contrainte.

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 4. del: Preskušanje z vlažno vročino, v ustaljenem stanju in z močno pospešenim obremenjevanjem (HAST) (IEC 60749-4:2017)

Ta del standarda IEC 60749 določa preskus z močno pospešenim temperaturnim in vlažnostnim obremenjevanjem (HAST) za namene vrednotenja zanesljivosti nehermetično pakiranih polprevodniških elementov v vlažnih okoljih.

General Information

Status
Published
Publication Date
15-Jun-2017
Drafting Committee
Current Stage
6060 - Document made available
Due Date
16-Jun-2017
Completion Date
16-Jun-2017

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SLOVENSKI STANDARD
SIST EN 60749-4:2017
01-september-2017
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Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat,

steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 4: Feuchte

Wärme, konstant, Prüfung mit hochbeschleunigter Wirkung (HAST) (IEC 60749-4:2017)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 4:

Essai continu fortement acceléré de contrainte de chaleur humide (HAST) (IEC 60749-

4:2017)
Ta slovenski standard je istoveten z: EN 60749-4:2017
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-4:2017 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-4:2017
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SIST EN 60749-4:2017
EUROPEAN STANDARD EN 60749-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2017
ICS 31.080.01 Supersedes EN 60749-4:2002
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 4: Damp heat, steady state, highly accelerated stress test
(HAST)
(IEC 60749-4:2017)

Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische

mécaniques et climatiques - Partie 4: Essai continu Prüfverfahren - Teil 4: Feuchte Wärme, konstant, Prüfung

fortement acceléré de contrainte de chaleur humide (HAST) mit hochbeschleunigter Wirkung (HAST)

(IEC 60749-4:2017) (IEC 60749-4:2017)

This European Standard was approved by CENELEC on 2017-04-07. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,

Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels

© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN 60749-4:2017 E
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SIST EN 60749-4:2017
EN 60749-4:2017
European foreword

The text of document 47/2346/FDIS, future edition 2 of IEC 60749-4, prepared by IEC/TC 47

"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN 60749-4:2017.
The following dates are fixed:
• latest date by which the document has to be implemented at (dop) 2018-01-07
national level by publication of an identical national
standard or by endorsement
• latest date by which the national standards conflicting with (dow) 2020-04-07
the document have to be withdrawn
This document supersedes EN 60749-4:2002.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 60749-4:2017 was approved by CENELEC as a European

Standard without any modification.
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SIST EN 60749-4:2017
EN 60749-4:2017
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are

indispensable for its application. For dated references, only the edition cited applies. For undated

references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod),

the relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is

available here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60749-5 - Semiconductor devices - Mechanical EN 60749-5 -
and climatic test methods - Part 5:
Steady-state temperature humidity bias
life test
1) To be published.
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SIST EN 60749-4:2017
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SIST EN 60749-4:2017
IEC 60749-4
Edition 2.0 2017-03
INTERNATIONAL
STANDARD
Semiconductor devices – Mechanical and climatic test methods –
Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-4002-1

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 7 ----------------------
SIST EN 60749-4:2017
– 2 – IEC 60749-4:2017 © IEC 2017
CONTENTS

FOREWORD ........................................................................................................................... 3

1 Scope .............................................................................................................................. 5

2 Normative references ...................................................................................................... 5

3 Terms and definitions ...................................................................................................... 5

4 HAST test – General remarks .......................................................................................... 5

5 Test apparatus ................................................................................................................ 6

5.1 Test apparatus requirements .................................................................................. 6

5.2 Controlled conditions .............................................................................................. 6

5.3 Temperature profile ................................................................................................ 6

5.4 Devices under stress .............................................................................................. 6

5.5 Minimize release of contamination .......................................................................... 6

5.6 Ionic contamination ................................................................................................. 6

5.7 De-ionized water ..................................................................................................... 6

6 Test conditions ................................................................................................................ 6

6.1 Test conditions requirements .................................................................................. 6

6.2 Biasing guidelines ................................................................................................... 7

6.3 Choosing and reporting ........................................................................................... 8

7 Procedure ........................................................................................................................ 8

7.1 Test device mounting .............................................................................................. 8

7.2 Ramp-up ................................................................................................................. 8

7.3 Ramp-down ............................................................................................................ 8

7.4 Test clock ............................................................................................................... 8

7.5 Bias ........................................................................................................................ 8

7.6 Readout .................................................................................................................. 9

7.7 Handling ................................................................................................................. 9

7.8 Calibration records .................................................................................................. 9

8 Failure criteria ................................................................................................................. 9

9 Safety .............................................................................................................................. 9

10 Summary ......................................................................................................................... 9

Table 1 – Temperature, relative humidity and duration requirements ...................................... 7

Table 2 – Bias and reporting requirements .............................................................................. 8

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SIST EN 60749-4:2017
IEC 60749-4:2017 © IEC 2017 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 4: Damp heat, steady state,
highly accelerated stress test (HAST)
FOREWORD

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International Standard IEC 60749-4 has been prepared by IEC technical committee 47:

Semiconductor devices.

This second edition cancels and replaces the first edition published in 2002. This edition

constitutes a technical revision.
This edition includes the following signif
...

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