Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

IEC 60749-30:2020 is available as IEC 60749-30:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3; - expansion of 6.7 on solder reflow; - inclusion of explanatory notes and clarifications.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 30: Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor Zuverlässigkeitsprüfungen

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 30: Préconditionnement des composants pour montage en surface non hermétiques avant les essais de fiabilité

IEC 60749-30:2020 est disponible sous forme de IEC 60749-30:2020 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L’IEC 60749-30:2020 établit une procédure normalisée de détermination du préconditionnement pour les composants pour montage en surface (CMS) non hermétiques avant les essais de fiabilité. Cette méthode d’essai définit une refusion de préconditionnement pour les CMS à l’état solide non hermétiques représentative d’une opération de refusion de soudure multiple industrielle type. Les CMS sont soumis à la séquence de préconditionnement appropriée décrite dans le présent document avant d’être soumis aux essais de fiabilité sur place spécifiques (qualification et/ou surveillance de la fiabilité) pour évaluer la fiabilité à long terme (qui pourrait être affectée par la refusion de soudure). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - ajout du nouvel Article 3; - extension de 6.7 concernant la refusion de soudure; - inclusion de notes explicatives et de clarifications.

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 30. del: Predkondicioniranje nehermetičnih elementov za površinsko namestitev pred preskušanjem zanesljivosti (IEC 60749-30:2020)

General Information

Status
Published
Publication Date
24-Sep-2020
Drafting Committee
Current Stage
6060 - Document made available - Publishing
Start Date
25-Sep-2020
Completion Date
25-Sep-2020

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SLOVENSKI STANDARD
SIST EN IEC 60749-30:2020
01-december-2020
Nadomešča:
SIST EN 60749-30:2005
SIST EN 60749-30:2005/A1:2011
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 30. del:
Predkondicioniranje nehermetičnih elementov za površinsko namestitev pred
preskušanjem zanesljivosti (IEC 60749-30:2020)
Semiconductor devices - Mechanical and climatic test methods - Part 30:
Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC
60749-30:2020)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 30:
Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor
Zuverlässigkeitsprüfungen (IEC 60749-30:2020)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
30: Préconditionnement des composants pour montage en surface non hermétiques
avant les essais de fiabilité (IEC 60749-30:2020)
Ta slovenski standard je istoveten z: EN IEC 60749-30:2020
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 60749-30:2020 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 60749-30:2020

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SIST EN IEC 60749-30:2020


EUROPEAN STANDARD EN IEC 60749-30

NORME EUROPÉENNE

EUROPÄISCHE NORM
September 2020
ICS 31.080.01 Supersedes EN 60749-30:2005 and all of its
amendments and corrigenda (if any)
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 30: Preconditioning of non-hermetic surface mount devices
prior to reliability testing
(IEC 60749-30:2020)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 30: Préconditionnement Prüfverfahren - Teil 30: Behandlung nicht hermetisch
des composants pour montage en surface non hermétiques verkappter oberflächenmontierbarer Bauelemente vor
avant les essais de fiabilité Zuverlässigkeitsprüfungen
(IEC 60749-30:2020) (IEC 60749-30:2020)
This European Standard was approved by CENELEC on 2020-09-21. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 60749-30:2020 E

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SIST EN IEC 60749-30:2020
EN IEC 60749-30:2020 (E)
European foreword
The text of document 47/2633(F)/FDIS, future edition 2 of IEC 60749-30, prepared by IEC/TC 47
“Semiconductor devices” was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-30:2020.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-06-21
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2023-09-21
document have to be withdrawn
This document supersedes EN 60749-30:2005 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60749-30:2020 was approved by CENELEC as a European
Standard without any modification.

2

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SIST EN IEC 60749-30:2020
EN IEC 60749-30:2020 (E)
Annex ZA
(normative)

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